Ink silk-screen process of thick-copper white soldering resistant ink PCB

A solder mask ink, PCB board technology, used in printed circuits, printed circuit manufacturing, printed circuit secondary processing, etc., can solve the problems of poor interlayer ink adhesion, lack of excellent resin flexibility, and high titanium dioxide content to avoid problems. The effect of white oil cracks, shortening the standing time, and reducing the cost of silk screen printing

Active Publication Date: 2019-09-20
惠州市联达金电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, there are many kinds of white solder resist inks used in the market, and the content of titanium dioxide in the existing white solder resist inks is relatively high
Titanium dioxide is an inorganic compound, which is relatively brittle and does not have the flexibility of resin
Therefore, printing the insulating layer of thick copper PCB board with white solder resist ink usually has the following defects: (1) printing the insulating la

Method used

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  • Ink silk-screen process of thick-copper white soldering resistant ink PCB
  • Ink silk-screen process of thick-copper white soldering resistant ink PCB
  • Ink silk-screen process of thick-copper white soldering resistant ink PCB

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042]For the thick copper PCB board with a total copper thickness of 128 μm, the white solder resist ink layer is screen-printed, and the specific steps are as follows:

[0043] S1. Perform sandblasting pre-treatment on the thick copper PCB board to be screen-printed with solder resist ink, and use aluminum sheets to plug the via holes.

[0044] S2. Use 36T screen printing mesh to print white solder resist ink. Among them, the printing uses a new squeegee at 75 degrees. In addition, the white solder resist ink is used after oiling. Specifically, after oiling, stir for 17 minutes and let it stand for 30 minutes, so that the viscosity of the white solder resist ink reaches 200dpa.s, and then use it for printing.

[0045] Moreover, the angle of the screen printing squeegee for printing is 26°, and the air pressure of the screen printing is 6.2kg / cm 2 , the screen printing speed is 2.2m / min; and after the screen printing is completed, the screen frame rises, and the ink on the ...

Embodiment 2

[0050] For the thick copper PCB with a total copper thickness of 116 μm, the white solder resist ink layer is screen-printed, and the specific steps are as follows:

[0051] S1. Perform sandblasting pre-treatment on the thick copper PCB board to be screen-printed with solder resist ink, and use aluminum sheets to plug the via holes.

[0052] S2. Use 36T screen printing mesh to print white solder resist ink. Among them, the printing uses a new squeegee at 75 degrees. In addition, the white solder resist ink is used after oiling. Specifically, after oiling, stir for 20 minutes and let it stand for 30 minutes to make the viscosity of the white solder resist ink reach 185dpa.s, and then use it for printing.

[0053] Moreover, the angle of the screen printing squeegee for printing is 23°, and the air pressure of the screen printing is 6.1kg / cm 2 , the screen printing speed is 2.2m / min; and after the screen printing is completed, the screen frame rises, and the ink on the screen f...

Embodiment 3

[0058] For the thick copper PCB with a total copper thickness of 140 μm, the white solder resist ink layer is screen-printed, and the specific steps are as follows:

[0059] S1. Perform sandblasting pre-treatment on the thick copper PCB board to be screen-printed with solder resist ink, and use aluminum sheets to plug the via holes.

[0060] S2. Use 36T screen printing mesh to print white solder resist ink. Among them, the printing uses a new squeegee at 75 degrees. In addition, the white solder resist ink is used after oiling. Specifically, after oiling, stir for 15 minutes and then let it stand for 30 minutes, so that the viscosity of the white solder resist ink reaches 180dpa.s, and then use it for printing.

[0061] Moreover, the angle of the screen printing squeegee for printing is 24°, and the air pressure of the screen printing is 6.5kg / cm 2 , the screen printing speed is 2.5m / min; and after the screen printing is completed, the screen frame rises, and the ink on the ...

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Abstract

The invention discloses an ink silk-screen process of a thick-copper white soldering resistant ink PCB. The silk-screen process comprises the following steps of S1, performing sand-blasting pre-processing on the thick-copper PCB to be silk-screened with soldering resistant ink, and performing plugging a conduction hole; S2, performing silk-screen printing of white soldering resistant ink, and allowing to stand; and S3, sequentially performing segmented pre-baking, alignment, exposure and developing, and completing ink silk-screen printing. According to the process, the white soldering resistant ink layer with a line shoulder thickness not lower than 7 micrometers can be completed on the thick-copper PCB by one-time silk-screen printing, the silk-screen process is improved, the silk-screen cost is reduced, and the problem that the ink layer is easy to crack during die punching is also prevented; moreover, by segmented pre-baking, the standing time after silk-screen is shorted, and the defect of white oil crack is also solved; and meanwhile, by controlling the energy of exposure and developing, the ink layer is maintained to be shiny, the developing is clear, and the defect that white oil crack is easily occurred after backflow welding or wave soldering at a client is effectively prevented.

Description

technical field [0001] The invention relates to the technical field of production of thick copper PCB boards, in particular to an ink screen printing process for thick copper white solder resist ink PCB boards. Background technique [0002] With the development of LED (Light-Emitting Diode, light-emitting diode) lamps, lamps and outdoor and indoor billboards basically replace traditional tungsten lamps with LED lamps. At the same time, LED lamps are widely used in roads, homes, automobiles, advertising decoration, and civil, industrial, medical, aerospace, and military industries. [0003] The PCB board (Printed Circuit Board, printed circuit board) on the LED lamps generally uses white solder resist ink as the insulating layer of the lamps. This is because the white ink has the characteristics of high reflective efficiency, which can greatly reduce the loss of light. This enables the lamps to obtain better illuminance under the same conditions. PCB boards use white solder...

Claims

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Application Information

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IPC IPC(8): H05K3/28
CPCH05K3/282
Inventor 杨展仁
Owner 惠州市联达金电子有限公司
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