196results about How to "Does not affect electrical performance" patented technology

The invention discloses a lithium ion phosphate positive electrode material of a nanometer core shell structure. The positive electrode material is provided with an inner core active material and a conductive outer shell structure; a conductive agent is an outer shell material; the active material is of an inner core structure; and the structure formula of the inner core active material is LiFe[1-x]MxP[1-y]AyO4, wherein x is greater than or equal to 0, y is less than or equal to 0.1, M is a transition metal element, and A is silicon. Additionally, the invention also discloses a preparation method of the lithium ion phosphate positive electrode material. According to the preparation method in the invention, a porous material is adopted as a synthesis microreactor, and a lithium ion phosphate precursor is loaded and filled in holes, namely, the inner core active precursor reversely wraps a porous precursor so as to form a special nanometer core shell structure, thus the topography granularity of primary granule is controlled; and the lithium ion phosphate positive electrode material of the nanometer core shell structure is prepared by adopting a liquid phase mixed material and solid phase sintering technology. According to the invention, on the premise that the electrical performance of the positive electrode material is not influenced, a nanometer core shell structured active substance with uniform and controllable topography and granularity is synthesized; and the preparation method disclosed by the invention has lower technology, devices and control costs, which is beneficial to large-scale production.

The invention discloses a thermoplastic low-smoke halogen-free flame-retardant environment-friendly sheath material for power cables and a preparation method thereof. The thermoplastic low-smoke halogen-free flame-retardant environment-friendly sheath material for power cables comprises the following components in parts by weight: 60-80 parts of EVA (ethylene-vinyl acetate), 20-30 parts of HDPE (high-density polyethylene), 10-15 parts of EPDM (ethylene-propylene-diene monomer), 15-25 parts of compatiblizing agent, 100-150 parts of halogen-free flame retardant, 0.5-1 part of antioxidant 1035, 0.5-1 part of antioxidant DSTP, 1-2 parts of ethylene bis stearamide, 3-5 parts of DCP (dicumyl peroxide), 2-4 parts of zinc oxide, 1-2 parts of calcium stearate, 10-20 parts of dimethyl methyl phosphonate, 30-40 parts of nano kaolin, 2-3 parts of stearic acid and 0.5-1 part of isopropyl tri(dioctylpyrophosphate)titanate. The sheath material disclosed by the invention has the advantages of excellent physical and mechanical properties, excellent flame retardancy, favorable high / low temperature resistance, favorable oil resistance, favorable solvent resistance, favorable wear resistance, favorable ozone resistance, favorable aging resistance, high flexibility, crack resistance and the like, is very durable, environment-friendly and pollution-free, and can completely satisfy the requirements for modern power cables.

The invention discloses an anti-discoloring protective agent for silver plating and a preparation method as well as application method thereof. The anti-discoloring protective agent for silver plating comprises the following components in parts by weight: 5-20 parts of film forming matter, 1-5 parts of auxiliary film forming matter, 3-12 parts of organic inhibitor and 55-90 parts of dispersing agent. The preparation method of the anti-discoloring protective agent comprises the following steps of: putting the film forming matter, the auxiliary film forming matter and the organic inhibitor into the dispersing agent, stirring for fully dissolving, and uniformly mixing. The application method of the anti-discoloring protective agent comprises the following steps of: dissolving the anti-discoloring protective agent for silver plating in water, wherein the dosage is 50ml / L; keeping the temperature at 42-55 DEG C; and immersing a silver plating workpiece into the anti-discoloring protective agent for 1-3 minutes. The anti-discoloring protective agent for silver plating has the advantages of obvious oxidation resistance / vulcanization resistance, simple technological operation, strong wear resistance and the like, is easy in workpiece cleaning, is harmless to the environment, and basically has no influence on the electrical performance of a plating.

