A kind of method for directly plating conductive metal on polyethylene surface

A technology of conductive metal and polyethylene, which is applied in the field of direct plating of conductive metal on the surface of polyethylene, which can solve the problems of low polarity of polyethylene molecules, difficulty in surface modification, and low heat resistance

Inactive Publication Date: 2011-12-28
XIAMEN HUARONG ENERGY TECH
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  • Summary
  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

[0010] Electroless plating is a method with high efficiency and low price, but it has the following problems: 1) The chemical plating solution often contains difficult-to-handle complexing agents such as EDTA or triethanolamine; 2) Contains carcinogen formaldehyde; 3) Process The stability is poor, and the coating is pr

Method used

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Examples

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Embodiment Construction

[0039] The present invention will be further described below in conjunction with specific examples, but the present invention is not limited to the following examples.

[0040] Put 3-5 micron polyethylene particles in 50 g / L NaOH, 30 g / L NaOH 2 CO 3 , 30 g / L Na 3 PO 4 12H 2 O, in a mixed solution consisting of 1 g / L sodium dodecylbenzenesulfonate and 100 g deionized water, react at a temperature of 70 °C for 8 min.

[0041] Put the degreased polyethylene particles in 380 g / L CrO 3 , 396 g / L H 2 SO 4 , 15 mg / L Pd 2+ , in a mixed solution consisting of 100 g of deionized water at a temperature of 80 °C for 15 min.

[0042]Place the coarsened polyethylene particles in 50 g / L NaH 2 PO 2 , 1 g / L sodium dodecyl sulfonate, 40 ml / L HCl, and 100 g deionized water in a reducing solution, react at a temperature of 50 °C for 3 min.

[0043] The reduced polyethylene particles were placed in a solution consisting of 300 ml / L HCL and 100 g deionized water, and reacted for 3 min a...

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PUM

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Abstract

The invention discloses a method for directly plating conductive metal on the surface of polyethylene. Polyethylene microparticles are placed in a degreasing solution at 30-70°C for 3-8 minutes; after degreasing, they are placed in a roughening solution at 62-80°C. React for 5-15 minutes; put it in the reducing solution after coarsening, and react for 1-3 minutes at 20-50°C; 100ml/LPd/Sn colloid, 20~40℃, react for 5~20min; after activation, put it in the metal replacement solution, 20~60℃, react for 5~10min; after metal replacement, put it in the electroplating solution, 20~50℃ , Current density 0.5 ~ 8A/dm2 for electroplating. The invention avoids the disadvantages of time-consuming, high cost and non-environmental protection of traditional electroless plating, and successfully realizes direct electroplating on the surface of polyethylene.

Description

technical field [0001] The invention relates to the field of plastic electroplating, in particular to a method for directly plating conductive metal on the surface of polyethylene. Background technique [0002] Plastic electroplating refers to covering the plastic surface with a layer of metal. Compared with metal parts, plastic electroplating products can not only achieve a good metal texture, but also reduce the weight of the product. While effectively improving the appearance and decoration of plastics, it is also It improves its performance in terms of electricity, heat and corrosion resistance, and improves its surface mechanical strength. [0003] Because plastic itself is not conductive, it is more difficult to electroplate than ordinary metals. The general plastic electroplating process includes the following procedures: [0004] (1) Degreasing: remove the dirt and fingerprints left in the plastic molding process; [0005] (2) Coarsening: roughen the plastic surfac...

Claims

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Application Information

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IPC IPC(8): C25D5/56
Inventor 唐芬姜荣军俞会根
Owner XIAMEN HUARONG ENERGY TECH
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