Laser device for cutting and method thereof

Abstract

The invention discloses a laser cutting device, which is used for cutting brittle material base board along the preset direction. The laser cutting device comprises: a load device, which is used for loading the brittle material base board; a breakage tool, which is used for forming a pre-cutting line along the preset direction on the brittle material base board; a laser generating device, which is used for producing laser bean to heat the brittle material base board along the pre-cutting line; a cooling device, which is used for providing cooling liquid to cool the heated brittle material base board, to make the brittle base board break along the pre-cutting line; a clamp device, which comprises at least one pair of clamp components, which is used to clamp the brittle material base board from the two corresponding sides of the preset direction. The invention also provides a method of using the laser cutting device to cut brittle material baseboard.

Description

technical field [0001] The invention relates to a laser cutting device and method, in particular to a cutting device and method for cutting a brittle material substrate by using a laser beam. Background technique [0002] With the continuous development of display technology, thin film transistor liquid crystal display (Thin Film Transistor Liquid Crystal Display, TFT-LCD) and other liquid crystal display devices have been widely used in the consumer field, which is expected to replace the traditional cathode ray tube (Cathode Ray Tube, CRT) display device . [0003] A liquid crystal display device such as a TFT-LCD usually consists of two glass substrates, a liquid crystal material accommodated between the two glass substrates, and a number of circuits. The liquid crystal material can change the arrangement mode under the action of electric field to complete the display function of TFT-LCD. Generally, in order to form liquid crystal display panels of different sizes, it i...

AI Technical Summary

Problems solved by technology

The glass substrate will have a stress change due to the sharp temperature difference, and the stress change will generate a downward-growing crack at the position of the pre-cut line formed by the cutter wheel on the surface of the glass substrate, and then crack the entire glass substrate.

[0005] However, in the process of cutting the glass substrate with the above-mentioned laser cutting device, a certain amount of displacement energy is often generated outward on both sides of the pre-cut line on the glass substrate along a direction substantially perpendicular to the pre-cut line, and this displacement energy is likely to cause crack growth. Deviation out of the allowable cutting range, resulting in cutting failure

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