169results about How to "Minimize cracks" patented technology

A peeling layer 2 is formed on an element-forming substrate 1, an element-forming layer 3 including an electrical element is formed on the peeling layer, the element-forming layer is joined by means of a dissolvable bonding layer 4 to a temporary transfer substrate 5, the bonding force of the peeling layer is weakened to peel the element-forming layer from the element-forming substrate, the layer is moved to the temporary transfer substrate 5 side, a curable resin 6 is applied onto the element-forming layer 3 which has been moved onto the temporary transfer substrate 5, the resin is cured to form a transfer substrate 6, and the bonding layer 4 is dissolved to peel the temporary transfer substrate 5 from the transfer substrate 6, resulting in a structure in which a transfer substrate is formed directly on the element-forming layer 3. The separation and transfer technique can be used to form a substrate with better flexibility and impact resistance directly on a semiconductor element, without an adhesive layer on the semiconductor device that is produced.

A vacuum insulating glass (IG) unit is provided with an array of spacers / pillars between opposing glass sheets. At least some of the spacers / pillars are coated on at least one surface thereof with a dry lubricant and / or reflective material such as silver. This coating permits the glass sheet(s) to move relative to one another during thermal expansion while minimizing the degree to which the spacers / pillars scratch or crack the glass during such relative movement. A method of making an exemplary spacer / pillar includes transforming by chemical reaction silver ions on a core into a metallic silver coating thereby resulting in a coated spacer / pillar.

A method of repairing cracks on a surface of a component such as gas turbine components includes the steps of repairing the cracks of the component by brazing, detecting remaining cracks on the surface or below the surface, which were not properly filled with braze material during the repair brazing operation, and repairing the crack zones with a focussed low-heat input welding method using an appropriate weld filler materials.

Systems and methods for fabricating a light emitting diode include forming a multilayer epitaxial structure above a carrier substrate; depositing at least one metal layer above the multilayer epitaxial structure; removing the carrier substrate.

The present invention is generally related towards enhancing the yield and / or cold-flow properties of certain hydrocarbon products, increasing the degree of isomerization in a diesel product and / or increasing the production rate of a diesel product. The embodiments generally include reducing the residence time of lighter hydrocarbon fractions during hydrocracking, thereby decreasing secondary cracking, by various configurations of introducing at least two hydrocarbon feedstreams of different boiling ranges at different entry points in a hydrocracking unit. A method further includes forming a hydrocarbons stream comprising primarily C5+ Fischer-Tropsch hydrocarbon products; fractionating hydrocarbons stream to form at least a wax fraction and an intermediate fraction which serve as separate feedstreams to a hydrocracking unit comprising at least two hydroconversion zones. One embodiment comprises the use of a bifunctional catalyst in one of the hydrocracking zones so as to favor hydroisomerization of hydrocarbons to favor the formation of branched paraffins boiling in the diesel range.

Methods for making scaffolds for delivery via a balloon catheter are described. The scaffold, after being deployed by the balloon, provides a crush recovery of about 90% after the diameter of the scaffold has been pinched or crushed by 50%. The scaffold structure has patterns that include an asymmetric or symmetric closed cell, and links connecting such closed cells.

The invention provides a high octane number gasoline pool comprises at least 2% of di-branched paraffins containing 7 carbon atoms, and a process for producing this gasoline pool by hydro-isomerizing a feed constituted by a C5 to C8 cut which comprises at least one hydro-isomerization section and at least one separation section, in which the hydro-isomerization section and at least one separation section, in which the hydro-isomerization section comprises at least one reactor. The separation section comprises at least one unit and produces at least two streams: a first stream which is rich in di- and tri-branched paraffins, and possibly in naphthenes and aromatic compounds which is sent to the gasoline pool; and in a first version of the process, a second stream is produced which is rich in straight-chain and mono-branched paraffins which is recycled to the inlet of the hydro-isomerization section, while in a second version of the process, a second flux is produced which is rich in straight-chain paraffins which is recycled to the inlet of a first hydro-isomerization section and a third stream is produced which is rich in mono-branched paraffins which is recycled to the inlet of a second hydroisomerization section.

Provided are an organic light-emitting display device and a method for manufacturing the same. A flexible substrate of the organic light-emitting display device is bent across a bend line and includes a first area, a first bending area adjacent to the first area, a second bending adjacent to the first bending area, and a second area adjacent to the second bending area. A wiring is formed over the first area, the first bending area, the second bending area, and the second area of the flexible substrate to electrically connect a display unit formed in the first area and a pad unit formed in the second area. A first alignment key is formed over the flexible substrate, and a second alignment is formed over the flexible substrate. The first alignment key is positioned to overlap the second alignment key with the flexible substrate bent across the bend line.

A method for twin roll casting aluminum clad magnesium by joining one or more sheets of aluminum cladding to molten magnesium during twin roll casting.

