Intelligent wave soldering tin bath

A wave soldering and tin bath technology, applied in the field of intelligent wave soldering baths, can solve the problems of increased oxygen content, increased oxygen content and impurities, and large volume of wave soldering baths, so as to improve welding quality, save energy, and improve production efficiency. Effect

Inactive Publication Date: 2010-09-15
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  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The volume of the traditional wave soldering tin bath is generally large, and a large amount of basic solder needs to be invested to meet the needs of the wave soldering process; after the tin wave is fired, it directly falls into the molten solder in the tin bath, thereby forming an oxygen absorption effect, which is the internal solder

Method used

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  • Intelligent wave soldering tin bath
  • Intelligent wave soldering tin bath
  • Intelligent wave soldering tin bath

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Embodiment Construction

[0012] The present invention will be described in further detail below in conjunction with the embodiments and with reference to the accompanying drawings.

[0013] An intelligent wave soldering tank includes a tank body 19 and a tank shell 22, the tank body 19 is composed of a transverse partition 7 in the middle and two vertical partitions 8, 10 perpendicular to the transverse partition 7 and the four sides of the tank body 19 Separated into three mutually independent spaces, wherein a space separated by the three sides of the tank body 19 of the transverse diaphragm 7 and the tank body 19 is the air return chamber 6, the longitudinal diaphragm 8, the longitudinal diaphragm 10, the transverse diaphragm 7 and the groove The other two spaces separated by the three sides of the body 19 are the solder chamber 3 and the copper removal chamber 4, and the lower parts of the two longitudinal partitions 8, 10 are provided with two return tin pipes 11 connecting between the solder cham...

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Abstract

The invention discloses an intelligent wave soldering tin bath which comprises a bath body and a bath shell, wherein the bath body is separated into an air reflux chamber, a solder chamber and a copper removing chamber, wherein a tin return hole is communicated with the solder chamber and the copper removing chamber, the copper removing chamber is internally provided with a movable box distributed with holes; the solder chamber is communicated with the air reflux chamber through a solder channel, the solder channel positioned at one end of the solder chamber is provided with a molten tin inlet, the solder channel positioned at one end of the air reflux chamber is provided with a molten tin outlet, the molten tin inlet is provided with a rotating impeller connected to a wave welding motor, the molten tin outlet is connected with a wave welding nozzle in a sealing way; a guide groove inclining to a plane is arranged above the air reflux chamber, one side edge of the guide groove is arranged at a neck part below the wave welding nozzle, and a lower edge is arranged above the copper removing chamber. The invention has the advantages of reducing base solder in a wave welding process, lowering the oxygen content and impurities inside the solder during the welding, and avoiding occurring temperature reduction.

Description

technical field [0001] The invention relates to a soldering tin tank in a wave soldering process, in particular to an intelligent wave soldering tin tank which can reduce basic solder and effectively remove impurities in a wave soldering process. Background technique [0002] The volume of the traditional wave soldering tin bath is generally large, and a large amount of basic solder needs to be invested to meet the needs of the wave soldering process; after the tin wave is fired, it directly falls into the molten solder in the tin bath, thereby forming an oxygen absorption effect. The oxygen content of the solder increases, and a large amount of oxidized slag is produced; when the basic solder is used for a long time, the oxygen content and impurities inside the solder gradually increase; there is a gap between the solder bath and the end of the preheating zone, so that when the PCBA runs to this area There is a drop in temperature. Contents of the invention [0003] In v...

Claims

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Application Information

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IPC IPC(8): B23K1/08B23K3/08
Inventor 严永农
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