Sheet/branch silver-coated copper powder and green halogen-free low-silver-content economical electrically conductive adhesive capable of replacing traditional electrically conductive adhesives with high silver contents

A silver-plated copper powder and flake technology, which is applied in the direction of conductive adhesives, adhesives, epoxy resin glue, etc., can solve the problems of weak bonding between silver plating and copper powder, low conductivity, low oxidation resistance, and silver powder washing. Collect troubles and other problems, achieve good intrinsic conductivity, good thermal conductivity, and increase the effect of electrical and thermal conductivity

Active Publication Date: 2015-08-12
重庆邦锐特新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are also some problems in the silver-plated copper powder prepared in the industry at present: the surface of the copper powder is not completely covered by the silver film, and its conductivity and oxidation resistance are still lower than that of pure silver powder; the binding force between the silver c

Method used

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  • Sheet/branch silver-coated copper powder and green halogen-free low-silver-content economical electrically conductive adhesive capable of replacing traditional electrically conductive adhesives with high silver contents
  • Sheet/branch silver-coated copper powder and green halogen-free low-silver-content economical electrically conductive adhesive capable of replacing traditional electrically conductive adhesives with high silver contents
  • Sheet/branch silver-coated copper powder and green halogen-free low-silver-content economical electrically conductive adhesive capable of replacing traditional electrically conductive adhesives with high silver contents

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-5

[0049] The preparation of embodiment 1-5 silver-plated copper powder:

Embodiment 1

[0050] Example 1: (1) 15g of silver powder, 70g of copper powder, and 15g of zinc-aluminum alloy powder were placed in a high-energy ball mill and ball-milled for 24 hours to obtain 100g of diffusion-type pre-alloyed copper powder. Among them: the particle size of copper powder>the particle size of silver powder≥the particle size of Zn-Al alloy powder, and the aluminum content of Zn-Al alloy powder is 1-3wt%.

[0051] (2) Take 100g of alloyed copper powder in step (1), wash in acetone for 15 minutes under ultrasonic stirring conditions, wash in 3% dilute sulfuric acid for 2 minutes, wash with deionized water three times, filter the water and set aside.

[0052] (3) Electroless plating solution composition: main salt (silver nitrate 25g / L), reducing agent (formaldehyde 20g / L), complexing agent (EDTA30g / L), stabilizer (bipyridine 30mg / L), foaming agent ( PEG 5 μg / L), use ammonia water to adjust the pH value to 11, add the alloy copper powder processed in step (2), ultrasonic ele...

Embodiment 2-5

[0056] Silver-plated copper powder was prepared with reference to the method of Example 1.

[0057] Wherein in embodiment 2,

[0058] Step (3) is: chemical plating bath composition: soluble silver salt silver nitrate: 10g / L, reducing agent: formaldehyde 5g / L, complexing agent: EDTA10g / L, stabilizer: bipyridine 10mg / L, foaming agent: PEG 1 μg / L. Utilize ammonia water to adjust the pH value to 10, add the alloy copper powder treated in step (2), perform ultrasonic chemical plating treatment (frequency 20KHz, power 200W, temperature 70°C, reaction time 5min, adopt intermittent ultrasonic, filter and separate, and remove After washing with deionized water and washing with ethanol once, the silver-plated copper powder after washing is placed in a vacuum drying oven and dried.

[0059] Step (4) is: the silver-plated copper powder obtained in the step (3) is placed in the tube furnace, H 2 : N 2 =1:9 atmosphere, calcined at 200°C for 60 minutes, and the finished silver-plated all...

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Abstract

The invention relates to sheet/branch silver-coated copper powder, a green halogen-free low-silver-content economical electrically conductive adhesive capable of replacing traditional electrically conductive adhesives with high silver contents, and a preparing method of the electrically conductive adhesive. The morphology of the sheet/branch silver-coated copper powder is in a sheet shape and/or a branch shape. The silver coating area rate on the surface of copper powder is 90-95%. The content of a zinc-aluminum alloy in the silver-coated copper powder is lower than 15 wt%. The electrically conductive adhesive comprises following raw materials by weight: 60-90% of the sheet/branch silver-coated copper powder, 0-30% of micron order silver power, 6-12% of epoxy resin, 1-8% of an active diluting agent, 1-6% of toughening resin, 1-3% of a curing agent, 0-1% of a curing promoter and 0.5-2% of a coupling agent. The sheet/branch silver-coated copper powder is high in silver coating rate on the surface of Cu and excellent in electrically conductive performance, so that the electrically conductive adhesive prepared from the sheet/branch silver-coated copper powder is excellent in performance, low in cost and good in intrinsic conductivity.

Description

technical field [0001] The invention relates to a conductive adhesive and a preparation method thereof, in particular to an epoxy resin conductive adhesive and a preparation method thereof. It can be widely used in electronic and microelectronic packaging. Background technique [0002] In the field of microelectronic packaging, the environmental pollution caused by tin-lead solder has attracted more and more attention. It has become an inevitable trend to reduce or limit the use of lead. In 2004, Japan banned the use of lead in electronic products, and it has been legislated in Europe. Bans and restrictions on the use of lead in connections, and American countries are also following the trend. [0003] As an alternative to tin-lead solder, conductive adhesives have attracted widespread interest due to their environmental friendliness, mild processing conditions, simple process, and small line resolution. Vigorously developing conductive adhesives to replace tin-lead solder...

Claims

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Application Information

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IPC IPC(8): C09J9/02C09J163/00C09J163/10C09J179/08C09J113/00C09J115/00C09J181/04C09J11/06B22F1/02C23C18/42
Inventor 王传广徐杰
Owner 重庆邦锐特新材料有限公司
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