The invention belongs to the technical field of
polyamide hot melt adhesives, and particularly relates to a copolyamide
hot melt adhesive for bonding a low-surface-energy fabric and a preparation method of the copolyamide
hot melt adhesive. A low-surface-energy flexible organic
silicon system and an alicyclic rigid group are introduced into a
dimer acid type
polyamide system at the same time, so that the prepared copolyamide
hot melt adhesive product has high cohesive force,
adhesive strength and low-surface-
energy performance; the problems that an existing copolyamide
hot melt adhesive is complex in preparation process and has limitation in the aspect of
environmental protection are solved. Compared with a traditional copolyamide
hot melt adhesive, the copolyamide hot melt adhesive has the advantages of being
environmentally friendly, resistant to
water washing and resistant to low temperature while maintaining high adhesive performance, and the performance of a product is greatly improved through the beneficial effects; the product has high matching degree with the customer process, the
polymerization process is simple and efficient, the production is convenient, and the economic value is good.