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Silver nanowire doped conductive silver colloid and preparation method thereof

A technology of silver nanowires and conductive silver glue, which is applied in the direction of conductive adhesives, circuits, adhesives, etc., can solve the problems that conductive colloids cannot obtain good conductive effects, cannot reduce the cost of conductive glue, and the contact area of ​​silver powder particles is small. High industrial application value, good aging resistance, good conductivity effect

Inactive Publication Date: 2012-09-19
SHANGHAI FUXIN NEW ENERGY TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The silver filler in the traditional silver conductive adhesive is polycrystalline micron silver powder particles, which rely on the mutual contact between the silver particles to form conductive channels to conduct electricity, but because the contact area between the silver powder particles is small, there are many nodes between the particles, and the conductive The performance cannot be improved; moreover, the silver content in the traditional conductive silver glue is very high, generally 70-80% by weight. In the case of a small amount of silver powder doping, the conductive colloid cannot obtain a good conductive effect, and the conductive glue cannot be reduced. The cost, its industrial application value is also subject to certain restrictions

Method used

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  • Silver nanowire doped conductive silver colloid and preparation method thereof
  • Silver nanowire doped conductive silver colloid and preparation method thereof
  • Silver nanowire doped conductive silver colloid and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] A silver nanowire-doped conductive silver glue, its raw material includes the following components in weight percentage:

[0028]

[0029] The shape of the micron silver powder is flake, with a diameter of 1-8 μm and a specific surface area of ​​0.9-1.6 μm 2 / g; the silver nanowire is a single crystal silver nanowire with a length of 20-200 μm, a diameter of 20-100 nm, and a volume resistivity of 0.3×10 5 -0.35x10 5 S / cm; described epoxy resin is made up of E-51 epoxy resin and bisphenol epoxy resin, and described bisphenol epoxy resin is bisphenol S epoxy resin, and epoxy equivalent (g / mol) is 185~ 195 (Blue Star New Material Wuxi Resin Factory); The curing agent is triethanolamine; The solvent is made up of ethylene glycol and acetone; The accelerator is imidazole; The toughening agent is polyurethane, and the polyurethane is AFCONA- 4000 type polyurethane (Lanya Trading Co., Ltd.); said additive includes defoamer, coupling agent, thixotropic agent, anti-aging ag...

Embodiment 2

[0035] A silver nanowire-doped conductive silver glue, its raw material includes the following components in weight percentage:

[0036]

[0037]

[0038] The shape of the micron silver powder is flake, with a diameter of 1-8 μm and a specific surface area of ​​0.9-1.6 μm 2 / g; the silver nanowire is a single crystal silver nanowire with a length of 20-200 μm, a diameter of 20-100 nm, and a volume resistivity of 0.3×10 5 -0.35x10 5 S / cm; the epoxy resin is composed of bisphenol epoxy resin and glyceryl ether epoxy resin, wherein the bisphenol epoxy resin is bisphenol S epoxy resin, and the epoxy equivalent (g / mol) is 185~195 (Blue Star New Material Wuxi Resin Factory), glyceryl ether epoxy resin is glycidyl ether epoxy resin, and epoxy value is 0.78~0.85 (Shanghai Xinhua Resin Factory); Described curing agent is triethanolamine; Described solvent is It is composed of ethylene glycol, acetone and dimethyl phthalate; the accelerator is tertiary amines, and the tertiary a...

Embodiment 3

[0044] A silver nanowire-doped conductive silver glue, its raw material includes the following components in weight percentage:

[0045]

[0046]

[0047] The shape of the micron silver powder is flake, with a diameter of 1-8 μm and a specific surface area of ​​0.9-1.6 μm 2 / g; the silver nanowire is a single crystal silver nanowire with a length of 20-200 μm, a diameter of 20-100 nm, and a volume resistivity of 0.3×10 5 -0.35x10 5 S / cm; the epoxy resin is composed of E-51 epoxy resin and glyceryl ether epoxy resin, wherein the glyceryl ether epoxy resin is glycidyl ether epoxy resin, and the epoxy value is 0.78~0.85; the said The curing agent is composed of dicyandiamide and organic acid hydrazide, the organic acid hydrazide is adipic acid dihydrazide; the solvent is composed of acetone and dimethyl phthalate; the accelerator is imidazole The toughening agent is a silicone resin, and the silicone resin is a SH-1053 silicone resin; the additive includes a defoamer, a ...

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Abstract

The invention relates to the field of semiconductor electronic materials, and in particular relates to a silver nanowire doped conductive silver colloid and a preparation method thereof. The raw materials of the silver nanowire doped conductive silver colloid provided by the invention comprise the following components in percentage by weight: 25-60% of micrometer silver powder, 5-30% of silver nanowires, 20-50% of epoxy resin, 1.6-4% of curing agent, 5.8-9.2% of dissolvent, 0.4-1.6% of accelerant, 0.04-0.16% of toughening agent and 0.8-2.4% of additive. The conductive silver colloid is prepared by mixing and doping single-crystal silver nanowires and silver granules, thus, the total silver doping amount is reduced to 35-45%, and the conductive silver colloid has a favorable conductive effect, high shear strength, low working temperature and good ageing-resistant performance, and the cost of the conductive silver colloid is reduced. The silver nanowire doped conductive silver colloid can be widely applied to the fields of solar cell (film, crystal silicon) conductive colloids, conductive colloid LED (Light-Emitting Diode) package and the like.

Description

technical field [0001] The invention relates to the field of semiconductor electronic materials, in particular to a silver nanowire-doped conductive silver glue mainly used in the fields of solar cell (thin film, crystal silicon) conductive glue, LED packaging and the like and a preparation method thereof. Background technique [0002] In the past two decades, the semiconductor electronics industry has made great progress. In traditional industrial production, lead / tin (Pb / Sn) alloy is used as solder to connect various components of the circuit, so that each part can be fully supported by electric power and can transmit signals stably. However, lead / tin solders have gradually revealed many disadvantages in recent years. Lead is a serious hazard to the human body and the environment. Many countries have put forward clear regulations on the use of lead in the electronics industry, prohibiting the use of lead-containing materials in newly produced electronic products; in addi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C09J9/02C09J163/02C09J163/04H01L31/02H01L33/62
Inventor 陈平陈明富程晓丹
Owner SHANGHAI FUXIN NEW ENERGY TECH
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