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111results about How to "Reduce the chance of fragmentation" patented technology

Ceramic substrate porous array picosecond laser galvanometer scanning drilling system and method

The invention provides a ceramic substrate porous array picosecond laser galvanometer scanning drilling system and method. The method comprises the steps that firstly a laser drilling route and a laser drilling technological parameter are arranged, during drilling, a station sliding table moves a hole to be drilled of a ceramic substrate to a drilling position, CCD vision identifies and positionsthe drilling position, and a galvanometer laser beam precisely drills the ceramic substrate layer by layer; meanwhile, smoke suction and protective gas are started, a cutting head automatically movesdown one layer of machining thickness for each layer machining until all the layers are machined; and then the station sliding table moves a workpiece to the next drilling position, repetition is carried out until all the holes in the ceramic substrate are drilled. According to the ceramic substrate porous array picosecond laser galvanometer scanning drilling system and method, cutting edges of the ceramic substrate are smooth, the roundness is good, the taper is small, the fragmentation probability is low, nearly no heat affected zone exists, the edges are not yellowed, nearly no damage is caused to the ceramic substrate, and the yield is greatly improved.
Owner:苏州优快激光科技有限公司

Model cutting device for mobile phone heat dissipating graphite sheet

The invention relates to a model cutting device for a mobile phone heat dissipating graphite sheet. The device comprises a first model cutting unit, a first waste discharging unit, a double-face adhesive tape laminating unit, a second model cutting unit, a single-face adhesive tape separating unit and a third model cutting unit which are sequentially arranged in the moving direction of a materialbelt. The graphite sheet laminated on single-face adhesive tape is formed in a model cutting manner in the first model cutting unit. After outer frame waste materials of the graphite sheet are discharged through the first waste discharging unit, in the double-face adhesive tape laminating unit, double-face adhesive tape with a release film and the graphite sheet are laminated, locating and punching are carried out in the second model cutting unit, and after single-face adhesive tape is discharged through the single-face adhesive tape separating unit, the third model cutting unit carries out punching on the double-face adhesive tape. Compared with the prior art, at first, the single-face adhesive tape serves as a material belt carrier, model cutting forming of the graphite sheet is achieved, then the release film serves as the material belt carrier, model cutting forming of the double-face adhesive tape is achieved, the fragmentation rate and the machining difficulty of the graphite sheet are reduced greatly, and the quality and the production efficiency of finished products are improved.
Owner:昊佰电子科技(上海)有限公司

Wafer thinning method

The invention discloses a wafer thinning method. The wafer thinning method is characterized by comprising the steps of providing a wafer to be thinned, trimming a wafer edge by laser, and removing a part of material at a round angle to form an arc chamfer angle; preparing a coating liquid, uniformly coating the coating liquid on a front surface of the wafer and the chamfer angle of the edge, baking and hardening to form a coverage layer, and fixing the front surface of the wafer and a substrate; performing first-time grinding on a back surface of the wafer, and performing first-time wet etching on the back surface of the wafer; performing second-time grinding on the back surface of the wafer; and performing second-time wet etching on the back surface of the wafer, making the wafer and thesubstrate separated, removing the coverage layer of the wafer, thereby obtaining the thinned wafer. The wafer thinning method employs a special protection process, the internal stress of the device generated during the wafer thinning process can be reduced, the front surface of the wafer can be prevented from being polluted by a mixture of particle generated during the wafer thinning process and cooling wafer, the breakage probability is reduced, the finished rate is improved, and the production cost is reduced.
Owner:广西桂芯半导体科技有限公司

Back structure of electron multiplying charge-coupled device (EMCCD) and production method of back structure

The invention relates to a back structure of an electron multiplying charge-coupled device (EMCCD) and a production method of the back structure. The back structure comprises an EMCCD chip, electrode extracting regions, a photosensitive region, a storage grain region, ion implanting regions, an antireflection film and a metal shielding layer, wherein the electrode extracting regions are arranged on two sides of the back side of the EMCCD chip; bonding graphs are arranged on the electrode extracting regions at intervals; the photosensitive region and the storage grain region on the back side of the EMCCD chip are positioned between the electrode extracting regions; the ion implanting regions formed by implanting low-energy ions are separately formed inside the photosensitive region and the storage grain region; by using the antireflection film on the surface of the photosensitive region, a standing wave effect can be reduced, and reflected light rays are reduced; by using the metal shielding layer on the surface of the storage grain region, transmission of incident light on the surface of the storage grain region can be prevented. The back structure disclosed by the invention can be used for improving the photoelectric conversion efficiency of the EMCCD; meanwhile, the manufacturing cost of the device also can be reduced, and the rate of finished products is improved.
Owner:NORTH ELECTRON RES INST ANHUI CO LTD

Crystalline silicon solar cell string splicing method and module

The technology of splicing two adjacent cells is adopted, the distance between the solar cells in the module is shortened, the blank in the module is reduced in the module packaging of the same specification, the use number of the cells is increased, and the conversion efficiency of the module is greatly improved; due to the use of a triangular welding strip on the front surface of the cell, the sunlight absorptivity of the crystalline silicon solar cell is effectively improved, and the short circuit current of the cell is improved; due to the adoption of a flat welding strip on the back surface of the cell, the stress of the adjacent cells during series connection is reduced, and the subfissure and fragmentation rate of the solar cells in series connection and lamination processes are reduced. In a word, when the method is used for packaging the crystalline silicon solar cell module, the method greatly reduces the stress generated by the heating of the cell in the packaging process ofthe module while improving the power, conversion efficiency and production efficiency of the module and reducing the preparation cost of the module, reduces the probability of subfissure and fragmentation, prolongs the life cycle of the crystalline silicon solar cell module, and improves the reliability of the module.
Owner:YELLOW RIVER PHOTOVOLTAIC IND TECH CO LTD +2

