Tin-Silver-Zinc system lead-free solder with low silver content

A lead-free solder, silver content technology, applied in the field of lead-free solder, tin-silver-zinc lead-free solder, can solve the problems of increased solder production cost, low silver content, and decreased product competitiveness.

Inactive Publication Date: 2008-12-10
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is currently the most promising lead-free solder used to replace Sn-37Pb solder, and the high price of silver directly leads ...

Method used

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  • Tin-Silver-Zinc system lead-free solder with low silver content
  • Tin-Silver-Zinc system lead-free solder with low silver content
  • Tin-Silver-Zinc system lead-free solder with low silver content

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Tin, silver, and zinc with a purity of 99.99% are heated to 1000°C in a vacuum melting furnace under the protection of argon in a mass ratio of 96.1:3:0.9, and are magnetically stirred at the same time to make the alloy composition uniform, and then water-cooled and solidified . Then the alloy is turned over and reheated to 500°C to melt, and at the same time, it is magnetically stirred and water-cooled, and this is repeated at least five times to obtain a tin-silver-zinc lead-free solder with low silver content. The morphology of the prepared solder is as follows figure 1 shown.

Embodiment 2

[0028] Heat tin, silver, zinc, gallium with a purity of 99.99% in a mass ratio of 97:2:0.5:0.5 in a vacuum melting furnace under the protection of argon to 1100°C for melting, and at the same time add magnetic stirring to make the alloy composition uniform , and then freezes. Then the alloy is turned over and reheated to 500°C to melt, and at the same time, it is magnetically stirred and water-cooled, and this is repeated at least five times to obtain a tin-silver-zinc lead-free solder with low silver content. The morphology of the prepared solder is as follows figure 2 shown.

Embodiment 3

[0030] Heat tin, silver, zinc and indium with a purity of 99.99% in a mass ratio of 96.5:1:1.5:1 in a vacuum melting furnace under the protection of argon to 1200°C for melting, and at the same time add magnetic stirring to make the alloy composition uniform , and then freezes. Then the alloy is turned over and reheated to 480°C to melt, and at the same time, it is magnetically stirred and water-cooled, and this is repeated at least five times to obtain a low-silver content tin-silver-zinc lead-free solder. The morphology of the prepared solder is as follows image 3 As shown, the wetting angle between its interface with copper is shown as Figure 5 shown.

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Abstract

The invention relates to tin silver zinc series lead-free solders containing low silver, belonging to the lead-free solder technology. The components and the mass percentage of tin silver zinc series lead-free solders of the invention are as follows: tin, 85 to 99; silver, 0.01 to 3; zinc, 0.01 to 5; bismuth, 0 to 5; indium, 0 to 4; rare earth elements, 0 to 5; gallium, 0 to 2.5; and phosphorus, 0 to 3. The tin silver zinc series lead-free solders containing low silver have the advantages that under the premise of ensuring the industrial application thereof, the product cost is reduced by reducing the content of silver, and the tin silver zinc series lead-free solders containing low silver have good wetting property with a copper base plate.

Description

technical field [0001] The invention relates to tin-silver-zinc lead-free solder with low silver content, belonging to the lead-free solder technology. Background technique [0002] Various electronic products that are closely related to human life and work benefit human beings, but also increasingly endanger human health and the ecological environment due to the use of lead-containing solder in electronic products. Waste of Electrical and Electronic Equipment (WEEE), led by the European Union, called for an end to the use of lead-containing materials in the electronics assembly industry in 2006. The National Electronics Manufacturing Institute (NEMI) of the United States has implemented a special project called "NEMI's Soldering Lead-Free Program" to systematically study the use of lead-free assembly in the electronics industry; Japan's major consumer electronics manufacturers have also promised to fully implement it as soon as possible. To realize lead-free electronic ass...

Claims

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Application Information

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IPC IPC(8): B23K35/26
Inventor 刘永长韦晨余黎明徐荣雷
Owner TIANJIN UNIV
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