Single-component stable luminescent device embedding composition at room temperature

A light-emitting device, one-component technology, applied in the field of potting glue, can solve the problems of limited and inconvenient two-component potting glue

Active Publication Date: 2008-07-16
杨钢
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the need for mixing and the service life of a certain period of time after mixing are the limited and inconvenient places for two-component potting adhesives

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] The percentage by weight of potting glue is composed of: Polypropylene glycol glycidyl epoxy resin (PPGE) 15~18% embodiment is 16.4%, isoamyl glycol glycidyl epoxy resin (NGGE) 3.8~5% embodiment 4.1%, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carbonate (ACE) 20%~27% embodiment is 24.7%; tricyclodecanyl dimethyloxy Diacrylate (TAAT) 30-45% Example is 37%; Silicone additive 0.1%-1.2% Example is 1%; Defoamer BYK A550 (Chemei) 0.01-0.12% Example is 0.20%; Cationic Initiator: quaternary ammonium hexafluoroantimonate: 0.01% to 1.0%, the embodiment is 0.25%; silicate filler 10% to 20%, the embodiment is 16.35%; the potting compound synthesized from the above raw materials is used for potting LED light-emitting devices , cured at 100-120°C for 10 minutes, the hardness after curing is (shore A) 50-80; the colloid is colorless and transparent, and the UV light stability is 500 hours without color change. Combinations of the weight ratios of the above substances within the r...

Embodiment 2

[0021] The weight percentage of potting glue is composed of: isopentyl glycol glycidyl epoxy resin (NGGE) 4~7% embodiment is 4.9%, 3,4-epoxycyclohexylmethyl-3,4-epoxy ring Hexane carbonate (ACE) 60% ~ 80% embodiment is 75.4%; silicone additive 0.1% ~ 1.2% embodiment is 0.2%; defoamer BYK A550 (Chemei) 0.01 ~ 0.12% embodiment is 0.07% ; Cationic initiator: quaternary ammonium hexafluoroantimonate: 0.01% to 1.0%, the embodiment is 0.10%; silicate filler 18 to 30%, the embodiment is 19.3%; the potting glue synthesized by the above raw materials is used for LED light emitting devices During potting, it is cured at 100-120°C for 15 minutes, and its hardness after curing is (shore A) 80-95; the colloid is colorless and transparent, and has no color change after 500 hours of UV stability. Combinations of the weight ratios of the above substances within the range of values ​​are applicable, and are not limited to the specific ratios given in the examples.

Embodiment 3

[0023] The percentage by weight of potting glue is composed of: Polypropylene glycol glycidyl epoxy resin (PPGE) 32~45% embodiment is 36.60%, isoamyl glycol glycidyl epoxy resin (NGGE) 7~8% embodiment It is 7.30%, cyclohexyl dimethoxy glycidyl epoxy resin (CHDM-DGE) 50%~60% embodiment is 54.80%; Silicone auxiliary agent 0.1%~1.2% embodiment is 1%; Defoamer 0.01 ~0.12% embodiment is 0.10%; Cationic initiator: quaternary ammonium hexafluoroantimonate: 0.01%~1.0% embodiment is 0.20%; The encapsulant that above-mentioned raw material is synthesized is used in LED light-emitting device encapsulation, in 100 Curing at -120°C for 30 minutes, the hardness after curing is (shore A) 30-60; the colloid is colorless and transparent, and the UV light stability is 500 hours without color change. Combinations of the weight ratios of the above substances within the range of values ​​are applicable, and are not limited to the specific ratios given in the examples.

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PUM

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Abstract

The invention discloses a single-component encapsulating adhesive of a luminescent device with constant room temperature, and the components are: (1) epoxide resin and / or a monomer containing polymerizable double bond of C=C; (2) cation solicitation; (3) accessory ingredient: one or a combination of more than one of silicone adhesive accessory ingredient, foam killer, release agent, toner, antioxidant, and light scattering agent; the cation solicitation is: one of or a combination of more than one of triarylated matte onium based six fluorine antimonite, triarylated matte onium based six fluorine phosphate, phenyl octyloxy iodobenzene onium based six fluorine antimonite, quaternary ammonium group six fluorine antimonite, and quaternary ammonium group triflate. The encapsulating adhesive of the luminescent device is easy to be preserved; the use is convenient; double constituents of encapsulating adhesive are not needed to be blended when the encapsulation is conducted; the polymerization temperature is relatively low; the curing time is short, and the cured colloid is colorless and transparent with high transmittancy; the agglutinated property is constant; the adhesive is applicable to the encapsulating of the luminescent device, particularly for the encapsulating of a luminous diode.

Description

technical field [0001] The invention belongs to a potting glue for potting and sealing electronic devices, in particular to a single-component potting glue for a light-emitting device that is stable at room temperature. Background technique [0002] The currently commonly used potting glue for light-emitting devices, such as LED potting glue, is a two-component epoxy resin composition. As disclosed in US4178274, it is based on fast curing resin oxides, including at least one epoxy resin (alicyclic with two epoxy groups), at least one acid anhydride, zinc decacarbonate, various alcohols of low molecular weight, and Components such as low-molecular-weight hydroxy esters; as disclosed in US6617400, include cycloaliphatic epoxy resin, anhydride curing agent and boron catalyst; Diode potting compound. This type of encapsulant has good fluidity and filling properties, and also has good optical properties after curing. However, because it is a two-component, it is necessary to m...

Claims

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Application Information

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IPC IPC(8): C09K3/10C08L63/00H01L23/29
Inventor 杨钢
Owner 杨钢
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