Isotropous conductive adhesive and preparation method thereof

An isotropic, conductive adhesive technology, applied in the preparation of carboxylic acid nitrile, conductive adhesives, chemical instruments and methods, etc., can solve the problems of low heat resistance, high price of silver-containing conductive adhesive, etc., and achieve the reduction of silver content , Improve liquidity, reduce production costs

Inactive Publication Date: 2010-11-24
中国林科院林产化工研究所南京科技开发有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problems of high price and low heat resistance of the existing silver-containing conductive adhesive, the present invention provides an isotropic conductive adhesive and a preparation method thereof, which have the advantages of low cost, low toxicity and environmental protection, excellent electrical conductivity and adhesion Strong and other characteristics

Method used

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  • Isotropous conductive adhesive and preparation method thereof
  • Isotropous conductive adhesive and preparation method thereof
  • Isotropous conductive adhesive and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0081] Step 1: Put a certain amount of phenol in the reaction flask, add hexamethylenediamine at a molar ratio of 1:2.0 to 2.5, raise the temperature to 40-50°C, start stirring, and add dropwise organic aldehyde with a molar ratio of 1:2 to phenol, Control the heating rate not to exceed 80°C, reflux reaction for 0.5-1h, raise the temperature to 110-120°C, dehydrate and reflux reaction for 2-4 hours, until no water flows out of the receiver, cool down to 60°C, dropwise add the same mole number of phenol Acrylonitrile, control the temperature not to exceed 80°C, when the temperature of the reactant no longer rises, cool down to 60°C by itself, filter, and obtain an amber low-viscosity liquid, which is a modified amine curing agent.

[0082] Step 2: Put a certain amount of maleopimaric acid anhydride in the reaction flask, add triethylenetetramine at a molar ratio of 1:3 to 4, start stirring, heat up to 120°C to 140°C, and reflux for 1 to 5 hours. Gradually raise the temperature ...

Embodiment 2

[0086] Step 1: Put a certain amount of phenol in the reaction flask, add methylcyclopentyldiamine at a molar ratio of 1:2.0~2.5, raise the temperature to 40~50°C, start stirring, and dropwise add phenol with a molar ratio of 1:2 For organic aldehydes, control the heating rate not to exceed 80°C, reflux for 0.5-1 hour, heat up to 110-120°C, dehydrate and reflux for 2-4 hours until no water flows out of the receiver, cool down to 60°C, add dropwise with phenol For acrylonitrile with equivalent moles, control the temperature not to exceed 80°C. When the temperature of the reactant no longer rises, cool down to 60°C by itself, and filter to obtain an amber low-viscosity liquid, which is a modified amine curing agent.

[0087] Step 2: Put a certain amount of maleopimaric acid anhydride in a reaction flask, add diethylenetriamine in a molar ratio of 1:3 to 4, start stirring, heat up to 120°C to 140°C, and reflux for 1 to 5 hours. Gradually raise the temperature for dehydration until...

Embodiment 3

[0091] Step 1, put a certain amount of phenol in the reaction flask, add methylcyclohexanediamine in a molar ratio of 1:2.0~2.5, raise the temperature to 40~50°C, start stirring, and dropwise add phenol with a molar ratio of 1:2 For organic aldehydes, control the heating rate not to exceed 80°C, reflux for 0.5-1 hour, heat up to 110-120°C, dehydrate and reflux for 2-4 hours until no water flows out of the receiver, cool down to 60°C, add dropwise with phenol For acrylonitrile with equivalent moles, control the temperature not to exceed 80°C. When the temperature of the reactant no longer rises, cool down to 60°C by itself, and filter to obtain an amber low-viscosity liquid, which is a modified amine curing agent.

[0092] Step 2: Put a certain amount of maleopimaric acid anhydride in the reaction flask, add triethylenetetramine at a molar ratio of 1:3 to 4, start stirring, heat up to 120°C to 140°C, and reflux for 1 to 5 hours. Gradually raise the temperature for dehydration u...

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Abstract

The invention discloses an isotropous conductive adhesive and a preparation method thereof. A raw material of the isotropous conductive adhesive is prepared by compounding a component A and a component B in a mass ratio of 100:80-100, wherein the component A comprises the following constituents in part by mass: 100 parts of epoxy resin, 5 to 20 parts of flexible diluent and 200 to 300 parts of conductive filler; and the component B comprises the following constituents in part by mass: 50 parts of rosinyl polyamide curing agent, 50 parts of modified amine curing agent and 150 to 250 parts of conductive filler. The preparation method comprises the following steps of: performing a Mannich reaction of phenol, polyamine and organic aldehyde and performing an addition reaction of a Mannich reaction product and acrylonitrile to obtain an amber low-viscosity modified amine curing agent; performing an amidation reaction of maleopimaric acid and the polyamine and performing an addition reactionof an amidation reaction product and the acrylonitrile to obtain a yellow thick rosinyl polyamide curing agent; and uniformly mixing the amber low-viscosity modified amine curing agent and the yellowthick rosinyl polyamide curing agent according to a proportion to obtain the isotropous conductive adhesive.

Description

technical field [0001] The invention belongs to the field of conductive materials in the electronic assembly industry, and in particular relates to a conductive glue and a production method thereof. Background technique [0002] With the development of electronic assembly technology in the direction of miniaturization and high density, as well as people's increasing awareness of environmental protection, traditional lead-tin solder and other printed circuit board and surface assembly technologies are gradually restricted due to high lead content. Lead-tin solder is a connecting material in printed circuit boards and surface mount technology (abbreviated as SMT), and its lead content is as high as 40%, which not only endangers the health of operators, but also pollutes the environment. The United States banned the use of toxic heavy metals in electronic products and manufacturing processes in 1992, Japan restricted the use of lead metal in 2001, and Europe stopped using lead-...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J9/02C09J11/06C09J11/08C08G69/48C09F1/04C07C255/24C07C253/30
Inventor 聂小安林贵福蒋剑春夏建陵李科陈洁
Owner 中国林科院林产化工研究所南京科技开发有限公司
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