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Photo-curing ink-jet nano conductive printing ink, and preparation and use method thereof

A nano-conductive and light-curing technology, applied in ink, printed circuit manufacturing, application, etc., can solve the problems of high temperature resistance of substrate materials, slow curing speed of thermosetting resin, high curing temperature of thermosetting resin, etc., to achieve shortening Effects of sintering time, lower sintering temperature, and higher resolution

Inactive Publication Date: 2009-01-21
BEIJING UNIV OF CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] Properly adding thermosetting resin under the condition that the resistivity can meet the requirements can improve the mechanical properties of the conductive coating, but the curing speed of the thermosetting resin is slow, which is not conducive to improving the resolution of the PCB board.
At the same time, due to the high curing temperature of the thermosetting resin, the requirements for the high temperature resistance of the substrate material are strict.

Method used

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  • Photo-curing ink-jet nano conductive printing ink, and preparation and use method thereof
  • Photo-curing ink-jet nano conductive printing ink, and preparation and use method thereof
  • Photo-curing ink-jet nano conductive printing ink, and preparation and use method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Firstly, 5g of nano-silver powder (brand HDY, average particle size 43nm) was dissolved in 12g of ethanol and ultrasonically dispersed for 20 minutes to a homogeneous solution, and then added acrylic low-viscosity resin EB81 under the condition of yellow light (filtering light with a wavelength less than 420nm) (100mPas, 25°C) 2g, butyl acrylate 1g, neopentyl glycol diacrylate 1g, trimethylolpropane triacrylate 0.45g, 1-hydroxycyclohexyl benzophenone 0.3g, dibenzoyl peroxide 0.1g, BYK 020 0.05g, BYK 373 0.05g, and p-hydroxyanisole 0.05g were stirred evenly, and then ultrasonically dispersed for 15 minutes to prepare a photocurable inkjet nano conductive ink with a viscosity (20°C) of 10mPa·s.

[0043] Spray the prepared photocurable inkjet nano-conductive ink on the surface of the glass substrate with an inkjet printer, expose it to a high-pressure mercury lamp (the main wavelength is 365nm) for 2 minutes, and then sinter it on a temperature-controllable heating table at...

Embodiment 2

[0045] First, 5.5g of nano-silver powder (brand HDY, average particle size 43nm) was dissolved in 15g of ethyl acetate and ultrasonically dispersed for 20 minutes to a homogeneous solution. Viscosity resin viajet100 (100mPas, 25°C) 1.5g, N-vinylpyrrolidone 1g, neopentyl glycol diacrylate 1g, 6-ethoxytrimethylolpropane triacrylate 0.4g, 2-methyl 1-( 0.3g of 4-methylmercaptophenyl)-2-morpholine 1-acetone, 0.15g of dibenzoyl peroxide, 0.05g of BYK 055, 0.05g of BYK 373, 0.05g of p-hydroxyanisole, stir well and then ultrasonically disperse After 20 minutes, a photocurable inkjet nano conductive ink was prepared, with a viscosity (20° C.) of 8 mPa·s.

[0046] Spray the prepared photocurable inkjet nano-conductive ink on the surface of the glass substrate with an inkjet printer, expose it to a high-pressure mercury lamp (the main wavelength is 365nm) for 2 minutes, and then sinter it on a temperature-controllable heating table at 180°C. 10min to get the experimental sample. Resist...

Embodiment 3

[0048] First, 6g of nano-silver powder (brand HDY, average particle size 43nm) was dissolved in 20g of ethyl acetate and ultrasonically dispersed for 20 minutes to a homogeneous solution, and then added acrylate low-viscosity Resin viajet100 (100mPas, 25°C) 1g, isooctyl acrylate 1g, ethoxy neopentyl glycol diacrylate 1g, 6-ethoxytrimethylolpropane triacrylate 0.4g, 2-hydroxy-2-methyl 0.3g of 1-phenylacetone, 0.15g of azobisisobutyronitrile, 0.05g of BYK 055, 0.05g of Glide 100, 0.05g of p-hydroxyanisole were stirred evenly, and then ultrasonically dispersed for 20 minutes to obtain a photocurable spray Ink nano conductive ink, the viscosity (20°C) is 6mPa·s.

[0049] Spray the prepared photocurable inkjet nano-conductive ink on the surface of the polyester film with an inkjet printer, expose it to a high-pressure mercury lamp (the main wavelength is 365nm) for 100s, and then place it on a temperature-controllable heating table at 150°C. Sinter for 10 minutes to obtain an expe...

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Abstract

The invention relates to light-cured ink jet nanometer conductive printing ink for printed circuit boards, and preparation and use methods thereof. The preparation method comprises the following steps: an acrylic ester low viscosity resin and an acrylic ester active monomer are added into nanometer metal dispersing solution and the mixture adopts a double cured mode that the mixture is subjected to light cure firstly and heat treatment secondly, wherein the light-cured treatment ensures that a coat is cured rapidly and achieves good mechanical performance; and the heat treatment ensures that the nanometer metal is nodulized together to achieve good conductive performance. The light-cured ink jet nanometer conductive printing ink which adopts the ink jet technique can be painted in the specific area of a base material. A conductive path is obtained after the double cured treatment. The light-cured ink jet nanometer conductive printing ink has the advantages of short cured time, low cured temperature, good conductivity and high resolving capability. The manufactured conductive membrane has good adhesiveness, high hardness, good flexibility and excellent conductivity.

Description

Technical field: [0001] The invention relates to a photocurable ink-jet nano conductive ink and a preparation method and application method thereof. Background technique: [0002] Traditional manufacturing methods for printed circuit boards (PCBs) include etching and screen printing. The etching manufacturing process includes substrate processing, glue coating, pre-baking, exposure, middle baking, development, post-baking, and degumming. In the production process, many times or even dozens of photolithography are often required, and the process is very complicated. At the same time, even if the mask is closely attached to the PCB board pre-coated with photoresist material by vacuuming, there will still be gaps between layers, resulting in diffraction during exposure, making The image is distorted. Therefore, the resolution, alignment and product yield of PCB boards made by etching methods are difficult to meet the requirements. Screen printing is to solidify the conducti...

Claims

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Application Information

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IPC IPC(8): C09D11/10C09D7/12H05K3/14C09D11/52
Inventor 魏杰王玥
Owner BEIJING UNIV OF CHEM TECH
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