Equipment and operation method for improving rapid thermal processing productivity of wafers
A rapid heat treatment, wafer technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of single wafer, inconvenient operation, affecting production capacity, quality production cost, etc.
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[0019] The implementation of the present invention will be described in more detail in conjunction with the drawings and component symbols in the description below, so that those skilled in the art can implement it after studying the description.
[0020] refer to image 3 , Figure 4A as well as Figure 4B , are respectively the top view of the first embodiment of the device for improving the productivity of rapid thermal processing of wafers according to the present invention, and the perspective views of the examples of the loading end and the unloading end of the present invention. Such as image 3 As shown, the device 2 for improving the production capacity of wafer rapid thermal treatment in the present invention includes at least one process module, a base body 10, a front-end control interface 70, and a rear-end control interface 80, and the at least one process module includes at least one process chamber Body 20 , loading end 30 , unloading end 40 , mechanical arm...
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