The invention relates to a self-aligned multi-patterning mask layer and a formation method thereof. The formation method comprises the following steps that: a semiconductor substrate is provided and a to-be-etched material layer is formed at the surface of the semiconductor substrate; a sacrificial material layer is formed at the surface of the to-be-etched material layer; etching is carried out on the sacrificial material layer to form a sacrificial layer, wherein the dimension of the portion, approaching the to-be-etched material layer, of the sacrificial layer is smaller than that of the portion, far away from the to-be-etched material layer, of the sacrificial layer; and a side wall is formed at the surface of the side wall of the sacrificial layer, wherein the portions of the two sides of the side wall are inclined towards the middle portion of the side wall from a position at the surface of the to-be-etched material layer to a position far away from the surface of the to-be-etched material layer. Because the portions of the two sides of the side wall are inclined towards the middle portion of the side wall and the profile shapes of the portions of the two sides of the side wall are identical with each other, the shapes of side walls of the to-be-etched material layer formed by etching by using the side wall as the mask subsequently are identical, so that the electrical performance of the semiconductor device that is formed subsequently is not influenced.

The invention belongs to the technical field of solar batteries and particularly discloses a conductive paste for a solar battery. The conductive paste comprises an organic carrier and solid powder dispersed in the organic carrier, wherein the solid powder comprises conductive silver powder and glass powder; the conductive silver powder is flaked silver powder; and the conductive silver powder accounts for 92 to 99 weight percent of the solid powder and accounts for 35 to 60 weight percent of the conductive paste. The conductive paste overcomes the prejudice of technicists in the field on lowsilver content and low electric performance, and higher electric performance can be achieved by reducing the silver content in the conductive paste; furthermore, the conductive paste for the solar battery has low silver content and moderate viscosity, and is favorable for screen printing, and attractive in appearance without sand holes, pinholes and the like after being sintered; compared with the common silver paste having higher silver content, the conductive paste has the advantage that the solar battery prepared from the conductive paste has high photoelectric conversion efficiency and the photoelectric conversion efficiency of a monocrystalline silicon piece is more than 17.50 percent.

The invention relates to an improved method for manufacturing a solid electrolyte / aluminum electrolytic capacitor. The method comprises the following steps: 1, electrolytic papers between an anode formation aluminium foil and a cathode foil are reeled to form core bags, wherein the cathode foil faces outwards and wraps the electrolytic papers, a high-temperature rubber belt is used for clinging and fixing both in a ring manner, and sealing rubber covers are mounted on the core bags; 2, the core bags are immersed into formation liquid to be subjected to repair processing, and the repaired core bags are subjected to carbonization processing, wherein the step 2 is repeated about 2-10 times; 3; the core bags are immersed into the formation liquid again to be subjected to formation and repair processing; 4, the carbonized core bags are immersed into an oxide-film protection liquid and then are dried at the temperature of 50-150 DEG C; and 5, firstly, the core bags are respectively placed into monomers and oxidant for immersion and heating convergence, then the processed core bags are mounted in an aluminum shell and a sealing procedure is performed, and lastly, the produced products are subjected to ageing processing.

The invention relates to the field of oil paint chemical engineering and especially relates to organic silicon impregnating varnish, and a preparation method and an application thereof. The organic silicon impregnating varnish is acquired through the hydrolytic condensation of silane monomers and is further acquired through the hydrolytic condensation of the silane monomers containing full alkoxy. The pure resin type organic silicon impregnating varnish not only has the advantages of excellent insulating properties, such as, high heat resistance, hydrophobic property, pressure-withstanding anti-corona property, and the like, and environmental protection, but also has the advantages of excellent adhesive force and bonding strength to the impregnated substrates, so that the phenomena of cracking and insulating painting falling caused by vibration of machinery (such as, high-speed running locomotive, mining machinery, wind power generation equipment, and the like) and heat effect are resisted and avoided.

