Electronic package and fabrication method thereof

Abstract

An electronic package is provided, including: a substrate having opposite first and second surfaces; at least a first electronic element disposed on the first surface of the substrate; a first encapsulant encapsulating the first electronic element; at least a second electronic element and a frame disposed on the second surface of the substrate; and a second encapsulant encapsulating the second electronic element. By disposing the first and second electronic elements on the first and second surfaces of the substrate, respectively, the invention allows a required number of electronic elements to be mounted on the substrate without the need to increase the surface area of the substrate. Since the volume of the electronic package does not increase, the electronic package meets the miniaturization requirement.

Description

technical field [0001] The invention relates to an electronic package, in particular to an electronic package with lightness, thinness and miniaturization and its manufacturing method. Background technique [0002] Due to the vigorous development of the electronic industry, most electronic products are developing toward the goal of miniaturization and high speed, especially the development of the communication industry has been widely used in various electronic products, such as mobile phones (Cell phone), laptop Type computer (laptop) and so on. [0003] At present, due to the miniaturization of electronic products and the increase in the demand for high operating speed, in order to improve the performance and capacity of a single semiconductor package to meet the needs of miniaturization of electronic products, the semiconductor package adopts multi-chip modularization (Multichip Module) It has become a trend to combine two or more chips in a single package to reduce the ...

AI Technical Summary

Problems solved by technology

[0005] However, in the existing semiconductor package 1, the surface of the substrate 10 needs to accommodate many semiconductor chips 11 and many passive components 12 at the same time, causing the surface area of ​​the substrate 10 to increase, thereby forcing the volume of the semiconductor package 1 to increase. Does not conform to the development trend of thin, light and short semiconductor packages

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