The present application provides a method for preparing
solder mask for a circuit board based on plugging hole treatment and a circuit board. The above-mentioned method for preparing
solder mask for a circuit board based on plugging hole treatment, the present application provides a method for preparing
solder mask for a circuit board based on plugging hole treatment, comprising the following steps: providing a board body, plugging the via hole with a dual-curing resin, and then performing a
thermal curing operation to form a resin plug with an inner depression in the via hole, and performing a silk screen solder
mask operation, a vacuum operation, a photocuring operation, and a baking operation on the first and second surfaces of the board body formed with the resin plug, respectively, to solidify the solder
mask ink. Through this method, the bonding force between the board surface oil and the resin
plug in the plug hole can be increased, the connection strength between the solder
mask ink layer and the board body can be improved, and the via hole of the board body can be better protected, which is particularly suitable for the application of
new energy vehicles in harsh environments.