12results about How to "Reduce silver content" patented technology

The invention provides a preparation method of silver-coated copper powder, and relates to the technical field of metal materials, the preparation method comprises the following steps: simultaneously dropwise adding a first silver-ammonia solution and a first reducing agent solution into a dispersion liquid of deoiled and activated spherical copper powder, reacting for 5-20 minutes after dropwise adding is finished, then simultaneously dropwise adding a second silver-ammonia solution and a second reducing agent solution, and reacting for 5-20 minutes after the reaction is finished; and reacting for 25-40 minutes, filtering, washing with water, and drying to obtain the silver-coated copper powder. The concentration of the first silver-ammonia solution is higher than that of the second silver-ammonia solution. The silver-coated copper powder obtained through the preparation method is good in particle regularity and size uniformity, few in agglomeration phenomenon, good in oxidation resistance and low in resistivity.

The invention provides a solar photovoltaic cell printing method and a silver paste preparation method, and relates to the technical field of cell printing, and the method comprises the steps: printing corrosion contact silver paste on the surface of a cell to form a grid line; drying the battery piece printed with the corrosion contact silver paste; overprinting low-solid-content conductive welding silver paste on the grid lines; and sintering and overprinting the battery piece of the low-solid-content conductive welding silver paste. The corrosion contact silver paste corrodes silicon nitride and a doping layer on the surface of the battery piece, so that good contact is formed between the corrosion contact silver paste and the surface of the battery piece, and grid lines are stably reserved on the surface of the battery piece; the low-solid-content conductive welding silver paste is overprinted on the grid lines, so that the cell has a good electron collection function and is used as a welding material in a subsequent solar module section; and the effects of the two silver pastes are mutually compensated, so that the efficiency of the printed battery piece is kept unchanged. The silver content of the low-solid-content conductive welding silver paste is low, the total consumption of silver of the two kinds of silver paste is reduced, and the effects of reducing cost and improving efficiency are achieved.

The invention belongs to the technical field of conductive adhesives, and particularly relates to an ultralow-hardness silver-copper conductive adhesive and a preparation method thereof. The ultralow-hardness silver-copper conductive adhesive comprises the following components in parts by weight: 50-100 parts of liquid silicone rubber, 30-80 parts of a diluent, 1-10 parts of a chain extender, 0.1-5 parts of a heat-resistant agent, 0.1-5 parts of a coupling agent, 0.1-5 parts of an inhibitor and 100-400 parts of conductive filler. The shielding performance of the ultralow-hardness silver-copper conductive adhesive can reach 100 dB, the tensile strength is larger than 1 Mpa, the volume resistivity is smaller than 0.005 ohm.cm, and the hardness is smaller than 30 ShoreA. On the premise that the requirements of products for mechanical strength and shielding effectiveness are met, the ultralow-hardness silver-copper conductive adhesive has lower product hardness, the internal stress of the adhesive to electronic components is greatly reduced, and market requirements are met.

The invention provides high-conductivity and low-silver-content low-temperature composite polymer conductive silver paste and a preparation method thereof, and belongs to the technical field of heterojunction solar cells, the preparation method comprises the following steps: adding polymer resin and a coupling agent into an organic solvent together, and mechanically stirring for 5-15 minutes at the temperature of 25-30 DEG C to obtain an organic carrier; the preparation method comprises the following steps: mixing polyhedral silver-coated copper powder, submicron spherical silver powder, flaky silver powder and an organic carrier, and mechanically stirring for 5-15 minutes at the temperature of 25-30 DEG C to obtain mixed silver paste; and S3, rolling the mixed silver paste through a three-roller mill to obtain the low-temperature composite polymer conductive silver paste with high conductivity and low silver content. According to the method, the low-temperature composite polymer conductive silver paste with high conductivity and low silver content can be prepared on the premise that a fusion welding additive is not needed.

The application discloses a low-cost high-strength aluminum-lithium alloy for a space cabin body and a preparation method thereof, and belongs to the technical field of aluminum-lithium alloys.The aluminum-lithium alloy comprises the following components in mass fraction: 91.5-94.5 parts of aluminum, 3.9-4.2 parts of copper, 1.0-1.5 parts of lithium, 0.2-1.0 parts of magnesium, 0.2-0.4 parts of silver, 0.3-0.8 parts of zinc, 0.10-0.12 parts of zirconium and 0.15-0.25 parts of mixed rare earth; the mixed rare earth is a mixed rare earth of cerium and lanthanum, and the mass ratio of cerium to lanthanum is (1.5-2.5):1; the total mass of metal impurities in the aluminum-lithium alloy is not more than 0.15 parts, and the single metal impurity is not more than 0.05 parts; through multi-component micro-alloying design and a precise controllable thermal mechanical treatment process, the application solves the technical problems that the existing aluminum-lithium alloy is high in cost due to the dependence on high-content noble metals and is anisotropic in mechanical properties due to strong deformation texture, and provides an ideal material which is excellent in comprehensive performance and economically feasible for a space cabin structure.

The application provides a low-resistance high-temperature-resistant conductive adhesive as well as a preparation method, a use method and a photovoltaic module thereof, and relates to the technical field of electronic packaging materials. The low-resistance high-temperature-resistant conductive adhesive comprises, calculated based on the total mass of raw materials of the low-resistance high-temperature-resistant conductive adhesive as 100%, 45-60% of silver-coated ceramic powder, 10-20% of nano silver wire, 1-2% of silicon carbide whisker, 20-30% of polyimide resin and 0.1-0.5% of antioxidant. The base material of the polyimide resin is acetylene-terminated polyimide. The antioxidant comprises BHT. The conductive adhesive provided by the application can enable the material to maintain stable conductive performance and mechanical strength after long-term high-temperature aging, and is suitable for application scenarios such as photovoltaic modules which have strict requirements on weather resistance.

