Epoxide-resin glue liquid, laminated board for printed circuit board manufactured by using the same and manufacturing method thereof

A technology of epoxy resin glue and printed circuit board, which is applied in the direction of printed circuit manufacturing, printed circuit, lamination auxiliary operation, etc., and can solve the problems of many inorganic fillers, wear cutting and punching tools, and reduce the electrical performance of the substrate.

Active Publication Date: 2009-03-04
VENTEC ELECTRONICS SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As mentioned above, the addition of inorganic fillers can bring advantages such as improving the toughness of the material and reducing costs, but the problem is that it may corrode and wear cutting and punching tools, and there are many requirements for inorganic fillers
And not all inorganic fillers can meet the above requirements, and because the inorganic fillers are not conductive, the electrical properties of the substrate are usually reduced after the addition of inorganic fillers. Inorganic fillers that do not degrade electrical properties

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] According to the formula of the epoxy resin glue liquid of present embodiment: epoxy resin (XU19704, Dow Chemical, Tg 170) 119g, ethylene glycol 27g, 2-methylimidazole 0.5g (hardening accelerator), dicyandiamide 1.0g, 50g of phenolic resin (XZ92535), 13g of talc powder (FS2500 of American Special Mining Company or AG609 of Liaoning Haicheng), among which, the maximum size of talc powder is guaranteed to be no more than 40 microns and the average size is about 20 microns before use.

[0033] Laminates are made as follows:

[0034] (1) Preparation of glue solution: at about 35°C, add a formula amount of epoxy resin, curing agent, coupling agent, curing accelerator, solvent and inorganic filler to the batching container, and stir evenly to prepare;

[0035] (2) Gluing: refers to immersing the adhesive tape in the above glue solution, and then baking the adhesive cloth soaked in the glue solution in an oven to make a prepreg, wherein the baking temperature is about 220°C;

...

Embodiment 2-

[0040] According to the formula of the epoxy resin glue solution of the present embodiment is basically the same as that of Example 1, the difference is that the talcum powder adopted is 10g Nytal 400, and the laminated board of 0.2mm made by this formula is tested by IPC, and the dielectric strength It is 625 volts / bar. The laminate had a chip loss rate of 1.25% when powder tested.

Embodiment 3

[0042] According to the formula of the epoxy resin glue solution of the present embodiment is basically the same as that of Example 1, the difference is that the talcum powder used is 7.5g Nytal 400 and 2.5g FS2500, and the 0.2mm laminate made by this formula is passed through IPC Tested, the dielectric strength is 678 volts / bar. The laminate had a chip loss rate of 1.23% when powder tested.

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Abstract

The invention relates to an epoxy resin glue liquid, a laminate used for a printing circuit board manufactured by adopting the glue liquid as well as a manufacture method thereof. In the epoxy resin glue liquid, every 100 portions of epoxy resins are added with 2.5 to 20 portions of talcum powder; besides, the talcum powder meets a molecular formula of 3MgO.4SiO2.H2O; simultaneously the largest size of the talcum powder is required to be less than 40microns. The laminate manufactured by using the glue liquid is simply manufactured, has excellent drilling performance and is conveniently drilled. The laminate also has an excellent electric performance; the heat expansion coefficient of the epoxy resin on the Z direction is lower and the circuit failure rate is low, thus being suitable for the printing circuit board; besides, the manufacture cost of the laminate is lower when the talcum powder is used as inorganic fittings.

Description

technical field [0001] The invention relates to an epoxy resin glue solution for making a laminate, and also relates to a laminate for a printed circuit board and a manufacturing method thereof. Background technique [0002] In 1988, McGraw-Hill Press edited the "Circuit Board Handbook" for the third time, writing that the commonly certified substrate types are FR-2 (phenolic paper base), FR-3 (epoxy paper base), FR-4 (epoxy glass cloth) and CEM-1 (epoxy paper base), but the outer reinforcement material of the inner adhesive layer is glass cloth), among these four substrates, FR-2 has the lowest cost, but its electrical properties and The physical properties are relatively poor. CEM-1 improves the electrical and physical properties of the material, but has the highest cost. Therefore, FR-4 is currently being studied more. [0003] The glass transition temperature of the epoxy resin substrate is high and the heat resistance is good, which is unmatched by many low Tg value ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K3/34C08K5/315C08J5/24B32B15/092B32B15/20B32B27/04B32B27/18B32B37/06B32B37/10B32B38/08B32B38/16H05K1/03H05K3/00
Inventor 钟健人彭代信王琢张建方王娟
Owner VENTEC ELECTRONICS SUZHOU
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