4 results about "Manufacturing testing" patented technology

Systems and methods are presented for optical proximity correction (OPC)-based generation of test patterns. A method may include accessing an input test pattern and generating an intermediate OPC test pattern set for the input test pattern, which may include performing an OPC process on the input test pattern. The OPC process may include multiple iterations, the generated intermediate OPC test pattern set may include multiple intermediate OPC test patterns, and each given intermediate OPC test pattern in the intermediate OPC test pattern set may be an output of performance of a given iteration of the OPC process. The method may also include determining one or more selected intermediate OPC test patterns from the intermediate OPC test pattern set to include in a test mask to fabricate a test circuit and obtain measurement values through which to calibrate an OPC resist model.

The invention discloses a PCB test needle point alignment method and system based on visual identification, and relates to the technical field of electronic manufacturing testing, and the method comprises the steps: firstly, determining a preset path of image collection, then calibrating a visual detection part and a conversion matrix through a calibration board, and introducing a deep learning model; feeding conveying parameters are adjusted according to the actual size of the PCB, and whether the PCB is located in a preset detection area or not is judged after feeding; image acquisition and image processing are carried out according to a preset path, a PAD point is detected based on a deep learning model, and a machine vision algorithm is used to find the circle center of the PAD point and the position of a test needle point; and according to the preset fault-tolerant threshold value, the alignment result of the test pin point is automatically judged, alarm and / or recording are / is controlled, and the scheme realizes intelligent and quantitative alignment quality judgment of the test pin point on the PCB bare board.

An inspection system may receive first measurement data of training samples after a first process step using an online measurement subsystem, wherein the first process step is prior to manufacturing test features on the one or more training samples; and receiving second measurement data of the test feature after a second process step, wherein the second process step is after manufacturing the test feature. An inspection system may determine a difference metric associated with the first and second measurement data of the test feature. An inspection system may generate a measurement model for determining a metrological measurement of the test feature based on at least one of the second measurement data or the delta metric. An inspection system may determine a value of the metrology measurement for an additional instance of the test feature based on at least one of the second measurement data or the delta metric.

The disclosure relates to a method of fabricating a test socket that supports a probe stretchable in a longitudinal direction. The method of fabricating a test socket includes forming a probe hole for accommodating the probe in a base member made of a conductive material, filling the probe hole with a resin as an insulating material to a predetermined depth from an upper surface of the base member to form a probe support member; and forming a first support hole for supporting one end portion of the probe in the probe support member in the probe hole to expose the one end portion of the probe.