76 results about "Direct plating" patented technology

A method to deposit nucleation problem free ruthenium by ALD. The nucleation problem free, relatively smooth ruthenium ALD film is deposited by the use of plasma-enhanced ALD of ruthenium underlay for consequent thermal ruthenium ALD layer. In addition, oxygen or nitrogen plasma treatments of SiO₂ or other dielectrics leads to uniform ALD ruthenium deposition. The method has application as a direct plating layer for a copper interconnect or metal gate structure for advanced CMOS devices.

The present invention teaches a method for depositing a copper seed layer onto a substrate surface, generally onto a barrier layer. The barrier layer may include a refractory metal and/or a group 8, 9 or 10 metal. The method includes cathodically pre-treating the substrate in an acid-containing solution. The substrate is then placed into a copper solution (pH≧7.0) that includes complexed copper ions and a current or bias is applied across the substrate surface. The complexed copper ions are reduced to deposit a copper seed layer onto the barrier layer. In one aspect, a complex alkaline bath is then used to electrochemically plate a gapfill layer on the substrate surface, followed by overfill in the same bath. In another aspect, an acidic bath ECP gapfill process and overfill process follow the alkaline seed layer process.

The invention relates to a manufacture method for holographic direct plating lining paper which belongs to the technical field of an aluminum-plated paper manufacture method. The working procedures include: (1) providing a film; (2) carrying out laser holographic contour forging treatment on the film; (3) coating a layer of compound glue dope on the surface of the film with the holographic layer and then compounding with a lining paper base; (4) peeling off the film to obtain the paper base with holographic information and meeting the water requirements of aluminum plating; (5) plating aluminum on the coat of the paper base; (6) subsequent treatment of aluminum plating; core: compounding the coat printed with a holographic pattern on the paper base to replace the spreading pre-treatment on the paper base and directly carrying out vacuum aluminum plating on the surface of a dope layer. The invention has the effects that: 1, the quality of the holographic lining paper is high and completely removes various defects of the lining paper manufactured by a common direct plating method; 2 the technique step is simple; besides, as a BOPP film can be repeatedly used, the cost can be reduced, thus being suitable for batch manufacture; 3, compared with the common direct plating lining paper, the holographic pattern is added, thus being beneficial to anti-fake of the product and improving the grade of the product.

A multilayer ceramic electronic component includes external terminal electrodes that are formed by direct plating on the first and second side surfaces of a ceramic body including stacked ceramic layers and inner conductors. The external terminal electrodes include base plating films formed so as to cover the exposed portions of inner conductors. Voids are provided that are open to the side surfaces of the ceramic body so as to be adjacent to the ends in the width direction of the exposed portions of the inner conductors. A plating metal defining the base plating films enters the voids and is electrically connected to the inner conductors in the ceramic body.

The present invention relates to preparation process of composite Cu-Ag metal powder in core-shell structure. Cu powder is pre-plated in a direct plating process for Ag to crystallize and grow in the surface of Cu well, and through twice chemical reactions in glucose bath and twice densifying treatments, micron level Cu powder is clad with a complete compact Ag layer with greatly reduced gaps. The Ag plated Cu powder has improved high temperature oxidation resistance in the temperature up to 790 deg.c, and high binding strength between the Cu core and the Ag shell.

A multilayer ceramic electronic component including thin external terminal electrodes each having a superior bonding force to a ceramic base body is provided. In order to form the external terminal electrodes, after Cu plating films are deposited on exposed portions of internal electrodes by direct plating on a ceramic base body, a Cu liquid phase, an O₂-containing liquid phase, and a Cu solid phase are generated between the Cu plating film and the ceramic base body by a heat treatment, so that Cu oxides are dispersed in the Cu plating film, at least near an interface with the ceramic base body. Since the Cu oxides function as an adhesive, a bonding force of the Cu plating film to the ceramic base body can be increased, and hence the external terminal electrode having a superior bonding force to the ceramic base body can be obtained.

