Direct plating technology of circuit board

An electroplating process and circuit board technology, applied in electrical components, printed circuits, printed circuit manufacturing, etc., can solve the problems of cumbersome processes, wasteful production costs, and high costs, and achieve simple wastewater treatment, short process flow, and small equipment investment. Effect

Inactive Publication Date: 2014-07-30
广东达进电子科技有限公司
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Problems solved by technology

[0002] The traditional electroless copper plating process for printed boards in the PCB industry adopts the following process: first do copper sinking, then do full-board electroplating, do graphic transfer through the dry film process, and then do graphic electroplating. This process has its own insurmountable Disadvantages: (1) Contains formaldehyde, a carcinogenic substance, which seriously affects the health of operators and pollutes the environ

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  • Direct plating technology of circuit board

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Embodiment Construction

[0030] The present invention will be further described below in conjunction with accompanying drawing:

[0031] A direct electroplating process for circuit boards comprises the following steps.

[0032] 1. Board entry: Place the circuit board horizontally on the entrance roller of the production line.

[0033] 2. Washing: washing by spraying, washing pressure 1.3±0.5kg / cm 2 , Clean the surface of the board and the board powder and other sundries left after drilling in the hole.

[0034] 3. Pickling: Use sulfuric acid with a concentration of 3% to 5%, and the pickling pressure is 2.0±0.5kg / cm 2 , to remove oxides and oil stains on the copper surface, the pickling time at room temperature is 10 seconds to 12 seconds, and the pickling pressure is 2.0±0.5kg / cm 2 .

[0035] 4. Washing: washing by spraying, washing pressure 1.3±0.5kg / cm 2 , Clean the copper surface and the acid brought out of the hole.

[0036] 5. Grinding plate: Use a high-speed needle brush to polish the cop...

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Abstract

The invention discloses a direct plating technology of a circuit board. According to the technical scheme, the direct plating technology of the circuit board is characterized in that copper board covering after drilling, board inputting, water washing and acid washing, board grinding, water washing under pressure, tiny corrosion, DI water washing, hole adjusting, oxidation, catalyzing, dry board combination and the like are conducted, and an oxide film conductive layer is formed on a hole wall of the circuit board through a conductive membrane technology to replace chemical deposited copper. The direct plating technology of the circuit board is short in technological process, small in equipment investment, free of formaldehyde, EDTA and other clathrate, small in pollution, easy to control, high in rate of finished products and simple in wastewater treatment.

Description

【Technical field】 [0001] The invention relates to the technical field of circuit board production, in particular to a direct electroplating process for circuit boards. 【Background technique】 [0002] The traditional electroless copper plating process for printed boards in the PCB industry adopts the following process: first do copper sinking, then do full-board electroplating, do graphic transfer through the dry film process, and then do graphic electroplating. This process has its own insurmountable Disadvantages: (1) Contains formaldehyde, a carcinogenic substance, which seriously affects the health of operators and pollutes the environment; (2) Contains a large amount of complexing agents, which makes wastewater treatment difficult; (3) Uses formaldehyde as a reducing agent in lye , prone to disproportionation reactions, difficult to control the stability of the liquid crossing, resulting in waste and increased production costs; (4) The process is cumbersome, time-consumi...

Claims

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Application Information

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IPC IPC(8): H05K3/18C25D7/06C25D5/34
Inventor 黄烨侯建红谢兴龙王新
Owner 广东达进电子科技有限公司
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