The invention discloses an addition type silicone adhesive composition and a preparation method thereof. The addition type silicone adhesive composition comprises (A) 60 to 100 mass parts of organopolysiloxane, (B)1 to 10 mass parts of substance obtained by reacting Si-H groups in the organopolysiloxane with hydroxyls in hydroxy ethyl acrylate or hydroxy propyl methacrylate; (C) 1 to 50 mass parts of gaseous-phase silica, (D) 0.001 to 0.01 weight parts of alkyne inhibitor, and (E) 0.1 to 2 mass parts of platinum catalyst, wherein the content of platinum atoms is 5-2,000ppm; and the preparation method of the addition type silicone adhesive composition comprises the following steps: uniformly mixing the (A), (C) and (D) in vacuum, then sequentially adding (B) and (E) to carry out vacuum defoamation, and solidifying the obtained mixture for 5 to 60 minutes at the temperature of between 80 and 210 DEG C.

The invention relates to a manufacturing method of a phase-changing random access memory, comprising the following steps: providing a semiconductor substrate at least provided with a memory region, a peripheral circuit region and a plurality of polysilicon plugs connected with the memory region and the peripheral circuit region; etching the polysilicon plugs; performing ion implantation to the polysilicon plugs; filling a sacrifice electrolyte layer on a vertical diode; removing the sacrifice electrolyte layer filled on the vertical diode in the peripheral circuit region; removing the vertical diode of the peripheral circuit region; forming metallic plugs in plug holes of the peripheral circuit region; removing the sacrifice electrolyte layer in the plug holes in the memory region; and filling the phase-changing memory material in the plug holes in the memory region. Compared with the prior art, the plug hole in the memory region are filled by the sacrifice electrolyte layer, so, in the manufacturing process of the device, the metallic plugs cannot form in the plug holes in the memory region, thereby conquering the problem of short circuit. etc caused by the residual metal when removing the metallic plugs in the plug holes in the memory region.

The invention belongs to the technical field of radar antennas, in particular to a real-time adjustment method for a double-reflecting surface antenna shape surface based on the best fitting. According to the real-time adjustment method for the double-reflecting surface antenna shape surface based on the best fitting, a laser measuring device is installed on the back surface of a secondary reflecting surface, and the surface shape of a main reflecting surface is measured from the position of the secondary reflecting surface. The pose matching of the secondary reflecting surface is realized while realizing the surface shape detection of the main reflecting surface, and the real-time adjustment method is applicable to a non-active main reflecting surface antenna and an active main reflectingsurface antenna. On the premise that it is ensured that a measuring system does not affect the antenna electrical performance, the real-time adjustment of the antennas during service can be realized,and the formative factor of antenna deformation is not required to be considered. The real-time adjustment method for the double-reflecting surface antenna shape surface based on the best fitting issuitable for gravity load, steady-state wind load, slowly-changing temperature load and processing and installation errors, and is applied to the real-time adjustment of the shape surface of the largedouble-reflecting surface antenna during service.

The invention provides a semiconductor structure and a forming method thereof. The forming method comprises the following steps of: providing a semiconductor substrate; forming a first dielectric layer on the surface of the semiconductor substrate; forming a metal blocking layer on the surface of the first dielectric layer; forming a metal adhesion layer made of NDC (Naphthalene Dicarboxylate) materials on the surface of a metal diffusion layer; sequentially carrying out Ar ion and oxygen ion bombardment on the surface of the metal adhesion layer; and forming a second dielectric layer on the surface of the metal adhesion layer. A compact oxide film can be formed on the surface made of NDC materials, so that the surface stress is reduced, the adhesivity between the NDC materials and the adjacent dielectric layers is improved, and meanwhile, the electrical performance of the device cannot be influenced.

The invention relates to an epoxy resin glue liquid, a laminate used for a printing circuit board manufactured by adopting the glue liquid as well as a manufacture method thereof. In the epoxy resin glue liquid, every 100 portions of epoxy resins are added with 2.5 to 20 portions of talcum powder; besides, the talcum powder meets a molecular formula of 3MgO.4SiO2.H2O; simultaneously the largest size of the talcum powder is required to be less than 40microns. The laminate manufactured by using the glue liquid is simply manufactured, has excellent drilling performance and is conveniently drilled. The laminate also has an excellent electric performance; the heat expansion coefficient of the epoxy resin on the Z direction is lower and the circuit failure rate is low, thus being suitable for the printing circuit board; besides, the manufacture cost of the laminate is lower when the talcum powder is used as inorganic fittings.

