Epoxy conductive silver glue for LED and method for manufacturing same

A technology of conductive silver glue and epoxy, which is applied in the direction of epoxy resin glue, conductive adhesive, circuit, etc., can solve the problems of unsatisfactory comprehensive performance, low curing temperature of conductive glue, high curing temperature of conductive glue, etc., and achieve a solution The effect of poor overall performance, high colloidal shear strength, and short curing time

Active Publication Date: 2008-08-20
SHANGHAI MUNICIPAL ELECTRIC POWER CO +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there are not many domestic conductive adhesives specially used for LED packaging, and the comprehensive performance is not very ideal. There are some problems. The common problems are that the curing temperature is too high, the curing time is too long, and the shear strength is low. For example, a certain conductive adhesive , the curing temperature is 150 degrees, the curing time is 4 hours, and the shear strength is 4 MPa; the other one, the curing temperature is 150 degrees, the curing time is 0.5 hours, and the shear strength is 0.8-1.2 MPa; the curing conditions and

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] An epoxy conductive silver glue for LEDs, the raw material formula of the epoxy conductive silver glue includes the following components and weight percentages:

[0032] Metallic silver powder 70%

[0033] Epoxy 15%

[0034] Toughener 4%

[0035] Curing agent 1.95%

[0036] Accelerator 0.05%

[0037] Solvent 7%

[0038] Additive 2%

[0039] The metal silver powder is flake silver powder, the particle size of the silver powder is 2-10 μm, and the bulk density is 1.6-2.0 g / ml; the epoxy resin is selected from bisphenol A epoxy resin; The toughening agent is selected from polyurethane and single-terminated polyether; the curing agent is a latent curing agent organic acid hydrazide; the accelerator is miconazole nitrate; the solvent is selected from cyclohexanone; The additives include thixotropic agent, coupling agent, defoamer, anti-aging agent, the weight ratio of the four is 1.5:1:0.2:0.2, and the thixotropic agent is selected from nano-SiO 2 , The coupling agent...

Embodiment 2

[0048] An epoxy conductive silver glue for LEDs, the raw material formula of the epoxy conductive silver glue includes the following components and weight percentages:

[0049] Metallic silver powder 75%

[0050] Epoxy 8%

[0051] Toughener 10%

[0052] Curing agent 0.5%

[0053] Accelerator 0.05%

[0054] Solvent 6%

[0055] Additive 0.45%

[0056] The metal silver powder is flake silver powder, the particle size of the silver powder is 2-10 μm, and the bulk density is 1.6-2.0 g / ml; the epoxy resin is selected from bisphenol F epoxy resin; The toughening agent is selected from double-terminated polyether; the curing agent is a latent curing agent organic acid hydrazide; the accelerator is an imidazole compound miconazole; the solvent is selected from phthalic acid di Butyl ester; described additive comprises thixotropic agent, coupling agent, defoamer, antiaging agent, and the weight ratio of four is 1: 2: 0.5: 0.5, and described thixotropic agent is selected from nano-...

Embodiment 3

[0065] An epoxy conductive silver glue for LEDs, the raw material formula of the epoxy conductive silver glue includes the following components and weight percentages:

[0066] Metallic silver powder 80%

[0067] Epoxy resin 10.6%

[0068] Toughener 4%

[0069] Hardener 2%

[0070] Accelerator 0.3%

[0071] Solvent 3%

[0072] Additive 0.1%

[0073] The metal silver powder is flake silver powder, the particle size of the silver powder is 2-10 μm, and the bulk density is 1.6-2.0 g / ml; the epoxy resin is selected from glycidyl ester; the toughening agent is selected from From single-terminated polyether; described curing agent is latent curing agent dicyandiamide; described accelerator is dichlorophenyl imidazole ethanol (imidazole condensate); described solvent is selected from cyclohexanone; The additives described include thixotropic agent, coupling agent, defoamer, anti-aging agent, the weight ratio of the four is 4:1:0.1:0.1, and the thixotropic agent is selected from...

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Abstract

The invention relates to an epoxy conductive silver colloid used in LED, the raw material formula of which comprises the following components according to weight percentage content: 70 to 80 percent of silver powder, 8 to 15 percent of epoxy resin, 4 to 10 percent of toughening agent, 0.5 to 2 percent of curing agent, 0.05 to 0.3 percent of accelerator, 3 to 7 percent of solvent, and 0.1 to 2 percent of additive; the epoxy conductive silver colloid is prepared by (1) preparation pf substrate; (2) preparation of silver colloid; (3) production process of silver colloid. Compared with the prior art, the epoxy conductive silver colloid used in LED causes the curing condition of the conductive silver colloid and shear strength to be coordinated better, is more suitable for the industrialization production, and improves production efficiency and the reliability of products.

Description

technical field [0001] The invention relates to a conductive adhesive and a manufacturing method thereof, in particular to an epoxy conductive silver adhesive for LED (light emitting diode) packaging and a manufacturing method thereof. Background technique [0002] Conductive adhesive is the abbreviation of conductive adhesive, which is an adhesive that can effectively bond various materials and has conductive properties. Lead-tin solder is a connecting material in printed circuit boards and surface mount technology (Surface Mount Technology, referred to as SMT), wherein lead is about 40%, and lead is a toxic substance, which not only endangers human health but also pollutes the environment; meanwhile, Pb / Sn Solder can only be applied to connections with a pitch below 0.065mm, and the temperature of the connection process is higher than 200°C. With the miniaturization and high-density development of electronic assembly technology and the continuous improvement of integratio...

Claims

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Application Information

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IPC IPC(8): C09J9/02C09J163/00H01L33/00H01L23/29
Inventor 王洪波陈大庆薛峰
Owner SHANGHAI MUNICIPAL ELECTRIC POWER CO
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