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A kind of preparation method of light/moisture dual curing polyurethane hot melt adhesive

A polyurethane hot-melt adhesive, dual-curing technology, used in polyurea/polyurethane adhesives, adhesives, adhesive types, etc., can solve the problems of inability to quickly locate, limit use, poor impact resistance, etc. Low-intensity, fast positioning, high-intensity effects

Inactive Publication Date: 2017-12-19
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the curing speed of the existing polyurethane hot-melt adhesives is still slower than that of quick-drying adhesives and other rubber types. It often takes a long time after construction (generally 1-3 days for room temperature curing) before reaching the final strength, causing construction problems. The prolongation of the process is not conducive to the saving of production costs and the further improvement of process efficiency
UV curing acrylic adhesive has the advantage of fast curing, but it contains some volatile small molecular compounds, and its impact resistance is poor, so it cannot be positioned quickly
The above disadvantages limit the use of both

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] A preparation method of light-wet dual-curing polyurethane hot melt adhesive, the steps are as follows:

[0015] (1) Heat 20kg of HDI trimer to 65℃, keep this temperature and fill with nitrogen, slowly add 5kg of hydroxyethyl methacrylate dropwise to it, react for 3h and measure the NCO end point to be 12.0%; then add 18kg with a molecular weight of 1000 The polyoxypropylene glycol is heated to 100°C for 1.5 hours, the NCO end point is measured to be 3.5%, and the prepolymer A is prepared for use;

[0016] (2) Take 50 kg of polyhexanediol adipate diol with a molecular weight of 4000 and 50 kg of poly 1,3-butylene adipate diol with a molecular weight of 3000 and mix them with 10 kg of TDI at 100°C. 1.5h, the measured NCO endpoint is 2.20%, prepare prepolymer B for use;

[0017] (3) Put 40kg of prepolymer A and 80kg of prepolymer B into the reactor at 100℃, add 1.2kg of 2-hydroxy-2-methyl-1-phenylacetone, 0.06kg of dibutyltin dilaurate and 0.06 kg of dimorpholine diethyl ether...

Embodiment 2

[0019] A preparation method of light-wet dual-curing polyurethane hot melt adhesive, the steps are as follows:

[0020] (1) Heat 35kg of HDI trimer to 65℃, keep this temperature and fill with nitrogen, slowly add 8kg of hydroxyethyl methacrylate and 6kg of hydroxypropyl acrylate to it, the NCO end point is 12.0% measured after 3 hours of reaction ; Then added 62kg of polyoxypropylene glycol with a molecular weight of 2000 and heated to 100 ℃ for 1.5 hours, the measured NCO end point was 2.5%, prepare prepolymer A for use;

[0021] (2) Take 100 kg of polyhexylene adipate diol with a molecular weight of 3000, poly 1,3-butylene adipate diol with a molecular weight of 2000, 25 kg and a new polyadipate diol with a molecular weight of 2000 25kg of pentanediol ester diol was mixed and reacted with 37.5kg of MDI at 100°C for 1.5h, the NCO endpoint was measured to be 3.35%, and prepolymer B was prepared for use;

[0022] (3) Add 100kg of prepolymer A and 100kg of prepolymer B to the reactor ...

Embodiment 3

[0024] A preparation method of light-wet dual-curing polyurethane hot melt adhesive, the steps are as follows:

[0025] (1) Heat 50kg of HDI trimer to 65℃, keep this temperature and fill with nitrogen, slowly drop 11.4kg of hydroxyethyl methacrylate into it, the NCO endpoint measured after 3h is 12.0%; then add 131.6kg molecular weight The polytetrahydrofuran ether glycol is 3000 and the temperature is raised to 100°C to react for 1.5 hours, the NCO end point is measured to be 1.9%, and the prepolymer A is prepared for use;

[0026] (2) Take 100 kg of polyhexylene adipate diol with a molecular weight of 4000 and 88 kg of poly(ethylene phthalate diol) with a molecular weight of 1600 and mix with 40 kg of MDI at 100 ℃ for 1.5 h, the measured NCO endpoint is 2.90%, prepare prepolymer B for use;

[0027] (3) Put 150kg of prepolymer A and 100kg of prepolymer B into the reactor at 100℃, add 0.6kg of 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 0.3kg of dilauric acid Dibutyltin, 0.3kg ...

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PUM

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Abstract

The invention relates to a preparation method of a photo-moisture dual cured hot melt polyurethane sealant. The preparation method comprises following steps: firstly, an HDI (hexamethylene diisocyanate) trimer reacts with a hydroxyl acrylate monomer, after the reaction, polyether polyol is added for continuous reaction, and a prepolymer A is obtained; bifunctional isocyanate reacts with crystalline polyester polyol and non-crystalline polyester polyol, and a prepolymer B is obtained; the prepolymer A and the prepolymer B are mixed in a certain ratio, then a photoinitiator, a catalyst, a coupling agent and the like are added, and the photo-moisture dual cured hot melt polyurethane sealant is obtained. The preparation method improves the defects of failure in rapid positioning of UV glue, low initial strength of the hot melt polyurethane sealant and the like, rapid positioning can be realized, the hot melt polyurethane sealant can achieve higher strength in a short time, and the hot melt polyurethane sealant can be used for bonding of appliances, furniture, electronic components and the like.

Description

Technical field [0001] The invention belongs to the technical field of hot melt adhesive preparation, and in particular relates to a method for preparing a light / moist dual-curing polyurethane hot melt adhesive. Background technique [0002] Reactive polyurethane hot melt adhesive (Hot melt polyurethane sealant) is a hot melt adhesive with polyurethane prepolymer as the main component. This type of hot melt adhesive has the advantages of high tensile strength, excellent elasticity, abrasion resistance, oil resistance and cold resistance. It is widely used in buildings, squares and highways as caulking sealing materials, as well as automobile manufacturing and glass installation , Electronic filling, submarine and rocket sealing. However, the curing speed of existing polyurethane hot-melt adhesives is slower than that of fast-drying adhesives. After construction, it often takes a long time (generally curing at room temperature for 1-3 days) to reach the final strength. The prolo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J175/14C09J11/06C08G18/79C08G18/76C08G18/75C08G18/67C08G18/48C08G18/42C08G18/12
Inventor 刘文涛王建斌陈田安解海华
Owner YANTAI DARBOND TECH
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