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Wet processing system and method of operating

A deposition system and electrochemical technology, applied in the field of electrochemical deposition, can solve problems such as system difficulties and poor environmental control, and achieve the effects of simplifying chemical process management, improving process efficiency, and facilitating chemical concentration management

Inactive Publication Date: 2019-05-03
TEL NEXX INC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

More generally, these systems suffer from poor environmental control

Method used

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  • Wet processing system and method of operating
  • Wet processing system and method of operating
  • Wet processing system and method of operating

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Embodiment Construction

[0018] The technology disclosed herein includes an electrochemical deposition apparatus that provides a robust workpiece handling system, simplified circulation system, improved chemical management system for more reliable and uniform plating, and short maintenance times for better tooling availability.

[0019] The system and technology disclosed herein can be embodied as an electrochemical deposition system or a system module, or a workpiece surface wet treatment adjustment system. Example systems include wet processing systems capable of processing or conditioning workpieces of various types and sizes, including both wafer-type geometries (such as semiconductor wafers) and panel-type geometries, the former being characterized by relative Rigid silicon disks, the latter featuring larger and more flexible rectangular substrates. One embodiment includes an electrochemical deposition apparatus for depositing metal onto a substrate. figure 1 A schematic diagram of an electroch...

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Abstract

An electrochemical deposition system having two or more electrochemical deposition modules arranged on a common platform and configured for depositing one or more metals on a substrate is described. Each electrochemical deposition module includes an anode compartment configured to contain a volume of anolyte fluid, a cathode compartment configured to contain a volume of catholyte fluid, and a membrane separating the anode compartment from the cathode compartment. Each electrochemical deposition module further includes a workpiece holder configured to hold opposing edges of a flexible workpiecebetween first and second leg members via a clamping mechanism, and a loader module configured to position the flexible workpiece in the workpiece holder while holding the flexible workpiece using anair cushion on each opposing planar surface of the flexible workpiece.

Description

technical field [0001] CROSS-REFERENCE TO RELATED APPLICATIONS: This application is related to and claims priority to US Patent Application Serial No. 15 / 194,086, filed June 27, 2016, the entire contents of which are hereby incorporated by reference for the present disclosure. [0002] The present invention relates to methods and systems for electrochemical deposition, including the electroplating of various workpieces, such as semiconductor substrates. Background technique [0003] Electrochemical deposition systems or wet processing conditioning systems for workpiece surfaces are well known for wafer-type geometries, such as semiconductor wafers, and panel-type geometries characterized by relatively rigid silicon discs , while the panel-type geometry is characterized by a larger and more flexible rectangular substrate. There is a need in the industry for equipment that can process panel workpieces with a resulting precision of deposited metal that is comparable to that pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D17/00C25D17/04C25D17/02C25D21/12C25D21/10C25D7/12H01L21/288
CPCC25D17/00C25D17/001C25D17/002C25D17/06C25D21/10C25D21/14C25D17/28
Inventor 阿瑟·凯格勒乔纳森·韩德弗里曼·费雪乔纳森·海恩斯盖瑞·博利特大卫·瓜尔纳烚
Owner TEL NEXX INC
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