177 results about "Transfer technique" patented technology

Disclosed is a system for performing online data queries. The system for performing online data queries is a distributed computer system with a plurality of server nodes each fully redundant and capable of processing a user query request. Each server node includes a data query cache and other caches that may be used in performing data queries. The data query, as well as request allocation, is performed in accordance with an adaptive partitioning technique with a bias towards an initial partitioning scheme. Generic objects are created and used to represent business listings upon which the user may perform queries. Various data processing and integration techniques are included which enhance data queries. An update technique is used for synchronizing data updates as needed in updating the plurality of server nodes. A multi-media data transfer technique is used to transfer non-text or multi-media data between various components of the online query tool. Optimizations for searching, such as the common term optimization, are included for those commonly performed data queries. Also disclosed is a system for targeting advertisements that are displayed to a user of the system.

A coating composition for fabrics includes wetted microspheres containing a phase change material dispersed throughout a polymer binder, a surfactant, a dispersant, an antifoam agent and a thickener. Preferred phase change materials include paraffinic hydrocarbons. The microspheres may be microencapsulated. To prepare the coating composition, microspheres containing phase change material are wetted and dispersed in a dispersion in a water solution containing a surfactant, a dispersant, an antifoam agent and a polymer mixture. The coating is then applied to a fabric. In an alternative embodiment, an extensible fabric is coated with an extensible binder containing microencapsulated phase change material to form an extensible, coated fabric. The coated fabric is optionally flocked. The coated fabrics are manufactured using transfer techniques.

A peeling layer 2 is formed on an element-forming substrate 1, an element-forming layer 3 including an electrical element is formed on the peeling layer, the element-forming layer is joined by means of a dissolvable bonding layer 4 to a temporary transfer substrate 5, the bonding force of the peeling layer is weakened to peel the element-forming layer from the element-forming substrate, the layer is moved to the temporary transfer substrate 5 side, a curable resin 6 is applied onto the element-forming layer 3 which has been moved onto the temporary transfer substrate 5, the resin is cured to form a transfer substrate 6, and the bonding layer 4 is dissolved to peel the temporary transfer substrate 5 from the transfer substrate 6, resulting in a structure in which a transfer substrate is formed directly on the element-forming layer 3. The separation and transfer technique can be used to form a substrate with better flexibility and impact resistance directly on a semiconductor element, without an adhesive layer on the semiconductor device that is produced.

The present invention is directed to systems and methods for all-frequency relighting by representing low frequencies of lighting with spherical harmonics and approximate the residual high-frequency energy with point lights. One such embodiment renders low-frequencies with a precomputed radiance transfer (PRT) technique (which requires only a moderate amount of precomputation and storage), while the higher-frequencies are rendered with on-the-fly techniques such as shadow maps and shadow volumes. In addition, various embodiments are directed to a systems and methods for decomposing the lighting into harmonics and sets of point lights. Various alternative embodiments are directed to systems and methods for characterizing the types of environments for which the described decomposition is a viable technique in terms of speed (efficiency) versus quality (realism).

A technique for manufacturing a low-cost, small volume, and highly integrated semiconductor device is provided. A characteristic of the present invention is that a semiconductor element formed by using a semiconductor thin film is transferred over a semiconductor element formed by using a semiconductor substrate by a transfer technique in order to manufacture a semiconductor device. Compared with the conventional manufacturing method, mass production of semiconductor devices with lower cost and higher throughput can be realized, and production cost per semiconductor device can be reduced.

A method for fabricating optoelectronic devices is disclosed. A sacrificial layer is deposited, formed or attached to a target substrate having a plurality of through holes. One or more device layers are formed on the sacrificial layer and the sacrificial layer is exposed to an etchant through the holes in the target substrate to detach the target substrate from the sacrificial layer without destroying the target substrate.

To provide a thin film device which becomes possible to be formed in the portion which has been considered impossible to be provided with such device by the conventional technique, and to provide a semiconductor device which occupies small space and which has high shock resistance and flexibility, a device formation layer with a thickness of at most 50 mum which was peeled from a substrate by a transfer technique is transferred to another substrate, hence, a thin film device can be formed over various substrates. For instance, a semiconductor device can be formed so as to occupy small space by pasting a thin film device which is transferred to a flexible substrate onto a rear surface of a substrate of a panel, by pasting directly a thin film device onto a rear surface of a substrate of a panel, or by transferring a thin film device to an FPC which is pasted onto a substrate of a panel.

