Direct plating technology of circuit board

Abstract

The invention discloses a direct plating technology of a circuit board. According to the technical scheme, the direct plating technology of the circuit board is characterized in that copper board covering after drilling, board inputting, water washing and acid washing, board grinding, water washing under pressure, tiny corrosion, DI water washing, hole adjusting, oxidation, catalyzing, dry board combination and the like are conducted, and an oxide film conductive layer is formed on a hole wall of the circuit board through a conductive membrane technology to replace chemical deposited copper. The direct plating technology of the circuit board is short in technological process, small in equipment investment, free of formaldehyde, EDTA and other clathrate, small in pollution, easy to control, high in rate of finished products and simple in wastewater treatment.

Description

【Technical field】 [0001] The invention relates to the technical field of circuit board production, in particular to a direct electroplating process for circuit boards. 【Background technique】 [0002] The traditional electroless copper plating process for printed boards in the PCB industry adopts the following process: first do copper sinking, then do full-board electroplating, do graphic transfer through the dry film process, and then do graphic electroplating. This process has its own insurmountable Disadvantages: (1) Contains formaldehyde, a carcinogenic substance, which seriously affects the health of operators and pollutes the environment; (2) Contains a large amount of complexing agents, which makes wastewater treatment difficult; (3) Uses formaldehyde as a reducing agent in lye , prone to disproportionation reactions, difficult to control the stability of the liquid crossing, resulting in waste and increased production costs; (4) The process is cumbersome, time-consumi...

AI Technical Summary

Problems solved by technology

[0002] The traditional electroless copper plating process for printed boards in the PCB industry adopts the following process: first do copper sinking, then do full-board electroplating, do graphic transfer through the dry film process, and then do graphic electroplating. This process has its own insurmountable Disadvantages: (1) Contains formaldehyde, a carcinogenic substance, which seriously affects the health of operators and pollutes the environment; (2) Contains a large amount of complexing agents, which makes wastewater treatment difficult; (3) Uses formaldehyde as a reducing agent in lye , disproportionation reaction is prone to occur, and the stability of the liquid is difficult to control, resulting in waste and increased production costs; (4) The process is cumbersome, time-consuming, and uses a large amount of liquid medicine and other materials, and the cost is relatively high, etc.

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