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Ceramic material for 3D light curing formation printing and preparation method of ceramic element

A technology of photocuring molding and ceramic materials, applied in the direction of additive processing, etc., can solve the problems of easy cracking or deformation, low molding accuracy, poor fluidity, etc. of ceramic products, and achieve excellent printing and storage stability, good dispersion effect, The effect of high ceramic content

Inactive Publication Date: 2019-03-01
西安点云生物科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] In order to solve the problems of poor fluidity and low molding precision of existing light-cured ceramic resins, and the final prepared ceramic products are prone to cracks or deformations, the present invention provides a ceramic material for 3D light-cured molding printing and its preparation method

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0066] The composition of the ceramic material used for 3D light curing molding printing in this embodiment is as follows:

[0067] Ceramic powder (30vol%): use 20nm silicon dioxide;

[0068] Photosensitive resin premix (70vol%): select 38wt% of 6-functionality aromatic urethane acrylate and 12wt% of polyester acrylate as oligomers;

[0069] 22wt% THFA and 22wt% IBOMA are reactive diluents;

[0070] 1.5wt% phenyl bis(2,4,6-trimethylbenzoyl) phosphine oxide and 1.57wt% 1-hydroxycyclohexyl phenyl ketone are photoinitiators;

[0071] 0.5wt% BYK2155 and 0.52wt% Span80 are dispersants;

[0072] 0.1wt% UV-329 is an ultraviolet blocking agent;

[0073] 0.3wt% acrylate copolymer is leveling agent;

[0074] 1wt% polydimethylsiloxane is defoamer;

[0075] 0.01wt% hydroquinone is a polymerization inhibitor;

[0076] 0.5wt% BYK410 is anti-settling agent.

[0077] Preparation of light-cured ceramic resin:

[0078] First, mix the above selected oligomers, reactive diluents, photoini...

Embodiment 2

[0089] The composition of the ceramic material used for 3D light curing molding printing in this embodiment is as follows:

[0090] Ceramic powder (60vol%): use 700nm α-Al 2 o 3 ;

[0091] Photosensitive resin premix (40vol%): select 30wt% trifunctional aliphatic urethane acrylate and 13wt% difunctional aromatic urethane acrylate as oligomers;

[0092] 15wt% THFA, 5wt% EO 3 The triethylene glycol divinyl ether (DVE-3) of -TMPTA, 18wt% is reactive diluent;

[0093] 1.65wt% of 2,4,6-trimethylbenzoyl-diphenylphosphine oxide (TPO) and 2.35wt% of 1-hydroxycyclohexyl phenyl ketone (184) are photoinitiators;

[0094] 2wt% BYK118 and 3wt% polyoxyethylene octylphenol ether-10 (OP-10) are dispersants;

[0095] 0.6wt% OB-1 is an ultraviolet blocking agent;

[0096]3wt% polyether modified organosiloxane is a leveling agent;

[0097] 4wt% polydimethylsiloxane is defoamer;

[0098] 0.05wt% hydroquinone is a polymerization inhibitor;

[0099] 2.35wt% BYK410 is an anti-settling agent...

Embodiment 3

[0112] The composition of the ceramic material used for 3D light curing molding printing in this embodiment is as follows:

[0113] Ceramic powder (40vol%): use 200nm hydroxyapatite and 500nm β-tricalcium phosphate (mass ratio is 3:1);

[0114] Photosensitive resin premix (60vol%): select 50wt% of 6-functionality aromatic urethane acrylate as oligomer;

[0115] 15wt% THFA, 5wt% IBOMA, 20wt% TPGDA are reactive diluents;

[0116] 1.17wt% phenyl bis(2,4,6-trimethylbenzoyl) phosphine oxide (819) and 3wt% benzoin dimethyl ether (651) are photoinitiators;

[0117] 1.2wt% BYK2155 and 0.8wt% polyethyleneimine as dispersant;

[0118] 0.22wt% OB-1 is an ultraviolet blocking agent;

[0119] 0.7wt% polymethylphenylsiloxane is a leveling agent;

[0120] 2wt% polyoxypropylene glyceryl ether is defoamer;

[0121] 0.01wt% hydroquinone is a polymerization inhibitor;

[0122] 0.9wt% BYK410 is anti-settling agent.

[0123] Preparation of light-cured ceramic resin:

[0124] First, mix the...

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Abstract

The invention relates to a ceramic material for 3D light curing formation printing and a preparation method of a ceramic element. The ceramic material is prepared from 30 to 70 vol percent of ceramicpowder and 30 to 70 vol percent of photosensitive resin premixed liquid, wherein the photosensitive resin premixed liquid is prepared from 37 to 50 weight percent of oligomers, 30 to 60 weight percentof reactive diluents, 0.1 to 5 weight percent of photoinitiators, 1 to 5 weight percent of dispersing agents, 0.1 to 0.6 weight percent of ultraviolet blocking agents, 0 to 0.05 weight percent of polymerization inhibitors, 1 to 4 weight percent of anti-foaming agents, 0.5 to 2.35 weight percent of anti-settling agents and 0.3 to 3 weight percent of leveling agents. In the degreasing and sinteringpost-treatment work procedures, specific parameters are used, so that a sintering element can reach good sintering density and mechanical performance. By optimizing the composition and the proportionof light curing ceramic resin, and selecting the excellent dispersing agent combination and the reasonable consumption, the ceramic powder can be better dispersed in the resin; the problems that theexisting light curing ceramic resin has poor flowability and low formation precision, and that a finally prepared ceramic product can easily generate cracks or deformation, and the like are solved.

Description

technical field [0001] The invention belongs to the field of preparation of ceramic materials, and in particular relates to a ceramic material for 3D light-curing molding and printing, a light-curing ceramic resin, a preparation method of the light-curing ceramic resin, and a preparation method of ceramic parts. Background technique [0002] Ceramic materials refer to a class of inorganic non-metallic materials made of natural or synthetic compounds through molding and high-temperature sintering. It has the advantages of high melting point, high hardness, high wear resistance and oxidation resistance. It can be used as structural material and cutting tool material. Since ceramics also have some special properties, such as excellent mechanical properties, thermal properties, electrical properties, chemical properties, and optical properties, they can also be used as functional materials. [0003] The molding methods of ancient pottery include moulding, clay strip building, k...

Claims

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Application Information

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IPC IPC(8): C04B35/622C04B35/14C04B35/10C04B35/447B33Y70/00B33Y80/00B33Y10/00
CPCB33Y10/00B33Y70/00B33Y80/00C04B35/10C04B35/14C04B35/447C04B35/622C04B2235/3246C04B2235/77C04B2235/96
Inventor 曾庆丰赵小龙
Owner 西安点云生物科技有限公司
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