The invention discloses a polyimide / polytetrafluoroethylene composite membrane for the insulation of electric wires and cables and a preparation method thereof. The preparation method comprises the following steps of firstly preparing a surface modified molecular sieve; then preparing a polyamic acid (PAA) / molecular sieve composite solution, and preparing the polyamic acid / molecular sieve composite solution into a polyimide / molecular sieve composite membrane; then coating the prepared polytetrafluoroethylene / molecular sieve complex liquid on both surfaces of the membrane to obtain the polyimide / polytetrafluoroethylene composite membrane for the insulation of the electric wires and the cables. The polyimide / polytetrafluoroethylene composite membrane disclosed by the invention has good adhesion of polyimide and polytetrafluoroethylene and solves the problem of poor adhesion between a polytetrafluoroethylene coating and other base bodies; the polyimide / polytetrafluoroethylene composite membrane for the insulation of the electric wires and the cables, which is disclosed by the invention, has the advantages of excellent mechanical property and good insulating property, can normally work in a humid environment with electrical property which is not affected under the condition that the polytetrafluoroethylene coating is damaged and has the characteristic of low dielectric constant.

The invention discloses a method for preparing a color solar cell with a pattern. By the preparation method provided by the invention, any pattern can be manufactured on a part of the surface of the color solar cell; and the preparation method is simple and closely combined with a conventional production process to rapidly realize industrialization. The color solar cell prepared by the method canavoid electrical property loss. By the method, a required pattern can be randomly drawn on the color solar cell to satisfy different needs and expand the application fields of the color solar cell. The color solar cell, manufactured by the method, with the pattern has a simple structure, distinctive characteristics, the delicate pattern and good energy saving and environmental protection effects,is applicable as an ornament and meets different using demands.

The invention relates to an efficient organic light-emitting diode and a manufacturing method of the efficient organic light-emitting diode. The efficient organic light-emitting diode is of a microcavity structure. The efficient organic light-emitting diode structurally comprises a substrate, a metal anode, a hole injection layer, a hole transmission layer, an electron transfer layer / light-emitting layer and an electron injection layer / metal cathode from bottom to top in sequence. The microcavity structure is formed by bimetallic electrode aluminum, by the adoption of the optical microcavity of the structure, efficient organic light-emitting devices can be manufactured both in a top light-emitting component structure and a bottom light-emitting component structure, and the luminescent spectrum can be narrowed. Or the efficient organic light-emitting diode structurally comprises the substrate, the metal cathode / electron injection layer, the electron transfer layer / light-emitting layer, the hole transmission layer, the hole injection layer and the metal anode from bottom to top in sequence. Due to the fact that the bimetallic electrode structure is adopted by the optical microcavity, the efficient organic light-emitting diode is obtained through the microcavity effect, and the characteristic of higher spectrum color purity is shown at the same time.

The invention discloses a die bonding material for LED encapsulation and a preparation method thereof. The die bonding material comprises tin-based soldering powder, high-thermal-conductivity particles and die-bonding solder paste, wherein the high-thermal-conductivity particles include one or two substances selected from diamond particles, carbon nanotubes and SiC, and the volume of the high-thermal-conductivity particles accounts for 0.1-70% of the total volume of the tin-based soldering powder and the high-thermal-conductivity particles. As the die bonding material of the invention contains the high-thermal-conductivity particles, high thermal conductivity can be achieved on the premise of meeting the bonding strength between an LED chip and a heat sink and not affecting the electrical performance, and the thermal conductivity is several times or even dozens of times that of the existing LED die bonding solder. By adopting the die bonding material of the invention, the thermal resistance of power LED devices is reduced effectively, the heat dissipation capacity of LED chips is improved, the junction temperature of LED chips is reduced, and the service life of LED devices and application products is increased.