Disclosed herein is a touch-sensitive display device comprising: a first set of metal electrodes including a first metal electrode; a second set of metal electrodes including a second metal electrode and a third metal electrode, the first metal electrode located between the second metal electrode and the third metal electrode such that the second metal electrode is physically separated from the third metal electrode; a first set of touch electrodes including a first touch electrode that is connected to the first metal electrode; a second set of touch electrodes including a second touch electrode and a third touch electrode, the second touch electrode connected to the second metal electrode and the third touch electrode connected to the third metal electrode; an insulation film having a plurality of contact holes; and a connection electrode electrically connecting the second metal electrode to the third metal electrode through the plurality of contact holes.

A silicone coating composition comprising (A) a silicone resin resulting from (co)hydrolytic condensation of an alkoxysilane or a partial hydrolytic condensate thereof, (B) an aromatic-free compound for curing the silicone resin, and (C) a solvent remains stable during shelf storage. It is applied and heat cured to a plastic substrate to form a protective coat having a high hardness, mar resistance, adhesion, toughness and crack resistance.

An improved method for singulation of electronic substrates into dice uses a laser to first form cuts in the substrate and then chamfers the edges of the cuts by altering the laser parameters. The chamfers increase die break strength by reducing the residual damage and removes debris caused by the initial laser cut without requiring additional process steps, additional equipment or consumable supplies.

A stent (30) formed from cannula and having flexible segments (31) and high hoop strength segments (32) alternating therealong. Longitudinal struts or tie bars (41) interconnect the segments. Minimal length reduction of the strut occurs upon expansion. In the high hoop strength segment (32), struts (37) in a zig-zag configuration (Gianturco Z-stent) are initially parallel in the unexpanded strut condition. In the flexible segment (31), struts (58) extend from a respective C-shaped bend (59) to converge at the opposite ends thereof when unexpanded. In one embodiment, certain adjacent struts (39–41) of the hoop segment are spaced apart by elongated openings or gaps (46, 48) interposed therebetween and interconnected at their respective ends (42, 44) to form a T-shaped strut interconnection (45). The selected width (50, 51) of the first and third struts (54, 57) increases toward the ends (47, 48) of the elongated openings (46, 48) adjacent the strut interconnection (45). This strut width increase about one end of the strut significantly reduces the tensile strain exhibited about the opening end when the stent is radially expanded during manufacture. The tip length (52, 55) of the struts about the interconnection (45) is also adjusted (increased) along with the other C-shaped strut interconnections (59, 71) to further distribute the tensile strain developed during radial expansion.

A belt type fixing apparatus comprises: a fixing roller; a fixing belt which is installed to be opposite to the fixing roller;a nip forming member which is installed inside the fixing belt and supports the fixing belt so that the fixing belt can contact the fixing roller to form a fixing nip; a pair of sliding members which are installed to support both ends of the fixing belt and are rotated by the fixing belt; a pair of flange members which rotatably support the pair of sliding members; and a heat source which is installed inside the fixing belt and generates heat, wherein the rotation center of the pair of sliding members is located upstream in the transportation direction of printed matter compared to the rotation center of the fixing roller.

The invention provides orally disintegrating tablets that readily disintegrates in the mouth, releasing enteric coated drug sub-tablets.

System for repairing worn surfaces of steam turbine components and especially high pressure turbine rotors, are disclosed. These systems include depositing a first layer of weld metal on a worn surface of the component, whereby a heat-affected zone is created. A second layer of weld metal is then deposited over the first layer using a greater amount of heat to temper at least a portion of the heat-affected zone produced by the first layer. The preferred embodiments include the use of gas tungsten arc welding for providing fine-grain size and more creep resistance, especially in the weld and heat-affected zone. The resulting build-up can be machined, for example into a blade fastening to produce a component having properties equal to or better than the base-metal alloy. The invention also provides a longer lasting turbine system, including rotors which have serrated steeples that are more resistant to failure.

A nutcracking apparatus including a housing having opposing sidewalls. A hammer plate having an upper and lower portion is pivotally attached at its upper portion to the opposing sidewalls of the housing. A camshaft is positioned in abutment with a lower portion of the hammer plate, and a drive attached to an outer end of the cam shaft for effecting rotation thereof. An anvil plate having an upper and lower portion is spaced from the hammer plate is pivotally attached at its upper portion to the opposing sidewalls of the housing. A device is provided for moving the lower portion of the anvil plate towards and away from the lower portion of the hammer plate.

An electronic package is disclosed with an underfill with multiple areas of different stiffness and a method of constructing same. An underfill shell region that contacts the chip and the substrate is stiffer than an underfill build region that does not contact either the chip or the substrate. The variation in stiffness may be achieved using materials in the shell that include more filler and / or less solvents than the materials in the bulk region. The underfill may also be composed of a single material with an adhesion to the chip and substrate that is stronger than the material's internal cohesion (e.g., a long chain polymer with an active carboxyl group at the end of the chain). This can be achieved by exposing the chip and substrate surfaces to a curing substance (e.g., vaporized hydrofluoric acid).

