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Connecting device and semiconductor machining equipment

A technology for connecting devices and processing equipment, applied in semiconductor/solid-state device manufacturing, crystal growth, metal material coating technology, etc., can solve problems such as quartz tube 2 fragmentation, reduce the risk of fragmentation, reduce component processing, Solve the effect of high installation accuracy requirements

Active Publication Date: 2018-11-02
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Since the chamber 1 and the quartz shaft sleeve 12 are all fixed on the chamber outer cover 13, the processing and installation precision requirements for the chamber 1, the chamber outer cover 13 and the quartz shaft sleeve 12 are relatively high. If it is large, the axis center of the quartz tube 2 and the quartz shaft sleeve 12 will deviate far away, and when the O-ring pressure ring 11 presses the O-ring 4, the O-ring 4 will generate a radial force on the quartz tube 2. During the installation process Assembling stress is generated in the middle, long-term use or frequent disassembly and assembly will more easily cause the quartz tube 2 to break

Method used

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  • Connecting device and semiconductor machining equipment
  • Connecting device and semiconductor machining equipment
  • Connecting device and semiconductor machining equipment

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Embodiment Construction

[0035] The technical solutions in the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the present invention. Apparently, the described embodiments are part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0036] In the connecting device of the present invention, the upper connecting piece is sleeved on the outer peripheral wall of the quartz tube, the supporting part is fixedly connected with the bottom of the quartz tube, and accommodated in the lower connecting piece to support the upper connecting piece, and is fixedly connected with the upper connecting piece The lower connecting piece is fixedly connected with the rotary lifting mechanism, so that the quartz tube is fixedly connected wi...

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PUM

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Abstract

The invention discloses a connecting device and semiconductor machining equipment. An upper connecting element is arranged on the outer circumferential wall of a quartz tube by the connecting device in asleeving mode, and therefore a supporting element is fixedly connected with the bottom of the quartz tube and is arranged in a lower connecting element to support the upper connecting element, andthe lower connecting element fixedly connected with the upper connecting element is fixedly connected with a rotating lifting mechanism, so that the quartz tube is fixedly connected with the rotatinglifting mechanism. In this way, a cavity outer cover does not need to be additionally arranged, high accuracy requirements of mounting the quartz tube, a quartz shaft sleeve and the cavity outer coverare achieved, machining and mounting difficulty of parts is reduced; and the quartz tube is not subjected to radial-direction stress when used, and therefore the risk of quartz tube cracking is lowered.

Description

technical field [0001] The invention relates to the field of semiconductor equipment manufacturing, in particular to a connection device and semiconductor processing equipment. Background technique [0002] The CVD (Chemical Vapor Deposition, chemical vapor deposition) method is a method for preparing epitaxial thin film layers by using different gases to react with each other at high temperature. Epitaxial growth can be carried out by CVD equipment, that is, a single crystal layer with certain requirements and the same crystal orientation as the substrate is grown on a single crystal substrate (substrate). Because quartz has the advantage of high temperature resistance, in most CVD epitaxy equipment, quartz is used as the lining of the chamber. In addition, because the foamed quartz also has the advantage of good heat insulation, it is usually connected with the rotating lifting mechanism to achieve The effect of heat insulation from the outside reduces the influence of th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C16/44C30B25/08H01L21/67
CPCC23C16/44C30B25/08H01L21/6719
Inventor 张峥
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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