The invention provides high-strength thin-specification direct-plating steel based on a thin slab casting and rolling process and a making method thereof. The steel comprises the following chemical components in percentage by weight: C, 0.17-0.20%, Si, 0.09-0.25%, Mn, 0.90-1.40%, P, not more than 0.020%, S, not more than 0.010%, Als, 0.015-0.060%, and the balance of Fe and inevitable impurities. The process comprises the steps of molten iron desulfuration, bessemerize, argon blowing, LE furnace refining, continuous casting, descaling in a rotating way, soaking pit treatment, hydraulic jet descaling, seven-rack finish rolling, laminar cooling and reeling, wherein liquid core downward pressing is adopted in the step of continuous casting and the casting blank thickness is decreased to 50-55mm from 70-90mm; the discharging temperature of a soaking pit is 180-1200 DEG C to ensure that the temperature of blanks during the hydraulic jet descaling is between 1175-1190 DEG C and the temperature of a hydraulic jet descaling collecting pipe is 32-38 MPa; and the average cooling speed of laminar cooling after the seven-rack finish rolling is 30-60 DEG C/s.

A method for directly evaporating rainbow film (or paper) includes reforming the existing high-vacuum dual-chamber film plating equipment in such manner that the water cooling pipeline of central cooling drum is replaced by the force fereon refrigerating system and a evaporator and a hopper container for regulating the material feeding are installed at bottom of high-vacuum evaporating chamber, loading the evaporation material in the evaporator, heating it until it is boiling or atomizing and direct evaporation plating.

The invention discloses a direct plating technology of a circuit board. According to the technical scheme, the direct plating technology of the circuit board is characterized in that copper board covering after drilling, board inputting, water washing and acid washing, board grinding, water washing under pressure, tiny corrosion, DI water washing, hole adjusting, oxidation, catalyzing, dry board combination and the like are conducted, and an oxide film conductive layer is formed on a hole wall of the circuit board through a conductive membrane technology to replace chemical deposited copper. The direct plating technology of the circuit board is short in technological process, small in equipment investment, free of formaldehyde, EDTA and other clathrate, small in pollution, easy to control, high in rate of finished products and simple in wastewater treatment.

The invention discloses a direct plating method binding layer coating as well as a preparation method and an application thereof. The existing transferring method has higher cost of spray aluminium paper, uses a great amount of organic solvent, and does not accord with related requirements; and the direct plating method has low cost of spray aluminium paper and environmental protection, while is rough in surface effect, thus only being suitable for low-end package. The invention is characterized in that: the coating is prepared by the following materials by weight parts: 30-50 parts of waterborne resin, 13-30 parts of cosolvent, 36-40 parts of deionized water, 0.1-2 parts of pH value conditioning agent, 0.2-0.3 parts of leveling agent, and 0.05-0.1 parts of defoaming agent. The direct plating method binding layer coating takes water as main dispersing medium, does not contain organic solvent substantially, has extremely low content of volatile organic compounds and low production cost, and can achieve mirror effect in the finished paper prepared by using the coating due to high glossiness.

A method for fabricating a barrier layer and a barrier layer is described which employs a metal selected from the group of Ru, Ir, Pd, Pt, Rh, Os, Au, Ag, W, Ta and Ti. A graded region is formed to cause the metal to adhere to an underlying substrate. Direct plating is enabled without a seed layer.

A method for manufacturing a direct plating lined laser paper of cigarettes is disclosed, which main technological process comprises the steps of coating the base paper surface with a coating layer, laser molding the base paper after the coating, then aluminum plating the base paper, and then brushing and coating a layer to obtain said direct plating lined laser paper of cigarettes. The present invention simplifies the technological process by taking out adhesive and thin film in a metastasis process, and then saves the using amount of metal aluminum in contrast to aluminum foil compound, and lowers the energy consumption and manufacturing cost; furthermore, eliminates the potential harm of residual additive of the original paint to environment and human, by utilizing waterborne coatings.

When external electrodes of a multilayer ceramic capacitor are formed by performing direct plating on surfaces at which internal electrodes are exposed without forming paste electrode layers, bonding forces of plating layers are relatively weak, and in addition, when glass particles are included in the plating layers, blisters are often generated. To overcome these problems, a multilayer ceramic capacitor is formed by performing electrolytic plating using a plating bath including glass particles, electrolytic plating layers including glass particles dispersed therein are formed as the external electrodes.

