Conductive adhesive added with short rod type nano silver powder and preparation method thereof

Abstract

The invention relates to conductive adhesive which is added with short rod shaped silver powder and a process for preparation, which belong to the technical field of preparing technology for plastic material which is used to pack micro-electronics. The invention is characterized in that mixing silver powder of the short rod shaped silver powder and micrometer silver powder are taken as conductive filler and added into epoxide resin basal bodies to prepare utility conductive adhesive with high performance. The components and the percentage composition of the conductive adhesive are that polymeric matrix epoxide resin E-51 is 24-40%, conductive silver powder particles are 50-70%, wherein the short rod shaped silver powder is 10% and the micrometer silver powder is 40-60%, toughening agent dibutylphthalate is 2.4-4.0%, and curing agent triethanolamine is 3.6-6.0%. The preparation of the micrometer silver powder adopts silver nitrate, polyvinylpyrrolidone surface active agent and hydrazine hydrate reducing agent 5% as raw materials and prepared through liquid phase reducing reaction. The usage mass ratio of the silver nitrate and the polyvinylpyrrolidone is 1:1. Since the conductive adhesive which is prepared by the invention is added with the micrometer silver powder, thereby the electrical conductivity and the mechanical properties are increased, and the invention has better antiaging performance.

Description

technical field [0001] The invention relates to a conductive glue added with short rod-shaped nano-silver powder and a preparation method thereof, belonging to the technical field of preparation technology of conductive glue materials for microelectronic packaging. Background technique [0002] The connection material is a key factor affecting the line resolution and connection strength of the assembly technology. The aging resistance of the connection material directly affects the performance and application value of electronic products. At the same time, with the development of society, people's awareness of environmental protection has gradually increased, and new requirements have been put forward for the development of connecting materials. people's attention. As a basic connecting material, Sn / Pb solder has been used in the electronic packaging industry for many years, but its application in modern electronic technology is limited due to its own characteristics, such ...

AI Technical Summary

Problems solved by technology

However, silver conductive adhesive also has disadvantages such as high price and low connection strength, and silver migration phenomenon will occur under the condition of DC electric field and humidity, which will reduce the conductivity and affect its service life.

At present, the conductive fillers added to commercially available silver conductive adhesives are mainly micron silver powder, resulting in a relatively high volume resistivity, which affects its application in many aspects, especially fine manufacturing. Now more and more researchers Add nano-silver with special morphology to conductive adhesive to improve its conductive performance

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