High-efficiency, long-life, low-coking and low-blocking regenerator

The invention belongs to the technical field of regenerators, in particular to a high-efficiency, long-life, low-coking and low-blocking regenerator. The high-efficiency, long-life, low-coking and low-blocking regenerator comprise a flue gas inlet pipeline, a regenerator wall and a flue gas outlet pipeline, and the flue gas inlet pipeline, the regenerator wall and the flue gas outlet pipeline arearranged in the same direction, wherein a container formed by the regenerator wall contains a large number of heat storage balls, the flue gas inlet area and the flue gas exhaust outlet area use the large-size heat storage balls, and the particle sizes of the heat storage balls in the middle of the regenerator gradually decrease in the flue gas flow direction. The design scheme that the particle sizes of the heat storage balls gradually decrease in the flue gas flow direction is adopted in the middle of the regenerator, the breaking probability of the heat storage balls caused by thermal stress can be greatly reduced, the service life of the heat storage balls is significantly prolonged, the cycle for replacing the heat storage balls during use of the regenerator is prolonged, the flue gas inlet pipeline, the regenerator wall and the flue gas outlet pipeline are arranged in the same direction, the restricted vertical staggering of the air intake and exhaust is not required in the technical scheme, and the high-efficiency, long-life, low-coking and low-blocking regenerator is more convenient for the staff to operate and use .
Owner:SUZHOU NORETA NEW MATERIAL TECH

Equipment and operation method for improving rapid thermal processing productivity of wafers

The invention discloses equipment and an operation method for improving the rapid thermal processing productivity of wafers. The equipment includes at least one processing procedure module, a base body, a front end control interface and a rear end control interface, wherein each processing procedure module includes at least one processing procedure cavity, a loading end, an unloading end, a mechanical arm and a cooling device; the loading end and the unloading end are combined-type cassettes used for accommodating multiple-piece graphite bearing plates in a layered manner; and the multiple-piece graphite bearing plates are provided with carving grooves, so as to load wafers of various sizes. The cassettes are designed to be the multiple-piece graphite bearing plates capable of accommodating and loading wafers, so that operation of the mechanical arm during the processing procedure is reduced, and rapid thermal processing for a plurality of wafers can be performed at the same time, the productivity in unit time can be greatly improved, the flexibility of the processing procedure and the compatibility of the equipment are improved, the time for processing procedure is saved, and the fragment probability of wafers is reduced.
Owner:PREMTEK INT

Anti-reflection and anti-explosion protective film of mobile phone glass view-window protective screen and preparation method of anti-reflection and anti-explosion protective film

The invention discloses an anti-reflection and anti-explosion protective film of a mobile phone glass view-window protective screen and a preparation method of the anti-reflection and anti-explosion protective film, relates to a protective film of the mobile phone glass view-window protective screen and a preparation method of the protective film, and aims to solve the problem that the light transmittance performance and the anti-explosion function of the anti-reflection and anti-explosion protective film of the mobile phone glass view-window protective screen are needed to be improved. The anti-reflection and anti-explosion protective film comprises a plastic basic layer, a first plastic layer, a reinforced glass film layer, a second plastic layer, an anti-explosion layer and a third plastic layer in sequence, wherein the polyethylene plastic basic layer is formed by film blowing and is prepared from low density polyethylene, linear low density polyethylene and metallocene medium density polyethylene. The high-light-transmittance-performance plastic basic layer is prepared by film blowing, so that the structure of the protective film is optimized, and the light transmittance rate of the anti-reflection and anti-explosion protective film can be up to 90 percent or above; and furthermore, when the reinforced glass film layer is broken, the reinforced glass film layer is only cracked instead of generating sputtering broken blocks, so that the use safety is improved.
Owner:萍乡星弛光电科技有限公司

Method and device for conveying plastic substrate

The embodiment of the invention provides a method and a device for conveying a plastic substrate and belongs to the field of industrial control. The method comprises the following steps that when a first optical signal of throwing equipment is in a first threshold range, an inlet unit is switched into a horizontal state, and a plastic substrate is thrown into the inlet unit; when a plurality of second optical signals of the inlet unit are all in a second threshold range, the inlet unit is switched into an inclined state with a preset inclined angle; an outlet electric signal at an outlet of the inlet unit or a middle unit is received, and when the outlet electric signal is in a third threshold range, a next conveying unit of a conveying unit, corresponding to the outlet electric signal, isswitched into the inclined state with a preset inclined angle; and a plurality of third optical signals of a plurality of second preset positions of the outlet unit are received, and when a pluralityof fourth optical signals are all in a fourth threshold range, the outlet unit is switched into the horizontal state. The method and the device can enable the plastic substrate to be successfully conveyed in production equipment, so that the plastic substrate can be avoided from being broken, and the rate of good products is increased.
Owner:深圳市格睿尔科技有限公司
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