Certain example embodiments of this invention relate to the use of graphene as a transparent conductive coating (TCC). In certain example embodiments, graphene thin films grown on large areas hetero-epitaxially, e.g., on a catalyst thin film, from a hydrocarbon gas (such as, for example, C2H2, CH4, or the like). The graphene thin films of certain example embodiments may be doped or undoped. In certain example embodiments, graphene thin films, once formed, may be lifted off of their carrier substrates and transferred to receiving substrates, e.g., for inclusion in an intermediate or final product. Graphene grown, lifted, and transferred in this way may exhibit low sheet resistances (e.g., less than 150 ohms / square and lower when doped) and high transmission values (e.g., at least in the visible and infrared spectra).

A method for formation of a semiconductor device including a first wafer including a first single crystal layer comprising first transistors and first alignment mark, the method including: implanting to form a doped layer within a second wafer; forming a second mono-crystalline layer on top of the first wafer by transferring at least a portion of the doped layer using layer transfer step, and completing the formation of second transistors on the second mono-crystalline layer including a step of forming a gate dielectric followed by second transistors gate formation step, wherein the second transistors are horizontally oriented.

A technique is described in which a layer to be transferred is easily peeled and transferred to a transferred body that is pliable or flexible. Also, a method of fabricating a semiconductor device using these peeling and transfer techniques, and electronic equipment fabricated with the semiconductor device is described. A transfer method in which a layer to be transferred formed on a substrate is transferred to a transfer body that is pliable or flexible includes the first step of forming a layer to be transferred on a substrate; the second step of bonding the layer to be transferred formed on the substrate to a transfer body that is pliable or flexible fixed on a fixture; and the third step of peeling the layer to be transferred from the substrate and transferring the layer to be transferred to the transfer body.

The present invention relates to systems and methods to port controller state and context via non-volatile portable memory to controllers employing an open operating system. The present invention provides for saving a controller's state and context, for example after the controller has been suitably configured. The saved image can then be employed for subsequent controller startups to resume a particular state and context, utilized during maintenance to return a controller to a previously saved state and context, and employed to efficiently configure similar controllers via porting and / or loading the saved image to the similar controllers, which mitigates manual controller configuration. The present invention can be employed in connection with various industrial controller designs, memory configurations, and data transfer techniques. In addition, the present invention provides for serial and / or concurrent state and context transfers between controllers and memory devices.

A coating composition for fabrics includes wetted microspheres containing a phase change material dispersed throughout a polymer binder, a surfactant, a dispersant, an antifoam agent and a thickener. Preferred phase change materials include paraffinic hydrocarbons. The microspheres may be microencapsulated. To prepare the coating composition, microspheres containing phase change material are wetted ahd dispersed in a dispersion in a water solution containing a surfactant, a dispersant, an antifoam agent and a polymer mixture. The coating is then applied to a fabric. In an alternative embodiment, an extensible fabric is coated with an extensible binder containing microencapsulated phase change material to form an extensible, coated fabric. The coated fabric is optionally flocked. The coated fabrics are manufactured using transfer techniques.

Disclosed is a system for performing online data queries. The system for performing online data queries is a distributed computer system with a plurality of server nodes each fully redundant and capable of processing a user query request. Each server node includes a data query cache and other caches that may be used in performing data queries. The data query, as well as request allocation, is performed in accordance with an adaptive partitioning technique with a bias towards an initial partitioning scheme. Generic objects are created and used to represent business listings upon which the user may perform queries. Various data processing and integration techniques are included which enhance data queries. An update technique is used for synchronizing data updates as needed in updating the plurality of server nodes. A multi-media data transfer technique is used to transfer non-text or multi-media data between various components of the online query tool. Optimizations for searching, such as the common term optimization, are included for those commonly performed data queries. Also disclosed is a system for targeting advertisements that are displayed to a user of the system.

The present invention provides a transfer technique that can improve the transfer ability when reinforcing and expanding the transfer system, with effectively using the existing system. The transfer system includes tracks that link a plurality of manufacturing equipments, a plurality of carriers having different performances that run on the tracks to transfer objects between the manufacturing equipments and the like in a factory space having a plurality of manufacturing equipments, and the plurality of carriers having different performances are simultaneously provided and run on the same tracks. The plurality of carriers are composed of old carriers and new carriers that provided together and run depending on their own performances (running performance such as running speed, acceleration / deceleration, and the like and transfer performance such as transfer speed and the like).

