Ultraviolet (UV)/moisture dual-cured laminated adhesive and preparation method thereof

Abstract

The invention discloses an ultraviolet (UV) / moisture dual-cured laminated adhesive and a preparation method thereof. The UV / moisture dual-cured laminated adhesive is prepared by mixing ultraviolet-curable (methyl) acrylate resin, moisture-curable modified (methyl) acrylate resin, a (methyl) acrylic reactive diluent, a moisture-curable (methyl) acrylic reactive diluent, a photoinitiator and a catalyst in an appropriate formula ratio. Compared with a moisture-cured laminated adhesive, the invention has the advantages that: the UV / moisture dual-cured laminated adhesive is quickly cured, the efficiency is high, and the production cost is reduced. Compared with a UV-cured laminated adhesive, the UV / moisture dual-cured laminated adhesive has the advantages that: the disadvantage that a shaded part cannot be cured is overcome; and the protection effect of glue is improved. According to the results, the adhesive fully meets the production process requirements of laminated adhesives which are applied to the protection of printed circuit boards (PCB) and laminated adhesives for the protection of chip on glass (COG).

Description

technical field [0001] The invention relates to the field of polymer materials, in particular to a UV / moisture dual-curing coating adhesive and a preparation method thereof. Background technique [0002] Radiation curing refers to ultraviolet (UV) and electron beam (EB) curing, which is an advanced material surface treatment technology. It uses UV / EB to initiate rapid polymerization and crosslinking of chemically active liquid materials, and instantly solidifies to form a film. Light curing technology has the advantages of fast curing, low energy consumption, high efficiency, and no pollution. It fully complies with the "5E" principle: Efficient high efficiency, Enabling wide adaptability, Economical economy, Energy Saving energy saving, Environmental Friendly environment friendly, is an environmentally friendly green technology; [0003] In recent years, with the enhancement of people's environmental awareness and the development of high technology, UV curing technology h...

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Problems solved by technology

[0006] The purpose of the present invention is to overcome the shortcomings of the existing UV coating glue that cannot provide effective protection on complex types of circuit boards, and the glue cannot be UV cured in the shaded parts, and provide a UV / moisture dual curing coating glue with UV fast curing , the shadow part can be moisture cured, UV / moisture dual curing film adhesive that can meet the special protection requirements of complex types of circuit boards

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