The invention discloses a direct plating method for a printed circuit board free of chemical plating. Formaldehyde pollution is avoided, and metal copper and precious metal palladium are saved. A prefabrication method for additionally fabricating a conductive polymer is not adopted while oxidization and polymerization reactions are carried out in the fabrication flow of the printed circuit board; a hole site of the printed circuit board generates a conductive polymer in the flow; the electrical conductivity in the hole can be obtained without electroless copper plating, so that the hole site of the printed circuit board is well directly copperized. The main points of adopting the novel method are as follows: the processing mode of horizontally placing the printed circuit board is adopted when a conductive high-molecular polymer for replacing electroless copper plating is adopted. Thus, the hole site can be effectively subjected to chemical processing and cleaning. The water consumption is reduced, so that the production efficiency is improved, and the resources are saved.

Disclosed is a catalyst application solution for plating an insulating portion of an object to be plated that comprises the insulating portion. The catalyst application solution is characterized by containing a water-soluble palladium compound, a reducer, a dispersant, catechol, a copper antioxidant and a buffering agent, and by having a pH of not less than 4. When the catalyst application solution is compared with a Pd—Sn colloidal solution, the catalyst application solution has the following advantages: since the catalyst application solution is a colloidal solution of Pd only that does not contain Sn, a pre-dip process and an Sn removal process are unnecessary and thus the catalyst application process can be simplified; since the catalyst application solution has a pH of not less than 4, haloing does not occur; and since the catalyst application solution is in a reducing atmosphere due to the reducer contained therein, a copper surface is not oxidized and no copper dissolution occurs, thereby causing no palladium displacement reaction.

The invention provides a direct vacuum aluminum plating water-based under-coating paint composition and a preparation method thereof. The paint comprises the following components in parts by weight: 20-30 parts of a self-cross-linking acrylic resin, 10-20 parts of an aromatic water-based polyurethane resin, 1-5 parts of a cross-linking agent, 40-70 parts of water, 0.05-2 parts of aids and 0.2-3 parts of a rheology controller. The problems that the plated aluminum is dazzled and the stiffness is insufficient because the common direct plating coating used for common transfer paper is not subjected to overpressure treatment are solved. Compared with the prior art, the composition disclosed by the invention can be directly used for common transfer paper with obvious cost advantage, imported direct plating special paper with high price does not need to be used, and the production cost of direct plating paper is greatly reduced. In addition, by virtue of the good film-forming property of the formula system, any extra coalescing agent or cosolvent does not need to be added, and the composition has the environment-friendly attributes such as low smell, low VOC content, safety, non-toxicity and the like.

A multilayer ceramic electronic component including thin external terminal electrodes each having a superior bonding force to a ceramic base body is provided. In order to form the external terminal electrodes (9), after Cu plating films (20) are deposited on exposed portions (14) of internal electrodes (12) by direct plating on a ceramic base body (2), a Cu liquid phase, an O2-containing liquid phase, and a Cu solid phase are generated between the Cu plating film (20) and the ceramic base body (2) by a heat treatment, so that Cu oxides (21) are dispersed in the Cu plating film (20), at least near an interface with the ceramic base body (2). Since the Cu oxides (21) function as an adhesive, a bonding force of the Cu plating film (20) to the ceramic base body (2) can be increased, and hence the external terminal electrode (9) having a superior bonding force to the ceramic base body can be obtained.

The invention discloses waterborne environment-friendly direct-plating beer bottle label base and surface paint with ink retaining performance. The paint comprises a base paint component and a surface paint component, wherein the base paint component comprises 40-60 parts of a waterborne acrylic emulsion, 0.1-0.2 parts of a leveling agent, 0.02-0.08 parts of an antifoaming agent, 10-30 parts of a cosolvent and 20-40 parts of a solvent; the surface paint component comprises 8-18 parts of waterborne polyurethane, 10-20 parts of waterborne epoxy resin, 5-10 parts of a waterborne epoxy resin curing agent, 0.05-0.3 parts of an adhesion promoter, 0.05-0.1 parts of a wetting agent, 0.1-0.25 parts of a wax emulsion, 0.05-0.1 parts of an antifoaming agent and 60-70 parts of a solvent. Compared with the prior art, the paint belongs to environment-friendly waterborne paint, is low in odor, low in volatile organic matter content, high in aluminizing brightness, good in surface leveling property and excellent in ink adhesive force, and has the excellent ink retaining effect, the label removing time is less than 300 s, and an aluminized coating is completely cleaned up.

