Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Ceramic circuit board with plated through hole and manufacturing method thereof

A technology of metallized through holes and manufacturing methods, applied in the fields of printed circuit manufacturing, removing conductive materials by chemical/electrolytic methods, manufacturing printed circuit precursors, etc., can solve problems that are prone to voids, not suitable for making fine circuit boards, Low reliability and other issues, to achieve the effect of high reliability, fine production reliability, and high reliability

Pending Publication Date: 2018-07-24
深圳市牧泰莱电路技术有限公司
View PDF0 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a ceramic circuit board with metallized through holes, which is used to solve the problem that the traditional ceramic substrate in the prior art is not suitable for making fine circuit boards, or is suitable for making fine circuit boards but is easy to have Voids cause technical issues with lower reliability

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Ceramic circuit board with plated through hole and manufacturing method thereof
  • Ceramic circuit board with plated through hole and manufacturing method thereof
  • Ceramic circuit board with plated through hole and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] In order to make the technical problems to be solved, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0035] It should be noted that when a component is referred to as being “fixed on” or “disposed on” another component, it may be directly on the other component or indirectly on the other component. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0036] It should also be noted that the same or similar symbols in the drawings of the embodiments of the present invention correspond to the same or similar components; The orientation or positional relations...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Aperture sizeaaaaaaaaaa
Login to View More

Abstract

The invention belongs to the technical field of PCB manufacture and is to provide a ceramic circuit board with a plated through hole and a manufacturing method thereof. The ceramic circuit board comprises a ceramic substrate. The ceramic substrate is provided with at least one connection through hole through laser; then, each connection through hole is filled with metal slurry; after high-temperature solidification, the metal slurry forms metal columns, so that metallization of each connection through hole is realized; the holes do not have chemical liquid, thereby ensuring reliability of theceramic circuit board and avoiding the defect of existence of holes in the through holes in the conventional electroplating hole filling process; and by carrying out mechanical polishing on the metalcolumns protruding on upper and lower surfaces of the ceramic substrate and then, carrying out magnetron vacuum sputtering on at least one surface of the ceramic substrate to form a metal layer group,and since the metal layer group can be firmly combined with the ceramic substrate, and the magnetron vacuum sputtering technique can control the thickness well, the ceramic substrate is suitable forpreparing a fine ceramic circuit board, and the ceramic circuit board can take both fine production and high reliability into considerations.

Description

technical field [0001] The invention belongs to the technical field of PCB board manufacturing, and more specifically relates to a ceramic circuit board with metallized through holes and a manufacturing method thereof. Background technique [0002] With the development of LED chip technology, the packaging structure of LED products has changed from pin type packaging structure to surface mount type (SMD) packaging structure and then to power type packaging structure. As we all know, the heat dissipation performance of LED has a significant impact on the efficiency, life and reliability of LED chips, which requires the LED package to have a good heat dissipation function. Due to the high heat dissipation, low resistance, long life, and voltage resistance of ceramic substrates, LED packaging substrates have gradually shifted from traditional glass epoxy resins to substrates made of aluminum or copper to ceramic materials with high thermal conductivity. As the main material of...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K1/11H05K3/00H05K3/40H05K3/02H05K3/06
CPCH05K1/115H05K3/0029H05K3/0094H05K3/022H05K3/06H05K3/4038H05K2201/09563H05K2203/107
Inventor 彭湘陈晓艺钟岳松
Owner 深圳市牧泰莱电路技术有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com