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High-temperature-resistant bismaleimide resin carrier structure adhesive film and preparation method thereof

A technology of bismaleimide resin and maleimide resin, which is used in adhesives, polymer adhesive additives, film/sheet adhesives, etc. The adhesive film and bismaleimide film do not have the problems of high temperature resistance and high toughness, so as to achieve the effect of good high temperature resistance, high bonding reliability and good process performance.

Active Publication Date: 2013-08-14
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problem that the existing bismaleimide adhesive film does not have both high temperature resistance and high toughness, and the poor process performance cannot be paved in a large area

Method used

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  • High-temperature-resistant bismaleimide resin carrier structure adhesive film and preparation method thereof
  • High-temperature-resistant bismaleimide resin carrier structure adhesive film and preparation method thereof
  • High-temperature-resistant bismaleimide resin carrier structure adhesive film and preparation method thereof

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specific Embodiment approach 1

[0014] Specific embodiment one: A kind of high temperature resistant bismaleimide resin carrier structure adhesive film of this embodiment is made of 75-100 parts of bismaleimide resin, 50-75 parts of process modification agent, 10-25 parts of toughening modifier, 1-4 parts of compatibilizer and 1-4 parts of thixotropic agent and carrier; wherein, the bismaleimide resin is made of BMT Type high temperature resistant short-chain bismaleimide resin, 4,4'-diaminodiphenylmethane type bismaleimide resin and ether bond-containing 44DADPE type bismaleimide resin with a mass ratio of 5: 3:2 ratio composition.

[0015] The BMT type bismaleimide resin of the present embodiment is a commercially available product, and its chemical structural formula is as follows,

[0016]

[0017] The 44DADPE type bismaleimide resin of this embodiment is published according to (Zhu Yulong, Yu Xinhai. Synthesis of Novel Bismaleimide Containing Ether Bonds, Insulating Materials [J], 2005(5):6~8) The ...

specific Embodiment approach 2

[0023] Specific embodiment 2: The difference between this embodiment and specific embodiment 1 is that the high temperature resistant bismaleimide resin carrier structure adhesive film is made of 80-90 parts by mass of bismaleimide Resin, 55-70 parts of process modifier, 15-20 parts of toughening modifier, 2-4 parts of compatibilizer, 2-4 parts of thixotropic agent and carrier. Others are the same as the first embodiment.

specific Embodiment approach 3

[0024] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is that: the process modifier is composed of allyl ether phenolic resin, allyl bisphenol A and hyperbranched polysiloxane; The mass ratio of allyl ether phenolic resin, allyl bisphenol A and hyperbranched polysiloxane is 6:3:1. Others are the same as those in Embodiment 1 or 2.

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Abstract

The invention provides a high-temperature-resistant bismaleimide resin carrier structure adhesive film and a preparation method thereof, and relates to a high-temperature curing high-temperature-resistant structure adhesive. The invention aims to solve the problems that the conventional bismaleimide adhesive film does not have high temperature-resistant grade and high toughness. The adhesive film consists of bismaleimide resin, a technical modifier, a toughening modifier, a compatibilizer and a thixotropic agent. The preparation method comprises the following steps of: performing prepolymerization on the bismaleimide resin and the technical modifier to obtain a bismaleimide resin prepolymer; mixing the bismaleimide resin prepolymer, the toughening modifier, the compatibilizer and the thixotropic agent uniformly by a mechanical blending method to prepare an adhesive material; and preparing the adhesive by using a three-roller coating film-making machine under the film-forming assistance of the carrier. The adhesive has the characteristics of high-temperature resistance and high toughness, wherein the glass-transition temperature reaches above 280 DEG C and the honeycomb roller peeling strength reaches about 75.0 N.m / m. The adhesive is applied to adhesion of metal or composite material high-temperature-resistant structure members in the field of aerospace.

Description

technical field [0001] The invention relates to a high temperature curing high temperature resistant structural adhesive, in particular to a high temperature resistant bismaleimide resin carrier structural adhesive film and a preparation method thereof. Background technique [0002] Structural adhesive is an adhesive used for bonding of load-bearing structures. It can transmit large static and dynamic loads, and can work reliably for a long time in the use environment. Compared with paste structural adhesives and solvent-based structural adhesives, film structural adhesives have the advantages of uniform and controllable adhesive layer thickness, low volatile content, high strength, high toughness, high durability and high reliability. It is widely used in aerospace field. [0003] Since the cured product of pure bismaleimide resin has a high crosslinking density and high temperature resistance, but its process performance and toughness are poor, it neither has the film-for...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/04C09J179/08C09J183/04C09J161/14C09J11/08C09J11/06C09J11/04
Inventor 王德志曲春艳冯浩杨海冬李洪峰张杨宿凯毛勇王海民
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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