To a silicone resin obtained through cohydrolytic condensation of 100 pbw of a mixture of 1-50 Si mol % of tetraalkoxysilane, 50-99 Si mol % of trialkoxysilane and 0-10 Si mol % of dialkoxysilane with less than 100 pbw of water, having a Mn of at least 1,500 and containing 30-80 mol % of R1SiO3 / 2 units and 20-70 mol % of R1SiO2 / 2(OX) and R1SiO1 / 2(OX)2 units combined, a curing catalyst and a solvent are added to formulate a silicone resin composition. It is applied and heat cured to a plastic substrate to form a protective coat having a high hardness and improved properties such as mar resistance, crack resistance, adhesion, water resistance, heat resistance and weathering resistance.

Re-usable ceramic magic angle spinning (MAS) NMR rotors constructed of high-mechanic strength ceramics are detailed that include a sample compartment that maintains high pressures up to at least about 200 atmospheres (atm) and high temperatures up to about least about 300° C. during operation. The rotor designs minimize pressure losses stemming from penetration over an extended period of time. The present invention makes possible a variety of in-situ high pressure, high temperature MAS NMR experiments not previously achieved in the prior art.

The present invention provides for a primer-surfacer composition for use over sealed SMC parts such as automotive body panels that significantly reduces paint defects (such as paint pop and cracking defects) from appearing in the subsequently applied automotive topcoat finish. The coating composition includes silane and melamine components. The composition is sufficiently stable to be formulated as a one-pack coating composition.

The organic light emitting display device includes a flexible substrate, a thin-film transistor on the flexible substrate, a first anode on the thin-film transistor, a second anode on the same plane with the first anode and spaced apart from the first anode so as to surround the first anode, an organic light emitting layer on the first anode and the second anode, and a cathode on the organic light emitting layer. The second anode includes an opening where the first anode is encompassed therein. The shape of the first anode and the second anode and arrangement thereof reduces a segment length of an anode in a bending direction of the organic light emitting display device, and, thus, occurrence of cracks in the anode can be minimized.

A pre-process before cutting a wafer is described. The wafer comprises a plurality of scribe lines and a plurality of dies defined by the scribe lines, and a material layer covers the wafer. A pre-processing step is performed to remove the material layer on the scribe lines close to the corner regions of the dies. Removing the material layer at the corner regions before cutting the wafer is able to preserve the integrity of the corner regions of the cut dies.

A flexible display including a first flexible substrate and a second flexible substrate, a plurality of electrodes and control microcircuits disposed on inner surfaces of both substrates, first channels disposed on the inner surface of the first flexible substrate and extending in a first direction, second channels disposed on the inner surface of the second flexible substrate and extending in a second direction, and a plurality of spacers disposed between the substrates. The inner surfaces of the substrates are substantially parallel and facing each other. The first direction and the second direction of the channels are inclined relative to each other. The spacers are disposed between the substrates in cross-points of the first channels and the second channels.

A semiconductor light emitting device and a method of manufacturing the semiconductor light emitting device are provided. The semiconductor light emitting device includes a substrate, at least two light emitting cells located on the substrate and formed by stacking semiconductor material layers, a reflection layer and a transparent insulating layer sequentially stacked between the light emitting cells, and a transparent electrode covering the upper surface of the light emitting cells.

A coating for a gas diffusion layer (GDL) of a fuel cell or battery. The coating comprises a dispersion of carbon black, a fluoropolymer, and one of graphite and carbon particulates, in which the size of the particulates are substantially larger than the size of the particles of carbon black and provide structural integrity to the coating so as to minimize cracking thereof. The size of the particles of carbon black may lie within the range of approximately 13-95 nm. The carbon particulates may be chopped carbon fibers, carbon or graphite flakes or platelets, carbon nanotubes, carbon fibrils, or carbon whiskers. The carbon particulates may have a high length to diameter ratio.

An aqueous coating composition is disclosed. The composition comprises fine organic particles, polyvinyl alcohol, and boric acids or salts thereof and comprising substantially no gelatin, and the same having a viscosity of 10 to 100 cp at 40 ° C., and a viscosity at 15 ° C., which is at least 20 times as much as that at 40 ° C. A coating method of the composition and an ink-jet sheet prepared by employing the composition are also disclosed.

In an integrated circuit (IC) chip and a flip chip package having the same, no wiring line is provided and the first electrode pad does not make contact with the wiring line in a pad area of the IC chip. Thus, the first bump structure makes contact with the first electrode regardless of the wiring line in the pad area. The second electrode pad makes contact with the wiring line in a pseudo pad area of the IC chip. Thus, the second bump structure in the pseudo pad area makes contact with an upper surface of the second electrode at a contact point(s) spaced apart from the wiring line under the second electrode.