Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device

a technology of integrated type and adhesive sheet, which is applied in the direction of heat-activated film/foil adhesive, film/foil adhesive, transportation and packaging, etc., can solve the problems of not being able to permit effective cutting of wafers and adhesive sheets, and achieve excellent adhesion reliability and effective cutting

Inactive Publication Date: 2008-07-17
INADA TEIICHI +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0010]As described above, in the method using an adhesive sheet in the wafer-back-face sticking mode, no way of permitting a wafer and the adhesive sheet to be effectively cut has been found. Accordingly, in a dicing step in the production of a semiconductor device, an adhesive sheet has been desired which can be cut at the same time as a wafer is cut after the work of the wafer into a cut-permissible state. Moreover, in the step of jointing a semiconductor element with a support member in the production of a semiconductor device, an adhesive sheet which is excellent in adhesion reliability has been desired.
[0011]An object of the present invention is to provide an adhesive sheet which can be stuck onto a wafer at low temperatures, is so flexible that the sheet can be handled at room temperature, and can be cut at the same time as the wafer is cut under ordinary cutting conditions.

Problems solved by technology

As described above, in the method using an adhesive sheet in the wafer-back-face sticking mode, no way of permitting a wafer and the adhesive sheet to be effectively cut has been found.

Method used

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  • Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device
  • Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device
  • Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device

Examples

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example 1

[0112]Cyclohexanone was added to a composition composed of: 30 parts by weight of a bisphenol F type epoxy resin (trade name: YD-8170C, manufactured by Tohto Kasei Co., Ltd., epoxy equivalent: 160) and 10 parts by weight of a cresol novolak type epoxy resin (trade name: YDCN-703, manufactured by Tohto Kasei Co., Ltd., epoxy equivalent: 210) as epoxy resins; 27 parts by weight of a phenol novolak resin (trade name: Priophen LF2882, manufactured by Dainippon Ink & Chemicals, Inc.) as a curing agent for the epoxy resins; 28 parts by weight of an epoxy-group-containing acrylic rubber (trade name: HTR-860P-3DR, manufactured by Nagase Chemtex Corp.; weight-average molecular weight based on gel permeation chromatography: 800000, glycidyl methacrylate: 3% by weight, and Tg: −7° C.) as an epoxy-group-containing acrylic copolymer; 0.1 part by weight of an imidazole curing accelerator (Curezol, manufactured by Shikoku Chemicals Corp.) as a curing accelerator; 95 parts by weight of a silica fil...

examples 2 to 6

[0114]About respective compositions shown in Table 1, adhesive sheets were produced in the same way as in Example 1. The adhesive sheet of Example 6 was an adhesive sheet obtained by subjecting the sheet of Example 1 to heat treatment at 40° C. for 24 hours, thereby lowering the breaking elongation.

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Abstract

The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.

Description

[0001]This application is a Divisional application of application Ser. No. 10 / 559,684, filed Dec. 6, 2005, the contents of which are incorporated herein by reference in their entirety. No. 10 / 559,684 is a National Stage Application filed under 35 USC 371 of International (PCT) Application No. PCT / JP04 / 08150, filed Jun. 4, 2004.TECHNICAL FIELD[0002]The present invention relates to an adhesive sheet suitable for the joint of a semiconductor element with a semiconductor-element-mounting support member, a dicing tape integrated type adhesive sheet, and a method of producing a semiconductor device using them.BACKGROUND ART[0003]Hitherto, silver paste has been mainly used to joint a semiconductor element with a semiconductor-element-mounting support member. However, the support member used has also been required to be made small-sized and minute as semiconductors have been made small-sized and the performance thereof has been made high in recent years. Silver paste has come not to meet su...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): B32B7/12C08L55/00C09J7/22C09J7/35H01L21/00H01L21/58H01L21/68
CPCC09J7/0242Y10T428/28H01L21/67132H01L21/6836H01L24/27H01L24/83H01L2221/68327H01L2221/68336H01L2224/274H01L2224/2919H01L2224/83191H01L2224/83856H01L2924/01002H01L2924/01004H01L2924/01005H01L2924/01011H01L2924/01012H01L2924/01013H01L2924/01015H01L2924/0102H01L2924/01027H01L2924/01029H01L2924/01039H01L2924/01047H01L2924/01051H01L2924/0106H01L2924/01077H01L2924/01078H01L2924/01079H01L2924/07802H01L2924/10329C09J2203/326Y10T428/2848Y10T428/266H01L24/29H01L2924/0665H01L2924/014H01L2924/01045H01L2924/01033H01L2924/01023H01L2924/01006H01L2924/01019H01L2924/00H01L2924/3512H01L2924/12042H01L2224/94C09J7/35C09J7/22Y10T428/31928Y10T428/31938Y10T428/31797Y10T428/31551Y10T428/31587Y10T428/31757Y10T428/31909Y10T428/31725Y10T428/31721Y10T428/3192Y10T428/31786Y10T428/31913Y10T428/31736Y10T428/31511Y10T428/3183H01L2224/27
Inventor INADA, TEIICHIMASHINO, MICHIOURUNO, MICHIO
Owner INADA TEIICHI
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