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Prepn process of composite Cu-Ag metal powder in core-shell structure

A technology of composite metal and preparation process, applied in the direction of coating, etc., can solve the problems of affecting the high temperature oxidation resistance and poor compactness of the Ag layer.

Inactive Publication Date: 2007-12-19
XI AN JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The present invention provides a Cu-Ag core-shell composite metal powder in order to solve the shortcomings of the poor compactness of the Ag layer in the powder produced by the existing Cu-Ag composite powder preparation process, which affects its high-temperature oxidation resistance. preparation process

Method used

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  • Prepn process of composite Cu-Ag metal powder in core-shell structure
  • Prepn process of composite Cu-Ag metal powder in core-shell structure

Examples

Experimental program
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Effect test

Embodiment 1

[0025] Step 1: Pre-plating treatment Weigh 6.0g of Cu powder with a particle size of 30 microns into a No. The Cu powder is pickled with 50ml of dilute sulfuric acid with a concentration of 5%, in order to remove the copper oxide and cuprous oxide on its surface. Afterwards, wash with distilled water until Cu is no longer detectable with potassium hexacyanoferrate. 2+ , and finally add 30ml of distilled water and 0.5g of sodium dodecylbenzenesulfonate for later use.

[0026] The second step: the direct method pre-silvering weighs 3.0g of AgNO 3 In the No. B Erlenmeyer flask, add 60ml of distilled water, and then add 27% ammonia water until the solution becomes clear again. Then slowly drop the solution in the No. B conical flask into the No. A conical flask under stirring, and stir until the reaction is complete.

[0027] The third step: glucose bath (1) prepares reducing agent: take by weighing the glucose (C of 11.2g) 6 h 12 o 6 ) and 0.5g of tartaric acid in a No. C c...

Embodiment 2

[0030] The first four steps are the same as in Example 1, and the fifth step: densification treatment. The dried silver-plated copper powder is kept at 350° C. for 1 hour under the protection of hydrogen, and then cooled in the furnace.

Embodiment 3

[0032] As shown in Figure 1, the first five steps are the same as in Example 2, and the sixth step is to perform silver plating on the densified powder in the glucose bath again, and repeat the third step. Step 7: Separation and drying Repeat step 4. Step 8: Densify again, repeat step 5.

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Abstract

The present invention relates to preparation process of composite Cu-Ag metal powder in core-shell structure. Cu powder is pre-plated in a direct plating process for Ag to crystallize and grow in the surface of Cu well, and through twice chemical reactions in glucose bath and twice densifying treatments, micron level Cu powder is clad with a complete compact Ag layer with greatly reduced gaps. The Ag plated Cu powder has improved high temperature oxidation resistance in the temperature up to 790 deg.c, and high binding strength between the Cu core and the Ag shell.

Description

technical field [0001] The invention relates to a preparation process of conductive metal powder, in particular to a preparation process of Cu-Ag composite metal powder. Background technique [0002] Silver has the best electrical conductivity among all metals, and its room temperature (20°C) resistivity ρ=1.59×10 -6 Ω.cm, in addition, Ag also has the characteristics of good oxidation resistance and stable performance. However, it is expensive and resources are scarce, so it can only be used in special occasions and cannot be applied on a large scale. The price of Cu powder is low, only about 1 / 20 of Ag, and its conductivity is excellent (ρ=1.7×10 -6 Ω.cm), are widely used in conductive coatings, electrode materials, catalysts and other fields. However, Cu has poor oxidation resistance, and it is easy to form an oxide film on the surface exposed to the air for a long time, which has a great impact on its performance. Plating silver on the surface of copper powder can ove...

Claims

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Application Information

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IPC IPC(8): B22F1/02B22F9/24
Inventor 席生岐赵科雄吴宏京周敬恩
Owner XI AN JIAOTONG UNIV
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