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Direct plating method for printed circuit board free of chemical plating

A printed circuit board and electroless plating technology, applied in the direction of electrical connection formation of printed components, etc., can solve problems such as low conductivity and limited application range

Inactive Publication Date: 2014-09-03
武汉中环泽科技有限公司
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AI Technical Summary

Problems solved by technology

The conductivity of the conductive polymer obtained by this method is only 1-10S / cm. When this low conductivity is used for direct plating, it has stricter requirements on the substrate, pore size, and pore density distribution of the printed board. selectivity, which limits the scope of its application

Method used

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Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0010] As an example, the method of direct electroplating copper without electroless copper plating on printed boards is to place the printed boards in a horizontally placed automatic conveying device after the printed boards have undergone a conventional pre-treatment process, and perform substrate surface activation treatment , oxidation treatment and conductive polymer generation process of three processes.

[0011] The substrate surface activation treatment is to treat the printed board in a solution containing sodium carbonate and cationic surfactant. The pH value of the treatment solution is kept at about 11, the temperature is 30°C-60°C, and the time is 40-60s. After the treatment is completed, it enters the oxidation process after three stages of full water washing.

[0012] The oxidation process is to oxidize the printed board in a permanganate solution. The pH value of the solution is controlled at 5-7, the temperature is 80°C-90°C, and the time is 80-100s. After suf...

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PUM

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Abstract

The invention discloses a direct plating method for a printed circuit board free of chemical plating. Formaldehyde pollution is avoided, and metal copper and precious metal palladium are saved. A prefabrication method for additionally fabricating a conductive polymer is not adopted while oxidization and polymerization reactions are carried out in the fabrication flow of the printed circuit board; a hole site of the printed circuit board generates a conductive polymer in the flow; the electrical conductivity in the hole can be obtained without electroless copper plating, so that the hole site of the printed circuit board is well directly copperized. The main points of adopting the novel method are as follows: the processing mode of horizontally placing the printed circuit board is adopted when a conductive high-molecular polymer for replacing electroless copper plating is adopted. Thus, the hole site can be effectively subjected to chemical processing and cleaning. The water consumption is reduced, so that the production efficiency is improved, and the resources are saved.

Description

technical field [0001] The invention relates to a direct electroplating method for a printed circuit board without electroless plating. Background technique [0002] Printed circuit boards are the substrates on which electronic components are installed in modern electronic products, and have developed from early single-sided boards to double-sided boards and multi-layer boards. These double-sided and multi-layer boards are made of a material with good insulating properties as the substrate and covered with copper foil on both sides. In order to connect the circuits on different surfaces of the printed board, the copper plating layer is obtained in the holes by means of electroless copper plating and electroplating copper in the form of rivet holes. Thereby, the metallized interconnection of a large number of through holes can be realized at one time, which is a great technical progress compared with the previous method of manually installing rivets one by one. Now, this ho...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/54C25D5/56H05K3/42
Inventor 刘仁志李俊范小兵何家俊李祖刚
Owner 武汉中环泽科技有限公司
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