Method for manufacturing endless cutting wire for ingot cutting

A manufacturing method and metal wire technology, which is applied in the direction of sawing machine tool manufacturing, manufacturing tools, metal sawing equipment, etc., can solve the problems of reduced cutting performance, weak fixing force, and easy falling off, so as to improve cutting quality and prevent falling off , the effect of strong fixing force

Inactive Publication Date: 2011-10-26
DISEC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] In addition, although various fixing methods have been proposed for the cemented carbide particles fixed to the above-mentioned cutting wire, the above-mentioned methods have weak fixing force or we

Method used

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  • Method for manufacturing endless cutting wire for ingot cutting
  • Method for manufacturing endless cutting wire for ingot cutting
  • Method for manufacturing endless cutting wire for ingot cutting

Examples

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Embodiment Construction

[0028] Dozens of small-diameter metal wires are braided into a twist shape to form a larger-diameter steel strand S, and the above-mentioned steel strands S of a certain length are braided into a large-diameter steel wire rope, so that they are connected as a whole without breakpoints. At the same time as the endless structure, the cutting part (20; hard carbide particles or diamond particles) is fixed on the surface of the above-mentioned steel wire rope, and it can also be used as a high-efficiency ingot when it is tightly coiled between high-speed rotating pulleys. A general ingot-cutting endless cutting wire 10 used for the cutting member. The manufacturing method of the above-mentioned annular cutting wire for ingot cutting includes the following steps: weaving dozens of small-diameter wires into twist-shaped steel strands (S; 0.5 mm or less) of a certain thickness, and preparing at least seven or more After the above-mentioned steel strands of the same length, the above-...

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Abstract

The present invention relates to a method for manufacturing a cutting edge used for cutting a silicon ingot which is grown as a single or poly crystal, especially for an endless cutting wire of a new mechanism which forms a loop without interruption and cuts the ingot while rotating at high speed on a pulley. The method comprises: preparing at least seven wire strands each of which is made by twisting dozens of thin and small-diameter wires to a uniform thickness and then binding and twisting the prepared strand wires into a single wire rope of larger diameter so that the twist-start point and the opposite twist-end point of the wire strands start and end at different positions, putting each wire strand in the center of other wire strands being twisted when twisting the wire strands, and also putting the twist-end point of each wire strand in the center of other wire strands being twisted. Therefore, an integrated endless cutting wire without a weak portion like a cutoff or knot is manufactured.

Description

technical field [0001] The present invention relates to a method of manufacturing a ring-shaped cutting wire, specifically, in a cutting blade for cutting a single crystal or polycrystalline silicon ingot, a shape of a non-broken connecting ring is formed, rotated at a high speed on a pulley, thereby cutting A new method of manufacturing ring-cut wire for ingot casting. Background technique [0002] Wafers used as the core components of semiconductors and solar cells are manufactured by cutting silicon ingots. As this cutting method, a saw-shaped ribbon cutting blade was generally used in the past, but the blade breakage rate is high. , short life, not only poor economy but also poor cutting efficiency and productivity, so it is almost no longer used recently. [0003] Recently, with the development of endless cutting wires for cutting ingots, the demand for them has increased dramatically. Such as figure 1 As shown, it is braided into a twist shape by dozens of very thin...

Claims

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Application Information

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IPC IPC(8): B23D61/18B23P15/28
CPCB23D61/185B23D65/00B23D61/18B23P15/28
Inventor 吴重杓
Owner DISEC
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