The present invention relates to the technical field of H01B1 / 16, and specifically to a PERC crystalline silicon solar back side silver paste and a preparation method thereof. The silver paste comprises a silver powder paste combination, a mixed metal oxide paste and an inorganic auxiliary agent paste. The silver powder paste combination comprises a silver powder paste with a D50 of 50nm-1μm. By optimizing the back side silver paste formula, the silver content of the back side electrode silver paste for the PERC crystalline silicon solar cell is effectively reduced to 48-52% (weight percentage), thereby reducing the material cost of a cell sheet while ensuring the photoelectric conversion efficiency and welding performance of the cell sheet.

The present invention belongs to solar cell material technology, and specifically relates to a conductive paste for a battery and a preparation method thereof, comprising the following raw materials in parts by weight: 0.5-3 parts of modified epoxy resin, 0.5-3 parts of hyperbranched epoxy resin, 0.5-2 parts of multifunctional epoxy resin, 0.5-1.2 parts of curing agent, 0.5-4 parts of organic solvent, 0.1-0.5 parts of surface additive, 0.1-1 parts of thixotropic agent, 50-70 parts of silver-nickel-copper powder, and 10-30 parts of high-brightness silver powder. The conductive paste prepared by the present invention has the characteristics of low-temperature curing, low cost, and high adhesion, can effectively reduce the silver content, reduce costs, and can effectively promote the cost reduction requirements of HIT batteries.

The application belongs to the technical field of conductive materials, and particularly relates to silver-coated copper powder based on copper powder pretreatment and a preparation method thereof. The preparation method is characterized in that the method comprises the following steps: (1) after the copper powder is laid flat, the copper powder is placed in a tube furnace, heated to a target temperature, air is introduced, heat preservation is performed, and cooling to room temperature is performed to complete the oxidation treatment of the copper powder; (2) a reducing agent, a complexing agent, a dispersing agent, a brightener and deionized water are stirred and mixed uniformly to prepare a reducing solution; then the copper powder after the oxidation treatment is added to the reducing solution, and continuous stirring is performed to obtain a copper powder-containing reducing solution; (3) silver nitrate solution is added to the copper powder-containing reducing solution, temperature is maintained, stirring is performed, and separation, washing and drying are performed to obtain the silver-coated copper powder based on the copper powder pretreatment. The silver-coated copper powder prepared by the application has good coating effect, so that the silver shell is uniformly distributed on the surface of the copper powder in the nucleation stage, thereby ensuring the uniform and dense coating of the silver shell.

The present disclosure relates to a kind of active solder paste composition for ceramic copper clad, ceramic copper clad method and copper clad ceramic, with the total weight of active solder paste composition as basis, active solder paste composition contains 1-20wt% first metal powder, 75-94wt% second metal powder and the balance of flux;Wherein, first metal powder contains titanium hydride, and second metal powder contains copper phosphorus silver alloy.The active solder paste composition provided by the present disclosure not only can reduce the silver content, but also can reduce the welding temperature, while also increasing the connection strength of Ti and Cu, increase the welding strength, so that material is not easy to occur segregation.

The application discloses a solar cell, a seed layer structure and a preparation method thereof and a photovoltaic module, and belongs to the photovoltaic technical field. The solar cell comprises a bottom silver-rich area, an intermediate transition area and a surface copper-rich area; the silver content of the bottom silver-rich area is greater than or equal to 75at%; the porosity of the bottom silver-rich area is less than or equal to 10%; the intermediate transition area comprises a silver-copper eutectic phase; the copper content of the surface copper-rich area is greater than or equal to 45at%; and the porosity of the surface copper-rich area is 20% to 50%. The seed layer can greatly reduce the silver content compared with a conventional pure silver seed layer, and can significantly reduce the material cost under the premise of ensuring the electrical performance; in addition, the seed layer structure has the transition structure of the bottom silver-rich area, the intermediate transition area and the surface copper-rich area, and is more conducive to improving the interface bonding strength, reducing the contact resistance and improving the photoelectric effect of the solar cell compared with the pure silver seed layer.

The invention provides an AgMeO composite Cu strip and application thereof in an organic matter type thermal fuse, the AgMeO composite Cu strip is a strip which is formed by extruding an AgMeO composite Cu spindle and has an overall structure of AgMeO / Cu / AgMeO, the AgMeO composite Cu strip comprises a middle layer and a surface layer arranged on the surface of the middle layer, the surface layer is made of AgMeO, the middle layer is made of Cu, and Me comprises Cu. The strip with the Cu layer in the middle is adopted to replace an AgMe or AgMeO strip, the proportion of the Cu in the middle can reach 50%-90%, and the minimum thickness of the upper AgMeO layer and the lower AgMeO layer can reach 0.005 mm, so that the overall silver content of the strip can be reduced to about 11%, the usage amount of precious metal is greatly reduced, and the material cost is reduced; and meanwhile, an Ag layer is not needed in the middle, the bonding strength of the AgMeO layer and the Cu layer can be guaranteed by directly adopting an extrusion silver compounding mode, and the use of precious metal is further reduced.