Thermoplastic resin composition, adhesive film and wiring film using the same

A thermoplastic resin and composition technology, applied in the direction of hydrocarbon copolymer adhesives, polyether adhesives, adhesive types, etc., can solve the problem of low modified polyolefin, achieve excellent adhesion, medium Low electrical loss tangent and excellent bonding reliability

Inactive Publication Date: 2012-03-21
HITACHI CABLE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this disclosed technique, in order to secure the adhesive force, the content of the modified polyolefin needs to be suppressed to a low level, so there is a limit to the reduction of the relative permittivity and the dielectric loss tangent of the adhesive layer.

Method used

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  • Thermoplastic resin composition, adhesive film and wiring film using the same
  • Thermoplastic resin composition, adhesive film and wiring film using the same
  • Thermoplastic resin composition, adhesive film and wiring film using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0102] Hereinafter, an Example and a comparative example are shown, and this invention is demonstrated concretely. Reagents and evaluation methods are shown.

[0103] (1) Test sample

[0104] (A) Hydrogenated styrene-based elastomer: Taftec (registered trademark) H1052, elongation 700%, manufactured by Asahi Kasei Chemicals Co., Ltd.

[0105] (B) Hydrogenated styrene-based elastomer: Taftec H1227, 950% elongation, manufactured by Asahi Kasei Chemicals Co., Ltd.

[0106] (C) Hydrogenated styrene elastomer: Taftec H1031, elongation 650%, manufactured by Asahi Kasei Chemicals Co., Ltd.

[0107] (D) Polyphenylene ether-based polymer-based resin containing OH at both ends: OPE, styrene-equivalent number average molecular weight 1000, manufactured by Mitsubishi Gas Chemical Co., Ltd.

[0108] (E) Isocyanate compound (1): Hexamethylene diisocyanate, manufactured by Wako Pure Chemical Industries, Ltd.

[0109] (F) Isocyanate compound (2): Polyhexamethylene diisocyanate, Duranate D...

Embodiment 1～6

[0150] Examples 1 to 6 are examples of adding various isocyanate compounds in predetermined amounts. The evaluation results are shown in Table 2. Comparing Comparative Example 1 with the present example, it was confirmed that the addition of the isocyanate compound improves the adhesive force with the base film and hardly deteriorates the dielectric properties. The adhesive film using this adhesive was considered to be excellent in both dielectric properties and adhesiveness, and was preferably used as an adhesive for high-frequency wiring films.

[0151] Table 2

[0152]

[0153]

Embodiment 7～11

[0155] Examples 7 to 11 are examples in which polyhexamethylene diisocyanate (D101) was added as an isocyanate compound. The evaluation results are shown in Table 3. It can be confirmed that the adhesive strength increases as the amount of the isocyanate compound increases. In addition, although the value of the dielectric loss tangent increases a little with the increase of the isocyanate compound, within the scope of this research, the dielectric properties and adhesiveness are excellent, and it is considered that the adhesive in this composition range can be preferably used. As a result of being used as an adhesive for high-frequency wiring films.

[0156] table 3

[0157]

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Abstract

The present invention relates to a thermoplastic resin composition having a low dielectric constant, a low dissipation factor and excellent adhesiveness to a substrate film or a conductor wiring, an adhesive film and a wiring film using the same. The thermoplastic resin composition includes a polyphenylene ether-based polymer having hydroxyl groups in its chemical structure and having 2,6-dimethylphenylene ether as a repeating unit, an isocyanate compound having a plurality of isocyanate groups in its structure; or a reaction product of the polyphenylene ether-based polymer having 2,6-dimethylphenylene ether as a repeating unit and the isocyanate compound having a plurality of isocyanate groups in its structure; and a hydrogenated styrene-based elastomer. .

Description

technical field [0001] The present invention relates to a thermoplastic resin composition, an adhesive film, and a wiring film for a flexible flat cable using the thermoplastic resin composition, which has a low dielectric constant and a low dielectric loss tangent, and is compatible with a base film and a conductor The thread adhesiveness was excellent. Background technique [0002] In recent years, electronic equipment has been gradually reduced in size, thickness, and weight, and wiring boards used therefor require multilayer, finer wiring, and thinner high-density fine wiring. As an example of this wiring technology, there is known a flexible flat cable (abbreviated as FFC) as described in Patent Document 1, wherein a plurality of conductor wirings are formed in parallel on a base film, the conductor wirings are covered with an insulating resin, and then A conductor layer is set on its outer layer as a shielding layer. The insulating resin functions as an adhesive laye...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L25/04C08L71/12C09J7/02C09J125/04C09J171/12H01B7/17B32B27/08B32B7/12
CPCB32B7/12B32B15/08B32B15/20B32B27/302B32B27/42B32B2405/00H05K1/0393H05K2201/0195C08G18/4879C08G18/73C08G18/755C08G18/7621C08G18/792C08L75/04C08K5/29C08L71/126B32B2307/202B32B2307/546B32B2307/702B32B2307/732B32B2457/00Y10T428/24959C08L25/02
Inventor 天羽悟桑原孝介堆信仁阿部富也
Owner HITACHI CABLE
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