Patents
Literature
Patsnap Copilot is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Patsnap Copilot

76results about How to "Minimize region" patented technology

Methods of Minimizing Etch Undercut and Providing Clean Metal Liftoff

A method of minimizing etch undercut and providing clean metal liftoff in subsequent metal deposition is provided. In one embodiment a bilayer resist mask is employed and used for etching of underlying substrate material and subsequent metal liftoff. In one embodiment, the top layer resist such as positive photoresist which is sensitive to selected range of energy, such as near UV or violet light, is first patterned by standard photolithography techniques and resist development in a first developer to expose portion of a bottom resist layer which is sensitive to a different selected range of energy, such as deep UV light. The exposed portion of the bottom layer resist is then removed by anisotropic etching such as oxygen reactive ion etching using the top layer resist as the etch mask to expose portion of the underlying substrate. This minimizes the undercut in the bottom resist around the top photoresist opening. The resultant patterned bilayer resist stack is then used as the etch mask for the subsequent etching of the exposed portion of the underlying substrate material. Because there is no undercut in the bottom resist layer, the etch undercut in the substrate material is also minimized relative to the edges of the top photoresist opening.
Owner:TRIQUINT SEMICONDUCTOR

Turbine blade cooling with a hollow airfoil configured to minimize a distance between a pin array section and the trailing edge of the air foil

A turbine blade with a generally hollow airfoil having an outer wall that defines a chamber for receiving cooling air, the airfoil comprising a leading edge that resides in an upstream direction, a trailing edge that resides in a downstream direction, a convex suction side, a concave pressure side, and an insert disposed within the chamber that is configured to initially receive at least a portion of the cooling air entering the chamber and direct the cooling air through a plurality of insert apertures to cool the inner surface of the outer wall, the insert further comprising a configuration that generally conforms to the contour of the outer wall of the chamber but in spaced relation thereto, wherein the chamber and insert narrow as they extend toward the trailing edge, the insert eventually terminating and the chamber eventually terminating at a pin array section, wherein a first distance exists that comprises the generally axial distance between the position of downstream termination point of the insert and the position of an upstream beginning point of the pin array section, wherein the pin array section, at a downstream end, comprises a plurality of openings that define an inlet to a plurality of trailing edge cooling apertures, and wherein the chamber, the insert, and the pin array section are configured such that the first distance is approximately minimized.
Owner:GENERAL ELECTRIC CO
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products