Epoxy conductive silver glue for LED and method for manufacturing same

Abstract

The invention relates to an epoxy conductive silver colloid used in LED, the raw material formula of which comprises the following components according to weight percentage content: 70 to 80 percent of silver powder, 8 to 15 percent of epoxy resin, 4 to 10 percent of toughening agent, 0.5 to 2 percent of curing agent, 0.05 to 0.3 percent of accelerator, 3 to 7 percent of solvent, and 0.1 to 2 percent of additive; the epoxy conductive silver colloid is prepared by (1) preparation pf substrate; (2) preparation of silver colloid; (3) production process of silver colloid. Compared with the prior art, the epoxy conductive silver colloid used in LED causes the curing condition of the conductive silver colloid and shear strength to be coordinated better, is more suitable for the industrialization production, and improves production efficiency and the reliability of products.

Description

technical field [0001] The invention relates to a conductive adhesive and a manufacturing method thereof, in particular to an epoxy conductive silver adhesive for LED (light emitting diode) packaging and a manufacturing method thereof. Background technique [0002] Conductive adhesive is the abbreviation of conductive adhesive, which is an adhesive that can effectively bond various materials and has conductive properties. Lead-tin solder is a connecting material in printed circuit boards and surface mount technology (Surface Mount Technology, referred to as SMT), wherein lead is about 40%, and lead is a toxic substance, which not only endangers human health but also pollutes the environment; meanwhile, Pb / Sn Solder can only be applied to connections with a pitch below 0.065mm, and the temperature of the connection process is higher than 200°C. With the miniaturization and high-density development of electronic assembly technology and the continuous improvement of integratio...

AI Technical Summary

Problems solved by technology

At present, there are not many domestic conductive adhesives specially used for LED packaging, and the comprehensive performance is not very ideal. There are some problems. The common problems are that the curing temperature is too high, the curing time is too long, and the shear strength is low. For example, a certain conductive adhesive , the curing temperature is 150 degrees, the curing time is 4 hours, and the shear strength is 4 MPa; the other one, the curing temperature is 150 degrees, the curing time is 0.5 hours, and the shear strength is 0.8-1.2 MPa; the curing conditions and shear strength are the same Regarding the contradiction, generally speaking, the conductive adhesive has a high curing temperature, a long curing time, and a high shear strength, and a conductive adhesive has a low curing temperature and a short curing time, and the shear strength is low. In practical applications, the curing temperature is required to be as low as possible and the curing time is as short as possible. At the same time, the shear strength is required to be as high as possible to meet the needs of industrial production to improve efficiency and application reliability