The invention relates to a multiple-layer metallization
processing method for an
epoxy resin
package electronic component surface. The method includes: first forming a chemical
nickel-plating bottom plated layer on the
epoxy resin
package electronic component surface, and then forming a
nickel and gold composite plated layer or a
copper,
nickel and gold composite plated layer on the chemical nickel-plating bottom plated layer. The detailed operation steps include: pin protection, oil removing, washing for the first time, coarsening, washing for the second time, ultrasonic washing, washing for the third time,
pickling, pre-sensitizing, activating, washing with running water, peptizing, washing for the fourth time, chemical nickel-plating, washing for the fifth time, electro-coppering, washing for the sixth time, electro-nickeling, washing for the seventh time,
drying and
gold plating. By means of the method, coarsening liquid, pre-sensitizing liquid, activating liquid, chemical nickel-plating liquid, electro-coppering liquid and relevant
process conditions are improved. The multiple-layer
metal plating achieves non-falling during
etching of circuits, is good in electric conduction and can be used as an electric conduction terminal of an electric component directly to achieve
circuit design.