Apparatus and method for vertically-structured passive components

A technology of passive components and electronic devices, applied in the direction of electrical components, semiconductor devices, electric solid devices, etc., to achieve the effect of reducing bridging and/or insufficient soldering and reducing the area

Active Publication Date: 2011-05-04
WINTEC IND INC
View PDF3 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Reduced size will make traditional passive components less likely to be soldered t

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Apparatus and method for vertically-structured passive components
  • Apparatus and method for vertically-structured passive components
  • Apparatus and method for vertically-structured passive components

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0051] Preferred embodiments of the present invention will be described with reference to the various drawings, where like numbers refer to elements that are identical or functionally similar. Also in illustrations, the leftmost digit of each number corresponds to the illustration in which that number is first used.

[0052] "A specific embodiment" or "a specific embodiment" mentioned in the specification means that a feature, structure or characteristic described in relation to the specific embodiment is included in at least one specific embodiment of the present invention. The phrases "in a specific embodiment" or "a specific embodiment" appearing in different places in the specification do not necessarily refer to the same specific embodiment.

[0053] In addition, in the description, the selection of words is based on the principle of easy reading and description, and is not used to limit or restrict the object of the present invention. Therefore, the disclosure of the pr...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

A manufacturing technique for constructing passive electronic components in vertical configurations is disclosed. Electrically passive components are constructed in a structure that is substantially perpendicular to target platform including a first plane to provide a larger electrode contact area and a smaller physical dimension. Passive components structured to be substantially perpendicular toa plane associated with a target platform can be directly connected to pad contacts of an integrated circuit or substrate or can be embedded in a package to reduce the area overhead of a passive component while improving the effectiveness of the passive components in their applications.

Description

[0001] This application claims priority to Provisional Application No. 61 / 251,617, filed October 14, 2009, which is hereby incorporated in its entirety. technical field [0002] The invention relates to an electronic component, in particular to a device of a vertical structure passive component that reduces the area occupied by the passive component on a target platform, and a packaging and assembly method thereof. Background technique [0003] Semiconductor components are usually manufactured using a ball grid array (BGA) package, in which metal solder balls composed of tin, silver and copper are pre-soldered on the pad contacts of a component package to seal the semiconductor The components are soldered to a target platform (eg, printed circuit board "PCB"). Semiconductor components are also often manufactured in a leadless grid array (LGA) package. The solder pad contact points of this package are not provided with solder balls, but a thin layer of solder paste is pre-pri...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L25/00H01L23/488H01L21/60
CPCH01L2924/0002
Inventor 陈拱辰
Owner WINTEC IND INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap