Glass substrate cutting equipment and cutting method

Abstract

The invention provides glass substrate cutting equipment which comprises a worktable, a cutting knife and a roller, wherein the glass substrate is transferred on the worktable; the cutting knife comprises an upper cutting knife and a lower cutting knife which are respectively arranged at the upper and lower ends of the glass substrate, and the knife edges of the cutting knives are opposite so as to cut the glass substrate into two halves from the upper and lower sides of the glass substrate; the roller is arranged at the upper end of the glass substrate, and the glass substrate can be pressed along the cutting crack on the glass substrate to break the glass substrate. The cutting equipment further comprises a high pressure nozzle mouth which is arranged between the cutting knife and the roller and can eject a high pressure air flow along the cutting crack so as to accelerate breakage of the glass substrate. By additionally arranging the high pressure nozzle mouth which ejects the high pressure air flow to the crack during cutting so as to increase the pressure at the crack and deepen the crack, the effect of quickly cracking is realized.

Description

Technical field [0001] The invention relates to a manufacturing equipment and a preparation method of a glass substrate, in particular to a cutting equipment and a cutting method of a glass substrate. Background technique [0002] The glass substrate of the existing liquid crystal panel needs to be combined with a color filter during the preparation process, and liquid crystal is poured on the substrate, and then cut into the required size. Generally, a cutting knife is used to cut the glass substrate back and forth to cut it into two halves. At this time, due to the long-term use of the cutting knife, the knife head is easy to wear and become blunt. When cutting the glass, the cracks are shallow, making it difficult to break. , It affects the cutting quality of the glass substrate and cannot meet the requirements of refined production of liquid crystal panels. Summary of the invention [0003] Based on the shortcomings of the prior art, the main purpose of the present invention ...

AI Technical Summary

Problems solved by technology

Usually, a cutting knife is used to cut the glass substrate back and forth to cut it into two halves. At this time, due to the long-term use of the cutting knife, the knife head is easy to wear and become blunt, and the cracks are shallow when cutting the glass, making it difficult to break. , affects the cutting quality of the glass substrate, and cannot meet the requirements of fine production of LCD panels

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