Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Novel tin-and-indium-containing multi-component cadmium-and-silver-free brazing filler metal

A multi-component, silver solder technology, applied in welding/cutting medium/material, welding medium, metal processing equipment, etc., can solve the problems of high cost, high silver content, unfavorable popularization and use of rare earth solder, etc. Effects of increased shear strength, reduced cost, and improved processability

Inactive Publication Date: 2013-04-24
XI AN JIAOTONG UNIV
View PDF6 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to improve the performance of brazing filler metals, rare earth elements are added to 16 kinds of brazing filler metals. As a strategic resource, the country actively takes measures to protect them. Rare earth brazing filler metals are not conducive to popularization and use.
Only four kinds of brazing alloys containing rare earth have a silver content below 30%, while other brazing alloys have a higher silver content, and the cost is correspondingly higher

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Novel tin-and-indium-containing multi-component cadmium-and-silver-free brazing filler metal
  • Novel tin-and-indium-containing multi-component cadmium-and-silver-free brazing filler metal

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] The mass percentage components of the solder in this embodiment are: Ag: 25.02%, Cu: 36.18%, Zn: 33.84%, In: 1.04%, and the remainder is Sn.

[0021] In this embodiment, the solidus temperature of the solder is 713°C, the liquidus temperature is 730°C, and the interval between the solidus and the liquidus temperature is 17°C. The wetting ratio on red copper is 2.32, the electrical conductivity is 9.6MS / m, the microhardness is 228Hv, and the shear strength of the brazed copper-red copper brazing joint is 225.49MPa.

Embodiment 2

[0023] The components of the solder in this embodiment are: Ag: 25.74%, Cu: 36.65%, Zn: 32.83%, In: 1.20%, and the remainder is Sn.

[0024] In this embodiment, the solidus temperature of the solder is 701°C, the liquidus temperature is 720°C, and the interval between the solidus and the liquidus temperature is 19°C. The wetting ratio on red copper is 2.63, the electrical conductivity is 9.5MS / m, the microhardness is 215Hv, and the shear strength of the brazed copper-red copper brazing joint is 224.62MPa.

Embodiment 3

[0026] The components of the solder in this embodiment are: Ag: 25%, Cu: 37%, Zn: 34%, In: 1%, and the remainder is Sn.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Temperatureaaaaaaaaaa
Liquidus temperatureaaaaaaaaaa
Conductivityaaaaaaaaaa
Login to View More

Abstract

The invention discloses novel tin-and-indium-containing multi-component cadmium-and-silver-free brazing filler metal. The novel tin-and-indium-containing multi-component cadmium-and-silver-free brazing filler metal is characterized by comprising, by mass, 25.0%-26.0% of Ag, 36.0%-37.0% of Cu, 32.0%-34.0% of Zn, 1.0%-1.2% of In and the balance Sn. Silver content of the brazing filler metal is reduced by 5%, and cost is lowered. Solidus temperature is kept unchanged to be 701-713 DEG C, liquidus temperature is within the range of 720-730 DEG C and is decreased by 50 DEG C, and accordingly the interval between the solidus temperature and the liquidus temperature is decreased by 50 DEG C. In addition, wetting rate of the brazing filler metal on copper is increased by 0.5, microhardness is lowered by 50Hv, machinability is improved, and shearing strength of copper-copper brazing seams is enhanced by 80MPa.

Description

technical field [0001] The invention belongs to the technical field of solder preparation, and relates to a multi-component cadmium-free silver solder, in particular to a novel multi-component cadmium-free silver solder containing tin and indium, which can be used for brazing silver, silver alloy, copper And copper alloy, steel and other materials. Background technique [0002] Among the silver-based solders, cadmium-containing silver solders have the best performance, mainly because cadmium element can reduce the melting point of the solder and inhibit the generation of brittle phases, so that the solder has excellent performance and processing performance. After the use of cadmium-containing silver solder was banned because it was harmful to the human body, cadmium-free silver solder was actively developed at home and abroad. The research mainly focuses on two aspects. First, adding other alloying elements to silver-based brazing filler metals, studying their effects, and...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B23K35/30
Inventor 潘希德陈迎谢小娟陈乐生顾章平
Owner XI AN JIAOTONG UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com