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Solar cell and preparation method thereof

A technology for solar cells and battery materials, applied in the field of solar cells, can solve the problems of insufficient power-to-weight ratio, easy-split yield, etc., and achieve the effects of reducing the preparation cost, reducing the risk of splitting, and reducing the amount of use

Active Publication Date: 2021-06-04
ZHONGSHAN DEHUA CHIP TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, flexible GaAs solar cells often use metal support substrates or metal-bonded flexible substrates, which have problems of insufficient power-to-weight ratio, easy cracking, and low yield.

Method used

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  • Solar cell and preparation method thereof
  • Solar cell and preparation method thereof
  • Solar cell and preparation method thereof

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Embodiment 1

[0100] This embodiment prepares a kind of solar cell, specifically comprises the following steps:

[0101] S1. Epitaxially growing a sacrificial layer on the first substrate, the material of the sacrificial layer is AlAs, and the thickness is 10 nm;

[0102] S2. On the surface of the sacrificial layer far away from the first substrate, a battery material layer 4 is arranged. The battery material layer 4 includes an n-GaAs layer, a GaInP battery layer, a tunnel junction, and a GaAs battery layer that are epitaxially grown in sequence starting from the surface of the sacrificial layer. , GaInP cut-off layer and p-GaAs layer;

[0103] S3. On the surface of the battery material layer 4 away from the first substrate, electron beam evaporation is used to arrange a back metal layer 3 with a total thickness of 3um. The back metal layer 3 is a composite layer formed by a Ni layer and an Au layer, wherein Ni Thickness 1um, Au thickness 2um;

[0104] S4. On the surface of the back meta...

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Abstract

The invention provides a solar cell and a preparation method thereof. The solar cell is characterized in that the solar cell comprises a flexible substrate (1); a bonding layer (2), arranged on the surface of the flexible substrate (1); a back metal layer (3), arranged on the surface of the bonding layer (2); a battery material layer (4), arranged on the surface of the back metal layer (3); front electrode layers (5), arranged on the surface of the battery material layer (4) at equal intervals; a cut-off layer (6), arranged on the surface of the back metal layer (3), and the cut-off layer (6) being adjacent to the battery material layer (4); a back electrode (7) embedded in the cut-off layer (6); and anti-reflection film layers (8), arranged on the surface of the cell material layer (4) outside the front electrode layer (5) and the surface of the cut-off layer (6) outside the back electrode (7). The solar cell preparation method provided by the invention is low in cost, high in yield and high in power-to-weight ratio.

Description

technical field [0001] The invention belongs to the technical field of solar cells, and in particular relates to a solar cell and a preparation method thereof. Background technique [0002] Energy is an important material basis for the existence and development of human society. As human society's demand for energy continues to increase, fossil energy reserves are decreasing, so the development and utilization of renewable energy is imminent. Solar energy is an inexhaustible new energy source, and solar cells are an important way for people to utilize solar energy. Solar cells can convert unlimited and clean solar energy into electrical energy, and are an important medium for human beings to utilize solar energy. [0003] According to the shape, solar cells can be divided into rigid solar cells and flexible solar cells. Compared with rigid solar cells, flexible solar cells have the characteristics of bendability and high power-to-weight ratio (power-to-weight ratio), which...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/0216H01L31/0304H01L31/0392H01L31/18
CPCH01L31/02167H01L31/0304H01L31/03926H01L31/0392H01L31/184Y02P70/50Y02E10/544
Inventor 杨文奕何键华黄嘉敬杜伟胡丹
Owner ZHONGSHAN DEHUA CHIP TECH CO LTD
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