The invention discloses a method for directly plating conductive metal on the surface of polyethylene. Polyethylene microparticles are placed in a degreasing solution at 30-70°C for 3-8 minutes; after degreasing, they are placed in a roughening solution at 62-80°C. React for 5-15 minutes; put it in the reducing solution after coarsening, and react for 1-3 minutes at 20-50°C; 100ml/LPd/Sn colloid, 20~40℃, react for 5~20min; after activation, put it in the metal replacement solution, 20~60℃, react for 5~10min; after metal replacement, put it in the electroplating solution, 20~50℃ , Current density 0.5 ~ 8A/dm2 for electroplating. The invention avoids the disadvantages of time-consuming, high cost and non-environmental protection of traditional electroless plating, and successfully realizes direct electroplating on the surface of polyethylene.

The invention provides a hole metallization process of a circuit board. The hole metallization process is a chemical copper plating process or a direct plating process and comprises the step of bakingthe circuit board before oil removal, and the chemical copper plating process comprises the following steps of sequentially performing drilling dirt removal, baking, oil removal, slight etching, pre-impregnation, activation, activation and reduction/acceleration and chemical copper plating on the circuit board. With the hole metallization process provided by the invention, plating leakage occurring in a hole wall of the circuit board can be effectively prevented, the bonding strength between a conductive material and the hole wall is improved, the conductive material and the hole wall are prevented from being separated, the hole wall can be completely covered only by hole metallization in one time and electroplating in one time, and the process required by hole metallization is reduced.

A biologically pure culture of Bacillus sphaericus strain 205y capable of producing an organic solvent-tolerant lipase was isolated from soil samples via direct plating method using 1% (v/v) of either benzene, toluene, or mixture of benzene and toluene as their sole carbon source, ethyl benzene and ρ-xylene. The lipase gene was isolated via genomic library and sequenced. The production of lipase gene from Bacillus sphaericus strain 205y is a novel gene. The lipase gene was cloned from Bacillus sphaericus strain 205y and the recombinant lipase was efficiently excreted into the culture medium using expression vectors bearing the lipase gene.

The invention provides vacuum metalized paper, in particular a process for producing partial vacuum metalized paper by adopting a direct plating method. The process comprises the following steps of: pretreating the surface of raw paper; preparing a pattern resin roll; applying fluorocarbon oil on the resin roll; applying the fluorocarbon oil on the paper surface; metalizing aluminum in vacuum; and applying a top coat on the partial vacuum metalized paper. The production process does not require film auxiliary materials, metalizes in partial vacuum, and saves materials and energy.

A magnetic head of the present invention includes a first magnetic pole that is exposed at the air bearing surface of the magnetic head and a second magnetic pole shaping layer that is not exposed at the air bearing surface. A layer of non-magnetic material is fabricated between the air bearing surface and the shaping layer, where the non-magnetic material is also electrically conductive. The pole tip of the magnetic head is electroplated on top of the non-magnetic electrically conductive material subsequent to the fabrication of the shaping layer, and in magnetic flux communication with the shaping layer.

The invention discloses lining paper for an embossment cigarette. The lining paper comprises a body paper layer and a forming layer, a vacuum aluminum plating layer and a water-based ink layer which are sequentially stacked on the surface of the body paper layer from interior to exterior. The invention further discloses a manufacturing method of the lining paper. The method comprises the steps of1, utilizing UV embossed ink, 3D ink, high-viscosity ink or thermal plastic ink to form the forming layer on the surface of the body paper layer; 2, adopting the vacuum aluminum plating mode, directlyplating an aluminum wire to the surface of the forming layer through vacuum steam plating to form a vacuum aluminum plating layer; 3, adopting a roll coating or spraying mode for coating the surfaceof the vacuum aluminum plating layer with the water-based ink and performing curing to form the water-based ink layer. According to the lining paper for the embossment cigarette, the vacuum direct plating mode is adopted for direct aluminum plating on the forming layer, the aluminum atom structure under the gasification state is used for enabling the forming layer to be reduced by 100%, the ultrathin substrate image-text embossment effect is achieved, and the appearance of the lining paper is more delicate.