The embodiment of the invention discloses a method for printing a pattern on a solar battery sheet, comprising the steps of: printing a back electrode and a back electric field; arranging a pattern at a place corresponding to a main grid line on a positive electrode screen, wherein the pattern is spaced from two side edges of the main grid line at a certain distance; printing a positive electrode and printing a hollow pattern corresponding to the pattern at the main grid line of the positive electrode; drying the positive electrode; and carrying out sintering. Another method disclosed by the embodiment of the invention comprises the steps of: printing a back electrode and a back electric field; printing a positive electrode and drying the positive electrode; carrying out sintering; and arranging a pattern on a main grid line of the positive electrode. The target of the pattern arrangement is the main grid line and the electric property of the solar battery sheet is not influenced if the main grid line is not cut off by the pattern, so that the aim of arranging a mark on the solar battery sheet is realized under the conditions of not increasing the shading area and not influencing the current transmission.

The invention is minim germanium straight silicon single crystal, it includes phosphor, or boron, or arsenic or antimony whose thickness is 1x10 to the power 13 -1x10 to the power 21 cm to the power 3, and germanium whose thickness is 1x10 to the power 3 -1x10 to the power 20 cm to the power -3. The silicon single crystal has minium germanium, the most outer electron number of germanium is 4, the samke to silicon, so it doesn't affect the electrically performance of silicon, takes advantage of germanium and point bug effect, the primary micro-bug of silicon single crystal can be restrained, especially the cavity bug. It can enhance the quality and product rate effectively and decrease the product cost.

The invention discloses a double-body composite ceramic antenna cover body and a preparation method thereof. The preparation method of the double-body composite ceramic antenna cover body includes the first step of preparation of a fiber preform, the second step of preprocessing of the fiber preform, the third step of impregnating and compositing of the fiber preform, the fourth step of high-temperature sintering of an initial blank, the fifth step of impregnating and compositing of a middle blank, the sixth step of high-temperature pyrolysis of a cover blank and the seventh step of machining and forming. According to the double-body composite ceramic antenna cover body, quartz fiber bundles serve as reinforcing bodies, silicon dioxide and silicon nitride serve as double bodies, ablation resistance and high temperature resistance of the antenna cover body can be effectively improved, cost is low, and the preparation period is short.

The invention belongs to the technical field of PCB manufacture and is to provide a ceramic circuit board with a plated through hole and a manufacturing method thereof. The ceramic circuit board comprises a ceramic substrate. The ceramic substrate is provided with at least one connection through hole through laser; then, each connection through hole is filled with metal slurry; after high-temperature solidification, the metal slurry forms metal columns, so that metallization of each connection through hole is realized; the holes do not have chemical liquid, thereby ensuring reliability of theceramic circuit board and avoiding the defect of existence of holes in the through holes in the conventional electroplating hole filling process; and by carrying out mechanical polishing on the metalcolumns protruding on upper and lower surfaces of the ceramic substrate and then, carrying out magnetron vacuum sputtering on at least one surface of the ceramic substrate to form a metal layer group,and since the metal layer group can be firmly combined with the ceramic substrate, and the magnetron vacuum sputtering technique can control the thickness well, the ceramic substrate is suitable forpreparing a fine ceramic circuit board, and the ceramic circuit board can take both fine production and high reliability into considerations.

The invention belongs to the field of liquid crystal display, and particularly relates to a liquid crystal display device and a backlight module. The backlight module includes a lamp strip, a light strip heat sink and a light guide plate, wherein an opto-coupling distance is arranged between the lamp strip and the light guide plate; and the backlight module further includes a controller used for controlling the opto-coupling distance, wherein a through hole is arranged in the lamp strip, the controller penetrates the through hole, the controller is arranged on the light strip heat sink, and the light strip heat sink provides the fixing force for controlling the position of the light guide plate. In the backlight module, the controller used for controlling the opto-coupling distance is not arranged on the lamp strip, but on the light strip heat sink, so that the fixing force for controlling the position of the light guide plate is not born by the lamp strip any longer, and is transferred onto the lamp strip heat sink; and the lamp strip is an aluminum extrusion profile with certain thickness and high strength, and can bear larger fixing force, therefore, the lamp strip is not influenced by external force any longer, is prevented from deformation easily, and avoids influence on electric properties.

