Solder paste reflow soldering and glue fixing process

A technology of reflow soldering and solder paste, which is applied in the direction of electrical components, printed circuit manufacturing, printed circuit, etc., can solve the problems of no uniform specification of process steps, lower yield rate of PCB board, and easy oxidation of solder paste film, etc., to achieve weakening Intermittent wetting phenomenon, reducing the cracking of the original, reducing the effect of bridging

Inactive Publication Date: 2019-09-17
深圳市英创立电子有限公司
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AI Technical Summary

Problems solved by technology

[0004] In the existing PCB board welding process, since there is no uniform specification for the process steps, most of the operators choose different process methods based on experience, but because the PCB is easily broken when heated, the SMT devices installed on the wave soldering surface Bridging between pins is easy to occur, and the solder paste film is also easily oxidized due to intermittent wetting, which greatly reduces the yield rate of PCB board processing

Method used

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  • Solder paste reflow soldering and glue fixing process

Examples

Experimental program
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Embodiment

[0043] Embodiment: a kind of solder paste reflow soldering and glue fixation process, refer to figure 1 , including the following steps:

[0044] 1. Determine the parameters of the solder paste, including: the initial temperature of the preheating zone, the range of the temperature rise slope; the temperature range and time range of the holding zone; the peak temperature range of the reflow zone, the range of the liquid phase state, the melting point of the solder paste, and the freezing point of the solder paste .

[0045] 2. Judging the size of the PCB board, including large board, medium board and small board; when it is a large board, the solder paste parameters take the upper limit value, and when it is a medium board and small board, the solder paste parameters take the upper and lower limits Median.

[0046]3. Draw the solder paste characteristic curve, and adjust the reflow oven according to the solder paste characteristic curve, so that the PCB production furnace te...

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Abstract

The invention discloses a solder paste reflow soldering and glue fixing process, belonging to the technical field of surface mount. The key point of the technical solution is that the process includes the steps of determining solder paste parameters, judging the size of a PCB, drawing a solder paste characteristic curve, applying solder paste, performing reflow soldering, applying glue, performing wave soldering, cooling and taking. According to the process, the technical problem that the bridging is easily generated between pins of a device in the prior art is solved, the effect of reducing the probability of generating bridging between the pins of the device is achieved, and the process is applied to the soldering of the PCB.

Description

technical field [0001] The invention relates to the technical field of surface assembly, more specifically, it relates to a solder paste reflow soldering and glue fixing process. Background technique [0002] Reflow soldering is one of the three main processes in the SMT placement process. Reflow soldering is mainly used to solder the circuit board with components already mounted. The solder paste is melted by heating to fuse the patch component and the circuit board pad, and then the solder paste is cooled by reflow soldering to cool the component and The pads are cured together. [0003] During the entire soldering process, the furnace temperature curve of reflow soldering plays a vital role in the soldering of electronic components. If the temperature is too low, it will lead to poor soldering. If the temperature is too high, it will cause damage to the components. If the device is cracked, the solder paste will change qualitatively if the temperature rises too slowly, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34
CPCH05K3/341H05K3/3494
Inventor 王启胜赵林森刘德荣宋日新夏明明
Owner 深圳市英创立电子有限公司
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