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Equipment and operation method for improving rapid thermal processing productivity of wafers

A rapid heat treatment, wafer technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of single wafer, inconvenient operation, affecting production capacity, quality production cost, etc.

Active Publication Date: 2012-08-29
PREMTEK INT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The equipment and operation method of rapid heat treatment in the prior art have the following disadvantages. For example, only a single wafer can be processed per unit time, which cannot meet the needs of current production capacity. In addition, there is only one front-end control interface 70. When it is desired to perform maintenance , testing or small-scale production, it is necessary to cancel the automatic process parameters first, which is inconvenient to operate. In addition, after a period of use, if the precision between the components is not accurate, if the wafer cannot be placed in the position, it will be difficult to operate during the operation steps. The problem of fragmentation may occur, which will affect the production capacity, quality and production cost

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  • Equipment and operation method for improving rapid thermal processing productivity of wafers
  • Equipment and operation method for improving rapid thermal processing productivity of wafers
  • Equipment and operation method for improving rapid thermal processing productivity of wafers

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Embodiment Construction

[0019] The implementation of the present invention will be described in more detail in conjunction with the drawings and component symbols in the description below, so that those skilled in the art can implement it after studying the description.

[0020] refer to image 3 , Figure 4A as well as Figure 4B , are respectively the top view of the first embodiment of the device for improving the productivity of rapid thermal processing of wafers according to the present invention, and the perspective views of the examples of the loading end and the unloading end of the present invention. Such as image 3 As shown, the device 2 for improving the production capacity of wafer rapid thermal treatment in the present invention includes at least one process module, a base body 10, a front-end control interface 70, and a rear-end control interface 80, and the at least one process module includes at least one process chamber Body 20 , loading end 30 , unloading end 40 , mechanical arm...

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Abstract

The invention discloses equipment and an operation method for improving the rapid thermal processing productivity of wafers. The equipment includes at least one processing procedure module, a base body, a front end control interface and a rear end control interface, wherein each processing procedure module includes at least one processing procedure cavity, a loading end, an unloading end, a mechanical arm and a cooling device; the loading end and the unloading end are combined-type cassettes used for accommodating multiple-piece graphite bearing plates in a layered manner; and the multiple-piece graphite bearing plates are provided with carving grooves, so as to load wafers of various sizes. The cassettes are designed to be the multiple-piece graphite bearing plates capable of accommodating and loading wafers, so that operation of the mechanical arm during the processing procedure is reduced, and rapid thermal processing for a plurality of wafers can be performed at the same time, the productivity in unit time can be greatly improved, the flexibility of the processing procedure and the compatibility of the equipment are improved, the time for processing procedure is saved, and the fragment probability of wafers is reduced.

Description

technical field [0001] The present invention relates to a device and an operation method for increasing the production capacity of wafer rapid heat treatment, and in particular to an equipment and an operation method for improving the production capacity of wafer rapid heat treatment, which can simultaneously carry multiple graphite carriers by changing the structure of the cartridge. Background technique [0002] refer to figure 1 and figure 2 , are respectively the top view of the prior art rapid heat treatment equipment and the flow chart of the prior art rapid heat treatment operation method. Such as figure 1 As shown, the prior art rapid heat treatment equipment 1 includes a base body 10, at least one process chamber 20, a loading end 35, an unloading end 45, a robot arm 50, a cooling and separation device 65, a front control interface 70, and a centering The device 90, wherein the loading end 35 and the unloading end 45 are generally used for accommodating multiple...

Claims

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Application Information

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IPC IPC(8): H01L21/673H01L21/324
Inventor 林武郎郑煌玉石玉光郭明伦吕学礼周明源黄文泰
Owner PREMTEK INT
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