The invention provides a light trapping structure for a thin film solar cell and a manufacturing method thereof. The light trapping structure is formed by a micro lens array (1), a micro lens array substrate (2), a reflecting film layer (4) with microhole arrays and a reflection lens (5). The positions of the microhole arrays of are in one to one correspondence with the positions of the focuses of the micro lens array (1) and are coincide with the positions of the focuses of the micro lens array (1). A cavity (6) is formed between the reflecting film layer (4) with the microhole arrays and the reflection lens (5). Sunlight is focused through the micro lens array and then is cast into the cavity through the micro lens array, multiple times of reflection are formed between the reflecting film layer with the microhole arrays and the reflection lens, and thus the light trapping of the sunlight is realized. A thin film solar cell is placed in the cavity, thus the absorption enhancement of the sunlight can be realized, and the photoelectric conversion efficiency is raised. The light trapping structure has the advantages of simple structure, high light energy utilization rate and good compatibility, and the light trapping structure can be widely used in various types of thin film solar cells and has a broad application prospect in the research aspect of the thin film solar cell.

The invention relates to the field of diesel vehicle tail gas emission monitoring and discloses a vehicular tail gas emission diagnosis and remote monitoring method. The method includes steps: readinginformation of operating conditions of a vehicular engine, information of each ECU controller of a vehicular body, information of a vehicular sensor and information of operating conditions of vehicular own after-treatment products; reading vehicular real-time geographical location information; uploading the information of the operating conditions of the vehicular engine, the information of each ECU controller of the vehicular body, the information of the vehicular sensor, the information of the operating conditions of the vehicular own after-treatment products and the vehicular real-time geographical location information into a monitoring system platform, and storing in the monitoring terminal. The invention further provides a cloud server based vehicular tail gas emission diagnosis and remote monitoring terminal. Problems of high labor consumption and failure in uniform and comprehensive inspection and performance tracking in diesel vehicle tail gas emission inspection in the prior art are solved.

The invention provides a three-dimensional array of fixed multi-beam helical antenna. The three-dimensional array of fixed multi-beam helical antenna comprises helical antenna units and a frustum structure. The frustum structure comprises a top face and a plurality of lateral faces. The upper ends of the lateral faces are connected with the edge of the top face, the lateral sides of adjacent lateral faces are connected with each other, and the top face and the lateral faces are each provided with a helical antenna unit. The top face of the frustum structure is an equilateral polygon, and the lateral faces of the frustum structure are isosceles trapeziums. Each helical antenna unit is separated through a beam separating sheet, and the helical antennas in the helical antenna units are installed on a medium sheet. The helical antennas have the function of folding and unfolding, and are capable of realizing effective control over the screw pitches and the stiffness both of the helical antennas through a flexible support wire and a screw pitch fine adjustment device. By using the three-dimensional frustum structure to realize directional deflection of antenna beam, so that beams of airspace from a wide angle are covered without the need to use phase shift feed network. In addition, the beam separating sheet reduces cross coupling among the antenna units, and reduces the size of the frustum structure. The three-dimensional antenna array is all good in electricity property, cost and weight.

