Preparation method of photo-moisture dual cured hot melt polyurethane sealant

A polyurethane hot-melt adhesive, dual-curing technology, used in polyurea/polyurethane adhesives, adhesives, adhesive types, etc., can solve the problems of limited use, inability to quickly locate, poor impact resistance, etc., and achieve rapid positioning , Improve the effect of low initial strength and high strength

Inactive Publication Date: 2016-01-20
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the curing speed of the existing polyurethane hot-melt adhesives is still slower than that of quick-drying adhesives and other rubber types. It often takes a long time after construction (generally 1-3 days for room temperature curing) before reaching the final strength, causing construction problems. The prolongation of th...

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] A preparation method of light-moisture dual-curing polyurethane hot-melt adhesive, the steps are as follows:

[0015] (1) Heat 20kg of HDI trimer to 65°C, keep this temperature and fill with nitrogen, slowly add 5kg of hydroxyethyl methacrylate dropwise to it, the NCO end point of the reaction for 3h is 12.0%; then add 18kg of 1000 molecular weight Polyoxypropylene glycol was heated to 100°C and reacted for 1.5h, the end point of NCO was measured to be 3.5%, and prepolymer A was prepared for use;

[0016] (2) Take 50 kg of polyhexylene adipate diol with a molecular weight of 4000 and 50 kg of poly(1,3-butanediol adipate diol with a molecular weight of 3000) and mix them with 10 kg of TDI at 100 °C for 1.5 h, the NCO end point was measured to be 2.20%, and the prepolymer B was prepared for use;

[0017] (3) Add 40kg of prepolymer A and 80kg of prepolymer B to the 100°C reaction kettle, add 1.2kg of 2-hydroxy-2-methyl-1-phenylacetone, 0.06kg of dibutyltin dilaurate and 0...

Embodiment 2

[0019] A preparation method of light-moisture dual-curing polyurethane hot-melt adhesive, the steps are as follows:

[0020] (1) Heat 35kg of HDI trimer to 65°C, keep this temperature and fill with nitrogen, slowly add 8kg of hydroxyethyl methacrylate and 6kg of hydroxypropyl acrylate into it, and the NCO end point is 12.0% after 3 hours of reaction; Then, 62 kg of polyoxypropylene glycol with a molecular weight of 2000 was added and the temperature was raised to 100 °C for 1.5 h. The NCO end point was measured to be 2.5%, and prepolymer A was prepared for use;

[0021] (2) Take 100 kg of polyhexylene adipate diol with a molecular weight of 3000, poly(1,3-butylene adipate) diol with a molecular weight of 2000, 25 kg and a new polyadipate with a molecular weight of 2000 After mixing 25kg of pentylene glycol ester diol with 37.5kg MDI at 100°C for 1.5h, the NCO end point was measured to be 3.35%, and prepolymer B was prepared for use;

[0022] (3) Add 100kg of prepolymer A and ...

Embodiment 3

[0024] A preparation method of light-moisture dual-curing polyurethane hot-melt adhesive, the steps are as follows:

[0025] (1) Heat 50kg of HDI trimer to 65°C, keep this temperature and fill with nitrogen, and slowly add 11.4kg of hydroxyethyl methacrylate dropwise to it. The NCO end point of the reaction for 3h is 12.0%; then 131.6kg of molecular weight is added. 3000 of polytetrahydrofuran ether diol was heated to 100 °C for 1.5 h, the NCO end point was measured to be 1.9%, and prepolymer A was prepared for use;

[0026] (2) Take 100kg of polyethylene adipate diol with a molecular weight of 4000 and 88kg of polyethylene phthalate diol with a molecular weight of 1600, mix them with 40kg of MDI and react at 100°C for 1.5h , the NCO end point was measured to be 2.90%, and the prepolymer B was prepared for use;

[0027] (3) Add 150kg of prepolymer A and 100kg of prepolymer B to the 100°C reactor, add 0.6kg of 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 0.3kg of dilauric a...

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PUM

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Abstract

The invention relates to a preparation method of a photo-moisture dual cured hot melt polyurethane sealant. The preparation method comprises following steps: firstly, an HDI (hexamethylene diisocyanate) trimer reacts with a hydroxyl acrylate monomer, after the reaction, polyether polyol is added for continuous reaction, and a prepolymer A is obtained; bifunctional isocyanate reacts with crystalline polyester polyol and non-crystalline polyester polyol, and a prepolymer B is obtained; the prepolymer A and the prepolymer B are mixed in a certain ratio, then a photoinitiator, a catalyst, a coupling agent and the like are added, and the photo-moisture dual cured hot melt polyurethane sealant is obtained. The preparation method improves the defects of failure in rapid positioning of UV glue, low initial strength of the hot melt polyurethane sealant and the like, rapid positioning can be realized, the hot melt polyurethane sealant can achieve higher strength in a short time, and the hot melt polyurethane sealant can be used for bonding of appliances, furniture, electronic components and the like.

Description

technical field [0001] The invention belongs to the technical field of hot-melt adhesive preparation, and in particular relates to a preparation method of a light / moisture dual-curing polyurethane hot-melt adhesive. Background technique [0002] Reactive polyurethane hot-melt adhesive (Hotmeltpolyurethanesealant) is a hot-melt adhesive with polyurethane prepolymer as the main component. This kind of hot melt adhesive has the advantages of high tensile strength, excellent elasticity, wear resistance, oil resistance and cold resistance, etc. It is widely used in buildings, squares, highways as caulking sealing materials, as well as automobile manufacturing, glass installation , electronic filling, sealing of submarines and rockets, etc. However, the curing speed of the existing polyurethane hot-melt adhesive is relatively slow compared to other types of adhesives such as fast-drying adhesives. The prolongation of the process is not conducive to the saving of production costs...

Claims

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Application Information

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IPC IPC(8): C09J175/14C09J11/06C08G18/79C08G18/76C08G18/75C08G18/67C08G18/48C08G18/42C08G18/12
Inventor 刘文涛王建斌陈田安解海华
Owner YANTAI DARBOND TECH
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