The invention relates to a trusted security enhancement method in a desktop virtualization environment. The method comprises the following steps that: a thin client and a server are started and automatically carry out trusted measurement and trust chain transferring from bottom-layer hardware to upper-layer application software; thin client trusted access and platform bidirectional remote attestation is carried out; and after the successful access authentication, remote desktop connection software is started and the thin client obtains a desktop of a server virtual machine and carries out access and operation. According to the invention, the integrity and confidentiality principles of the terminal platform and communication transmission in the desktop virtualization environment can be fully considered; and techniques like physical trust root-based trust link transfer technique, the trusted BIOS measurement technique, the trusted platform access and remote attestation technique and the like can be utilized comprehensively. Therefore, defects of the traditional desktop virtualization safety protection measure can be overcome; and the management difficulty of the virtual data center can be effectively reduced and the security can be improved.

To provide a thin film device which becomes possible to be formed in the portion which has been considered impossible to be provided with such device by the conventional technique, and to provide a semiconductor device which occupies small space and which has high shock resistance and flexibility, a device formation layer with a thickness of at most 50 μm which was peeled from a substrate by a transfer technique is transferred to another substrate, hence, a thin film device can be formed over various substrates. For instance, a semiconductor device can be formed so as to occupy small space by pasting a thin film device which is transferred to a flexible substrate onto a rear surface of a substrate of a panel, by pasting directly a thin film device onto a rear surface of a substrate of a panel, or by transferring a thin film device to an FPC which is pasted onto a substrate of a panel.

Using a thermal transfer technique to transfer a laser-absorbing dye from a transfer medium to a receiving substrate, then activating the dye by exposure to a laser source to affect a weld between the receiving substrate and an adjacent second substrate at a desired joint region. The same laser may optionally be used to both transfer the laser-absorbing dye to a receiving substrate and weld the receiving substrate and the second substrate.

The invention provides a full-automatic luminescent immunoassay system based on a micronano-magnetic bead electromagnetic transfer technique. The system includes a computer and a detection box. The detection box is a sealable lightproof box, and comprises a first motor, a second motor, a membrane rupture device, an electromagnetic stirring rod, a Teflon coating or a disposable plastic jacket, immunomagnetic beads, a sample pool, a temperature control device, a photoelectric conversion device, a bottom reading light path, a waste consumable material recovery area or ultrasonic cleaning equipment, a reagent bin consumable material and a consumable material adapter, a guide rail and an electromagnet. The system provided by the invention is based on a magnetic bead transfer method, simplifies the detection steps, integrates the detection module, avoids a complex liquid path system, saves the detection time while realizing full automation and miniaturization of the immunodetection system, and also lowers the system cost at the same time.

Disclosed herein are methods of patterning features in a structure, such as a layer of material used in forming integrated circuit devices or in a semiconducting substrate, using a multiple sidewall image transfer technique. In one example, the method includes forming a first mandrel above a structure, forming a plurality of first spacers adjacent the first mandrel, forming a plurality of second mandrels adjacent one of the first spacers, and forming a plurality of second spacers adjacent one of the second mandrels. The method also includes performing at least one etching process to selectively remove the first mandrel and the second mandrels relative to the first spacers and the second spacers and thereby define an etch mask comprised of the first spacers and the second spacer and performing at least one etching process through the etch mask on the structure to define a plurality of features in the structure.

This invention relates to methods for making immune compatible tissues and cells for the purpose of transplantation and tissue engineering, using the techniques of nuclear transfer and cloning. Also encompassed are methods for determining the effect on immune compatibility of expressed transgenes and other genetic manipulations of the engineered cells and tissues.

The invention discloses a method for transferring a graphene film, which comprises the following steps: preparing a graphene film on an initial substrate; directly attaching and aligning the target substrate with the prepared graphene film; and stripping the graphene film from the initial substrate by an electrochemical or metallic corrosion process, and attaching the graphene film to the target substrate, and finally, cleaning the target substrate with the graphene film to complete the transfer of the graphene film. The method implements the transfer of the graphene film in a direct attaching and aligning mode, thereby avoiding introducing the transitional support in the transfer process, preventing the support residue from polluting the graphene film, and effectively lowering the damage and wrinkles on the graphene film in the transfer technique. The method is simple to operate and convenient to use in different graphene fields.