The invention discloses a flat plate array antenna for X frequency band, comprising a plurality of antenna array units. Each antenna array unit comprises a circularly-polarized cover, a tuning air cavity, a cross radiator slit, a waveguide mode type transmission cavity body, a square orthogonal mode coupler, a first strip line input terminal, and a second strip line input terminal. The tuning aircavity is disposed at the upper part of the cross radiator slit. Each slit of the cross radiator slit is arranged in a rotating manner at an interval of 90 D. The waveguide mode transmission cavity body is disposed at the lower part of the cross radiator slit. The square orthogonal mode coupler is disposed at the lower part of the waveguide mode transmission cavity body. The first strip line inputterminal is disposed at one side face of the square orthogonal mode coupler, and the second strip line input terminal is disposed at the other side face of the square orthogonal mode coupler, whereinthe two side faces are adjacent. The antenna array of the invention is advantageous in that efficiency is high, cross section is low, gain is high, wave beam is narrow, processing is easy.

An electronic package is provided, including: a substrate having opposite first and second surfaces; at least a first electronic element disposed on the first surface of the substrate; a first encapsulant encapsulating the first electronic element; at least a second electronic element and a frame disposed on the second surface of the substrate; and a second encapsulant encapsulating the second electronic element. By disposing the first and second electronic elements on the first and second surfaces of the substrate, respectively, the invention allows a required number of electronic elements to be mounted on the substrate without the need to increase the surface area of the substrate. Since the volume of the electronic package does not increase, the electronic package meets the miniaturization requirement.

The invention discloses a method for growing low defect concentration straight silicon single crystal. The step is: the multi-crystal silicon is put into the quartz crucible, and adds in high purity germanium, the temperature are increased to 1400deg.C - 1450deg.C under the protection of 100-10000G magnetism field and protection gas, the germanium are melted into multi-crystal silicon liquid, the mixing thickness of germanium in single crystal silicon is 110 to the power 10- 110 to the power 21 1 / cu cm, the invention can control and decrease the thickness of oxygen effectively through adjusting magnetism intensity, the germanium can restrain the protogenesis micro deficiency, especially the VOID deficiency, decrease the deficiency density.

The invention discloses an antenna pointing adjustment mechanism. The adjustment mechanism includes three rotating units. Every two rotating units are connected by an angle bracket and a round bracket to form a three-axis pointing mechanism. The three rotation axes intersect at the focus of the reflector. , where the second rotation unit rotates around the first rotation unit to generate the required azimuth angle, the third rotation unit rotates around the second rotation unit to generate the elevation angle, and the third rotation unit can adjust the polarization direction of the antenna, so The adjustment of the antenna beam can be realized by controlling these two rotation angles. The mechanism can be placed far away from the focal point, will not block the primary beam of the antenna and can avoid the feed array and waveguide feeder, simplify the feeding system, make the feed source fixed at the focal point, the reflector rotates around the focal point, and allow The reflector can be rotated over a wide range without affecting the electrical performance of the antenna; this advantage is even more pronounced for bias-fed antennas.

The invention discloses a water base cleaning solution for cleaning solar battery electronic paste. The water base cleaning solution comprises, by weight, 1-30% of emulsifying agent, 1-20% of penetrating agent, 0.5-10% of detergent, 0.1-10% of chelant, 0-30% of low alcohols and balanced ultrapure water. The invention further discloses a preparation method of the water base cleaning solution. The water base cleaning solution is even and stable aqueous solution, soft in properties, high in efficiency, environment-friendly, non-toxic, free of pungent smell, free of corrosiveness on equipment device, capable of clearly washing slurry pasted on the surface of a solid, simultaneously capable of reducing volatilization speed of an organic solvent in the slurry and low in cost.

A flexible low radiation window film formed by plural layers coated on transparent flexible base material, wherein the Ag(Au) film is silver alloy comprising Ag and doped 15-20 wt% of homogeneous distribution Au. the real time window film monitoring method comprises arranging a plurality of light-emitting diode emission-receiving transducers on the material collecting roller on the multiple target magnetron sputtering coiling film plating machine in cross direction, whose output signals are magnified by amplifier and converted into digital information, and sent to one-chip computer for comparing and processing, and connected to the upper position through the interfaces, the target power output is controlled thus realizing the real time control for the continuous layer's film thickness.