4results about How to "Reduce silver content" patented technology

The application discloses a low-cost high-strength aluminum-lithium alloy for a space cabin body and a preparation method thereof, and belongs to the technical field of aluminum-lithium alloys.The aluminum-lithium alloy comprises the following components in mass fraction: 91.5-94.5 parts of aluminum, 3.9-4.2 parts of copper, 1.0-1.5 parts of lithium, 0.2-1.0 parts of magnesium, 0.2-0.4 parts of silver, 0.3-0.8 parts of zinc, 0.10-0.12 parts of zirconium and 0.15-0.25 parts of mixed rare earth; the mixed rare earth is a mixed rare earth of cerium and lanthanum, and the mass ratio of cerium to lanthanum is (1.5-2.5):1; the total mass of metal impurities in the aluminum-lithium alloy is not more than 0.15 parts, and the single metal impurity is not more than 0.05 parts; through multi-component micro-alloying design and a precise controllable thermal mechanical treatment process, the application solves the technical problems that the existing aluminum-lithium alloy is high in cost due to the dependence on high-content noble metals and is anisotropic in mechanical properties due to strong deformation texture, and provides an ideal material which is excellent in comprehensive performance and economically feasible for a space cabin structure.

The application provides a low-resistance high-temperature-resistant conductive adhesive as well as a preparation method, a use method and a photovoltaic module thereof, and relates to the technical field of electronic packaging materials. The low-resistance high-temperature-resistant conductive adhesive comprises, calculated based on the total mass of raw materials of the low-resistance high-temperature-resistant conductive adhesive as 100%, 45-60% of silver-coated ceramic powder, 10-20% of nano silver wire, 1-2% of silicon carbide whisker, 20-30% of polyimide resin and 0.1-0.5% of antioxidant. The base material of the polyimide resin is acetylene-terminated polyimide. The antioxidant comprises BHT. The conductive adhesive provided by the application can enable the material to maintain stable conductive performance and mechanical strength after long-term high-temperature aging, and is suitable for application scenarios such as photovoltaic modules which have strict requirements on weather resistance.

The present disclosure relates to a kind of active solder paste composition for ceramic copper clad, ceramic copper clad method and copper clad ceramic, with the total weight of active solder paste composition as basis, active solder paste composition contains 1-20wt% first metal powder, 75-94wt% second metal powder and the balance of flux;Wherein, first metal powder contains titanium hydride, and second metal powder contains copper phosphorus silver alloy.The active solder paste composition provided by the present disclosure not only can reduce the silver content, but also can reduce the welding temperature, while also increasing the connection strength of Ti and Cu, increase the welding strength, so that material is not easy to occur segregation.

The application discloses a solar cell, a seed layer structure and a preparation method thereof and a photovoltaic module, and belongs to the photovoltaic technical field. The solar cell comprises a bottom silver-rich area, an intermediate transition area and a surface copper-rich area; the silver content of the bottom silver-rich area is greater than or equal to 75at%; the porosity of the bottom silver-rich area is less than or equal to 10%; the intermediate transition area comprises a silver-copper eutectic phase; the copper content of the surface copper-rich area is greater than or equal to 45at%; and the porosity of the surface copper-rich area is 20% to 50%. The seed layer can greatly reduce the silver content compared with a conventional pure silver seed layer, and can significantly reduce the material cost under the premise of ensuring the electrical performance; in addition, the seed layer structure has the transition structure of the bottom silver-rich area, the intermediate transition area and the surface copper-rich area, and is more conducive to improving the interface bonding strength, reducing the contact resistance and improving the photoelectric effect of the solar cell compared with the pure silver seed layer.