Techniques are described herein that can be used to moderate the rate at which interrupts are emitted. A network component includes the capability to issue interrupts in response to receipt of network protocol units designated as regular and high priority or in response to other causes. High priority interrupts may be accumulated. A number of accumulated high priority interrupts may be decremented each time either a regular or high priority interrupt is transferred. Addition to a number of accumulated high priority interrupts may occur at a higher rate than a rate of availability of regular priority interrupts. A counter may be used to make regular priority interrupts available. The counter may be reset each time a high priority interrupt is provided.

This invention relates to methods for making immune compatible tissues and cells for the purpose of transplantation and tissue engineering, using the techniques of nuclear transfer and cloning. Also encompassed are methods for determining the effect on immune compatibility of expressed transgenes and other genetic manipulations of the engineered cells and tissues.

Techniques for efficiently and economically providing data transfer through data networks are disclosed. The techniques are particularly suitable for Internet data transfers. In one aspect, delayed response processing is utilized. Requests for common content are initially queued. After a short period of time, the queued requests are processed as a group so as to better utilize available bandwidth, particularly in times where traffic or congestion is high. In another aspect, multiple-destination data packets are utilized.

Certain example embodiments of this invention relate to the use of graphene as a transparent conductive coating (TCC). In certain example embodiments, graphene thin films grown on large areas hetero-epitaxially, e.g., on a catalyst thin film, from a hydrocarbon gas (such as, for example, C2H2, CH4, or the like). The graphene thin films of certain example embodiments may be doped or undoped. In certain example embodiments, graphene thin films, once formed, may be lifted off of their carrier substrates and transferred to receiving substrates, e.g., for inclusion in an intermediate or final product. Graphene grown, lifted, and transferred in this way may exhibit low sheet resistances (e.g., less than 150 ohms / square and lower when doped) and high transmission values (e.g., at least in the visible and infrared spectra).

Disclosed is a method for combining two plates in the fabrication process of an enclosure baseplate of a printed circuit or an integrated circuit. The method includes the following steps: splicing two chip plates through a bonding sheet so as to make a machining plate which is big in thickness, higher in rigidity and can satisfy common equipment machining requirements; processing pattern transfer to the spliced machining plate and developing a necessary circuit diagram of a conductor on the surface of the machining plate; developing an insulating medium layer and a conducting copper layer on the surface of the newly developed circuit diagram of the conductor through the method of lamination; repeating above processes so as to form a multilayer machining plate; separating the machining plate at two sides of the splicing sheet from the splicing sheet after the machining plate reaches certain thickness and rigidity, thus forming two machining plates; and respectively processing the two machining plates through regular lamination, boring, electroplating and pattern transfer techniques until the necessary circuit board and the enclosure baseplate are finished. The method requires no special equipment or machining tools and can reduce cost by a large margin and improve production efficiency and yield.

A digital to analog converter augmented with Direct Charge Transfer (DCT) techniques. A digital to analog converter augmented with DCT and CDS techniques. A digital to analog converter augmented with Postfilter Droop Compensation.

Techniques to indicate whether datum transferred from a memory device to a second device is likely to be accessed again by the second device. The second device may include a buffer memory to store the datum when the datum is indicated as likely to be accessed again. If the second device is to access the datum again after receipt from the memory device, the second device may retrieve the datum from the buffer memory instead of from the memory device. Accordingly, multiple accessed of datum transferred once from an external memory are possible.

The invention belongs to the technical field of mass transfer, and particularly discloses a Micro LED mass transfer device and method based on demagnetization through selective heating. The device comprises a substrate and a magnetic square array arranged on the upper surface of the substrate, wherein each magnetic square in the magnetic square array has magnetism, and the upper surface and the lower surface of each magnetic square are different magnetic poles; each magnetic square can lose magnetism under the action of external heating. When transfer operation is performed, the magnetic square array is in one-to-one correspondence with the Micro LED array with the magnetism, the magnetic square array is adopted to integrally pick up the Micro LED array, then the magnetic squares are selectively heated to allow the magnetic squares to lose the magnetism to selectively transfer the Micro LED onto a target circuit substrate with the magnetism. The Micro LED mass transfer device and method can achieve the patterning and selectivity mass transfer of the Micro LED, and is high in applicability and accurate in positioning, etc.