Method of preparing electric conductive adhesive by chemical plating silver on graphite powder surface

Abstract

The invention discloses a chemical silver plating preparing conducting resin method on the graphite powder surface in the chemical silver plating and micro-electronics connection material technique domain, which comprises the following steps: oxidizing the graphite powder in the air at 600-650DEG C; putting the dispersant, reducer and stabilizing agent in de-ionized water for reduced liquid; adding in graphite powder to stir; putting the silver nitrate in the de-ionized water; adding in ammonia and sodium hydroxide to get argentamine; putting the reduced liquid in the argentamine liquid to finish chemical silver plating on the graphite powder surface; filtering; separating and washing; drying in vacuum to get silver coated graphite powder.

Description

technical field

[0001] The invention relates to an electroless silver plating on the surface of graphite powder and a method for preparing conductive adhesive by using the obtained powder as a conductive filler, belonging to the technical field of electroless silver plating and microelectronic connection materials. The obtained silver-plated graphite powder has the advantages of low density, easy dispersion and high conductivity. The conductive adhesive prepared by silver-plated graphite powder as a conductive filler has low price and similar electrical properties to pure silver conductive adhesive. It is used as a conductive connecting material in the fields of electronic devices and integrated circuits. Background technique

[0002] Conductive adhesive has the advantages of lead-free pollution, low weight, and low curing temperature. As a conductive connection material, it is a substitute for tin-lead solder. Among all kinds of conductive adhesives, the conductive adhesiv...