Hole metallization process of circuit board

A technology of hole metallization and circuit board, which is applied in the field of hole metallization of circuit boards, and can solve problems such as separation and small friction coefficient

Active Publication Date: 2018-08-31
GUANGDONG SKYCHEM TECH LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, PTFE has a smooth surface and a small friction coefficient. When used as a circuit board substrate, the above-mentioned problems of missing plating and separation of electroplated copper from the hole wall are more serious.

Method used

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  • Hole metallization process of circuit board
  • Hole metallization process of circuit board
  • Hole metallization process of circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0084] This embodiment provides an electroless copper plating process for a high-frequency circuit board, comprising the following steps:

[0085] (1) Decontamination: Put a drilled 6cm×10cm high-frequency circuit board in a plasma cleaner, heat up to 80°C, vacuumize to 0.1torr, and introduce a mixed gas of oxygen, nitrogen and argon, Keep the pressure at 0.25torr and wash for 20min;

[0086] (2) Baking: put the high-frequency circuit board treated in step (1) into an oven at 120°C and bake for 2 hours;

[0087] (3) Degreasing: immerse the high-frequency circuit board treated in step (2) in SkyClean 321 degreasing solution at 50°C, degreasing for 90s, and then rinse with deionized water for 1min;

[0088] (4) Micro-etching: immerse the high-frequency circuit board treated in step (3) in a micro-etching solution at 28°C, perform micro-etching for 60 seconds, and then rinse with deionized water for 1 min;

[0089] (5) Pre-dipping: immerse the high-frequency circuit board treat...

Embodiment 2

[0104] This embodiment provides an electroless copper plating process for metallizing circuit board holes, which includes the following steps:

[0105] (1) Decontamination with liquid medicine: expand, bite and neutralize the circuit board after drilling in sequence, the specific method is as follows;

[0106] Expansion: Place the circuit board in SkySecure 302 expansion liquid at 65°C, expand for 5 minutes, and then rinse with deionized water for 1 minute;

[0107] Biting corrosion: Place the expanded circuit board in the etching solution SkySecure 305 at 80°C for 2 minutes, then rinse with deionized water for 1 minute;

[0108] Neutralization: Place the etched circuit board in the neutralizing solution SkySecure 310 at 30°C, neutralize it for 1 minute, and then rinse it with deionized water for 1.5 minutes;

[0109] (2) Baking: put the circuit board treated in step (1) into a 130°C oven and bake for 2.5 hours;

[0110] (3) Degreasing: immerse the circuit board treated in s...

Embodiment 3

[0119] This embodiment provides an electroless copper plating process for a high-frequency circuit board, comprising the following steps:

[0120] (1) liquid medicine decontamination: with embodiment 2;

[0121] (2) Baking: put the high-frequency circuit board treated in step (1) into a 100°C oven and bake for 5 hours;

[0122] (3) Degreasing: immerse the high-frequency circuit board treated in step (2) in SkyClean 321 at 40°C for 150 seconds, then rinse with deionized water for 1 minute;

[0123] (4) Micro-etching: immerse the high-frequency circuit board treated in step (3) in a micro-etching solution at 30°C, micro-etching for 45 seconds, and then rinse with deionized water for 1 min;

[0124] (5) Pre-dipping: immerse the high-frequency circuit board treated in step (4) in SkyCat 330 pre-dipping solution at 25°C for 30s;

[0125] (6) Activation: immerse the high-frequency circuit board treated in step (5) in SkyCat335 ionic palladium activation solution at 35°C, activate ...

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Abstract

The invention provides a hole metallization process of a circuit board. The hole metallization process is a chemical copper plating process or a direct plating process and comprises the step of bakingthe circuit board before oil removal, and the chemical copper plating process comprises the following steps of sequentially performing drilling dirt removal, baking, oil removal, slight etching, pre-impregnation, activation, activation and reduction/acceleration and chemical copper plating on the circuit board. With the hole metallization process provided by the invention, plating leakage occurring in a hole wall of the circuit board can be effectively prevented, the bonding strength between a conductive material and the hole wall is improved, the conductive material and the hole wall are prevented from being separated, the hole wall can be completely covered only by hole metallization in one time and electroplating in one time, and the process required by hole metallization is reduced.

Description

technical field [0001] The invention belongs to the technical field of circuit board production, and in particular relates to a hole metallization process of a circuit board. Background technique [0002] Circuit boards are the key to integrated circuits, and play an important role in mass production of fixed circuits and optimizing the layout of electrical appliances. According to the number of layers, circuit boards can be divided into three types: single-panel, double-panel and multi-layer circuit boards. Among them, the lines of the double-sided board and the multi-layer circuit board are distributed between different layers, so it is necessary to use holes to conduct the lines between different layers. However, since the base material of the circuit board is mostly non-conductive polymer materials such as polyester and epoxy resin, the hole wall cannot be plated with metal when the printed circuit is plated, so it is necessary to metallize the hole wall. make it condu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/42
CPCH05K3/42
Inventor 李晓红明东远章晓冬刘江波童茂军
Owner GUANGDONG SKYCHEM TECH LTD
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