124 results about "Polymeric liquid" patented technology

A method of forming a three-dimensional object, is carried out by (a) providing a carrier and a build plate, the build plate comprising a semipermeable member, the semipermeable member comprising a build surface with the build surface and the carrier defining a build region therebetween, and with the build surface in fluid communication by way of the semipermeable member with a source of polymerization inhibitor; (b) filling the build region with a polymerizable liquid, the polymerizable liquidcontacting the build surface, (c) irradiating the build region through the build plate to produce a solid polymerized region in the build region, while forming or maintaining a liquid film release layer comprised of the polymerizable liquid formed between the solid polymerized region and the build surface, wherein the polymerization of which liquid film is inhibited by the polymerization inhibitor; and (d) advancing the carrier with the polymerized region adhered thereto away from the build surface on the build plate to create a subsequent build region between the polymerized region and the build surface while concurrently filling the subsequent build region with polymerizable liquid as in step (b). Apparatus for carrying out the method is also described.

The present invention is directed toward an injectable, single- or multiple-component polymeric liquid precursor of an in situ-forming, non-absorbable, flexible, and resilient hydrogel or semi-solid that can be used in non-surgical, minimally invasive treatment of herniated disc.

A method of forming a dual cure three-dimensional object by additive manufacturing may be carried out by mixing a first precursor liquid and a second precursor liquid to produce a polymerizable liquid comprising a mixture of (i) a light polymerizable liquid first component, and (ii) a second solidifiable component (e.g., a second reactive component) that is different from the first component (e.g., that does not contain a cationic photoinitiator, or is further solidified by a different physical mechanism, or further reacted, polymerized or chain extended by a different chemical reaction). In the foregoing: (i′) at least one reactant of the second solidifiable component is contained in the first precursor liquid, and (ii′) at least one reactant or catalyst of the second solidifiable component is contained in the second precursor liquid. Once mixed, the three-dimensional object may be formed from the resin by a dual cure additive manufacturing process.

A method of forming a three-dimensional object, which method includes a cleaning or washing step, is carried out by: (a) providing a carrier and a fill level, and optionally an optically transparent member having a build surface defining the fill level, the carrier and the fill level having a build region therebetween; (b) filling the build region with a polymerizable liquid, the polymerizable liquid comprising a mixture of (i) a light polymerizable liquid first component, and (ii) a second solidifiable component that is different from the first component; (c) irradiating the build region with light, to form a solid polymer scaffold from the first component and also advancing the carrier away from the build surface to form a three-dimensional intermediate having the same shape as, or a shape to be imparted to, the three-dimensional object and containing the second solidifiable component carried in the scaffold in unsolidified and / or uncured form; (d) washing the three-dimensional intermediate; and (e) concurrently with or subsequent to the irradiating step, and / or the washing step, solidifying and / or curing the second solidifiable component in the three-dimensional intermediate to form the three-dimensional object.

An interconnect assembly and a fluxless method for forming the interconnect assembly. The fluxless method includes providing a first semiconductor substrate having a first pad connected thereto. A post is connected to the first pad and includes a length greater than a thickness of the first pad, and a metallic solder disposed on an associated end of the post. A second semiconductor substrate is provided as having a second pad connected thereto. The fluxless method further includes depositing an unfilled polymeric liquid on the second pad, aligning and contacting the metallic solder with the unfilled polymeric liquid, and forcing by pressure the first and second semiconductor substrate toward each while simultaneously heating the metallic solder and the unfilled polymeric liquid to form a metallurgical joint between the second pad and the metallic solder.

A method of forming a three-dimensional object, is carried out by (a) providing a carrier and a build plate, the build plate comprising a semipermeable member, the semipermeable member comprising a build surface with the build surface and the carrier defining a build region therebetween, and with the build surface in fluid communication by way of the semipermeable member with a source of polymerization inhibitor; (b) filling the build region with a polymerizable liquid, the polymerizable liquid contacting the build surface, (c) irradiating the build region through the build plate to produce a solid polymerized region in the build region, while forming or maintaining a liquid film release layer comprised of the polymerizable liquid formed between the solid polymerized region and the build surface, wherein the polymerization of which liquid film is inhibited by the polymerization inhibitor; and (d) advancing the carrier with the polymerized region adhered thereto away from the build surface on the build plate to create a subsequent build region between the polymerized region and the build surface while concurrently filling the subsequent build region with polymerizable liquid as in step (b). Apparatus for carrying out the method is also described.