Direct plating technology of circuit board
An electroplating process and circuit board technology, applied in electrical components, printed circuits, printed circuit manufacturing, etc., can solve the problems of cumbersome processes, wasteful production costs, and high costs, and achieve simple wastewater treatment, short process flow, and small equipment investment. Effect
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[0030] The present invention will be further described below in conjunction with accompanying drawing:
[0031] A direct electroplating process for circuit boards comprises the following steps.
[0032] 1. Board entry: Place the circuit board horizontally on the entrance roller of the production line.
[0033] 2. Washing: washing by spraying, washing pressure 1.3±0.5kg / cm 2 , Clean the surface of the board and the board powder and other sundries left after drilling in the hole.
[0034] 3. Pickling: Use sulfuric acid with a concentration of 3% to 5%, and the pickling pressure is 2.0±0.5kg / cm 2 , to remove oxides and oil stains on the copper surface, the pickling time at room temperature is 10 seconds to 12 seconds, and the pickling pressure is 2.0±0.5kg / cm 2 .
[0035] 4. Washing: washing by spraying, washing pressure 1.3±0.5kg / cm 2 , Clean the copper surface and the acid brought out of the hole.
[0036] 5. Grinding plate: Use a high-speed needle brush to polish the cop...
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Abstract
Description
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Application Information
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