End-blocking slurry for flaky component

A paste and component technology, applied in the field of materials used as conductors, can solve the problems of high silver content, low silver content, high production cost, etc., achieve the effect of low silver content, strong adhesion, and reduce paste cost

Inactive Publication Date: 2010-06-09
贵阳晶华电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a capping paste with low silver content that can meet the requirements of the t

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] Embodiment 1: compare with the end-capping slurry that does not add inorganic filler with the inventive method

[0045] (1) First set Bi 2 o 3 50%, B 2 o 3 15%, ZnO 12%, SiO 2 5%, Al 2 o 3 2%, TiO 2 4%, ZrO 2 2%, CaO 1%, MgO 1%, Na 2 O 5%, Li 2 O 3% powder was weighed in proportion and mixed evenly, put into a platinum crucible, kept in an electric furnace at 1300°C for 45 minutes, melted evenly, poured into a glass flaker and rolled into thin flakes; the glass flakes were ball-milled to 1 ~2μm, the obtained glass powder is used for later use;

[0046] (2) 15% of ethyl cellulose, 80% of terpineol, 3% of organic bentonite, and 2% of T60 are made into an organic carrier according to the mass fraction of each component;

[0047] (3) According to the mass fraction, take 10% of glass powder, 10% of inorganic filler CuO, Bi 2 o 3 5%, flake silver powder 30%, spherical silver powder 20%, and organic carrier 25%. Mix the inorganic and organic components, rol...

Embodiment 2

[0070] (1) will Bi 2 o 3 58%, B 2 o 3 12%, ZnO 8%, SiO 2 3%, Al 2 o 3 2%, TiO 2 3%, ZrO 2 2%, SnO 2 2%, Na 2 O 10%, the powder is weighed in proportion, mixed evenly, put into a platinum crucible, kept in an electric furnace at 1300°C for 45 minutes, melted evenly, poured into a glass flaker and rolled into flakes; the glass flakes were ball-milled to 1-2 μm, the obtained glass powder is used for later use;

[0071] (2) 18% of polymethyl methacrylate, 80% of terpineol, 1.5% of polyacrylamide, and 0.5% of organic silicon surfactant are made into an organic carrier according to the mass fraction of each component for subsequent use;

[0072] (3) According to the mass fraction of glass powder 7.7%, ZnO 14.0%, Bi 2 o 3 4.9%, 35% flake silver, 8.4% ball silver, 30% ratio of organic carrier, mix inorganic and organic components, roll evenly through three-roll rolling mill, and pass the inspection, then the chip element end-capped paste of the present invention is ...

Embodiment 3

[0084] (1) ZnO 25%, B 2 o 3 35%, SiO 2 10%, Al 2 o 3 4%, TiO 2 4%, ZrO 2 3%, CaO 2%, MgO 2%, Na 2 O 10%, K 2 O 3%, Li 2 O 2% powder was weighed in proportion and mixed evenly, put into a platinum crucible, kept in an electric furnace at 1350°C for 45 minutes, melted evenly, poured into a glass flaker and rolled into thin flakes; the glass flakes were ball-milled to 1 ~2μm, the obtained glass powder is used for later use;

[0085] (2) 13% of ethyl cellulose, 82% of terpineol, 4% of organic bentonite, T60 1% are made into organic carrier by the mass fraction of each component for subsequent use;

[0086] (3) Take 8% glass powder, 17% inorganic filler CuO, 30% flake silver powder, 20% spherical silver powder, and 25% organic carrier according to the mass fraction, mix the inorganic and organic components, and roll them evenly through a three-roll mill , the inspection is qualified, then the end-capping slurry for chip components of the present invention is obtained....

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Abstract

The invention relates to an end-blocking slurry for a flaky component, which is prepared from the following raw materials in percentage by mass: 40 to 55 percent of silver powder, 4 to 15 percent of glass powder, 5 to 25 percent of inorganic filler and 20 to 40 percent of organic carrier, wherein the silver powder comprises the following silver powder in percentage by mass in the slurry: 25 to 40 percent of flaky silver powder and 15 to 30 percent of spherical silver powder. The end-blocking slurry has the advantages that: (1) the content of silver is low so as to reduce the cost of the slurry and improve the market competitiveness of the products, and 300 RMB can be saved in 1 kg of the slurry; (2) lead is not contained in the slurry, which is in favor of environmental protection; (3) a compact and flat conductor layer is formed at the end head of a substrate without pit and bulge after the processes of dipping the silver, drying and sintering, so the platability is good, the adhesive force is strong, and the glass is acid resistant. The slurry has good process use characteristics and is suitable to be used in the industries for generating the flaky components.

Description

technical field [0001] The present invention relates to materials used as conductors and, more particularly, to termination pastes for chip components. Background technique [0002] Multilayer chip components have the advantages of miniaturization, easy placement, and integration, and are widely used in mobile communications, computers, home appliances, automotive electronics, and industrial control. With the continuous advancement of technology, multilayer chip components are developing in the direction of miniaturization, environmental protection, low cost, high stability and high precision. The multilayer chip inductor is to form a plurality of silver conductive bands by screen printing on the ferrite or ceramic powder diaphragm. The ferrite or ceramic powder and the conductive band are laminated, and the ferrite or ceramic The inside of the powder constitutes a plurality of helical coils. The diaphragm formed by it is cut into individual coils, and then sintered at a l...

Claims

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Application Information

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IPC IPC(8): H01B1/00H01B1/16H01B1/22C03C12/00
Inventor 雷安福谌业富陈迪勇白勇祥
Owner 贵阳晶华电子材料有限公司
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